TELECOM CIRCUIT Other Function Telecom Interface ICs 2,400+

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
EC25EUXGA-128-SGNS	Quectel Wireless Solutions	TELECOM CIRCUIT	COMMERCIAL EXTENDED	NO LEAD	144	XMA	RECTANGULAR	UNSPECIFIED	YES	1					3.8 V		MICROELECTRONIC ASSEMBLY				75 Cel	-35 Cel		UNSPECIFIED	150 Mbps	R-XXMA-N144		2.4 mm	29 mm					32 mm
GS2972-IBE3	Semtech	TELECOM CIRCUIT	OTHER	BALL	100	LBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.2 V		GRID ARRAY, LOW PROFILE			1 mm	85 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B100	3	1.7 mm	11 mm		e1		260	11 mm
LEA-M8T-0-10	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	DMA	RECTANGULAR	UNSPECIFIED	YES	1					3 V		MICROELECTRONIC ASSEMBLY			1.1 mm	85 Cel	-40 Cel		DUAL		R-XDMA-N24	4	2.7 mm	17 mm					22.4 mm
MAX2769CETI+T	Analog Devices	TELECOM CIRCUIT																					Matte Tin (Sn) - annealed				1				e3	30	260
MAX7044AKA-T	Maxim Integrated	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	8	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS		.0257 mA	2.7 V	2.7	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	TSSOP8,.1	Other Telecom ICs	.65 mm	125 Cel	-40 Cel	TIN LEAD	DUAL		R-PDSO-G8	1	1.45 mm	1.625 mm	Not Qualified	e0			2.9 mm
MAX7044AKA+T	Analog Devices	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	8	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS		.0257 mA	2.7 V	2.7	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	TSSOP8,.1	Other Telecom ICs	.65 mm	125 Cel	-40 Cel	NICKEL GOLD PALLADIUM	DUAL		R-PDSO-G8	1	1.45 mm	1.625 mm	Not Qualified		30	260	2.9 mm
PN5190B1HN/C121E	NXP Semiconductors	TELECOM CIRCUIT																									3						260
RS9116W-DB00-CC0-B2A	Silicon Labs	TELECOM CIRCUIT
SARA-R510S-71B	U-blox Ag	TELECOM CIRCUIT
TM1062DVA1	Pulse Electronics	TELECOM CIRCUIT	MILITARY	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		HYBRID			5 V	5	SMALL OUTLINE, SHRINK PITCH	SOP28,.5	ATM/SONET/SDH ICs	.65 mm	125 Cel	-55 Cel		DUAL		R-PDSO-G28	1	5.588 mm		Not Qualified
TMS3705DDRQ1	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100		5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G16	3	1.75 mm	3.9 mm		e4	30	260	9.9 mm
WFM200S022XNA3	Silicon Labs	TELECOM CIRCUIT																									3					40	260
XB9X-DMUS-031	Digi International	TELECOM CIRCUIT		NO LEAD	37	XMA	RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED	.25 Mbps	R-XXMA-N37
XRT85L61IG-F	Exar	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G28	1	1.2 mm	4.4 mm	Not Qualified	e3			9.7 mm
2615011136000	Wurth Elektronik	TELECOM CIRCUIT
ADF7012BRUZ-RL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS			3 V	2.5/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G24	1	1.2 mm	4.4 mm	Not Qualified	e3	30	260	7.8 mm
BGM240SA22VNA2	Silicon Labs	TELECOM CIRCUIT
BGM240SA22VNA2R	Silicon Labs	TELECOM CIRCUIT
BLUENRG-234	STMicroelectronics	TELECOM CIRCUIT																									1
DWM3000SQ	Qorvo	TELECOM CIRCUIT
ENW89854C2KF	Panasonic	TELECOM CIRCUIT
ESP32-D2WD	Espressif Systems (Shanghai)	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.35 mm	105 Cel	-40 Cel		QUAD		S-XQCC-N48		.9 mm	5 mm					5 mm
HMC980LP4E	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					12 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQCC-N24	1	1 mm	4 mm	Not Qualified	e3	30	260	4 mm
LMX9838SBX/NOPB	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	70	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS		.065 mA	3.3 V	3.3	GRID ARRAY	LGA70(UNSPEC)	Other Telecom ICs	1 mm	85 Cel	-40 Cel		BOTTOM		R-PBGA-B70	4	2.1 mm	10 mm	Not Qualified		30	250	17 mm
PN5190B1HN/C121Y	NXP Semiconductors	TELECOM CIRCUIT																									3						260
TESEO-VIC3D	STMicroelectronics	TELECOM CIRCUIT
TRF37A73IDSGT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	1				3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		S-PDSO-N8	1	.8 mm	2 mm		e4	30	260	2 mm
ZGM130S037HGN2R	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	64	QCCN	SQUARE		YES						1.8 V		CHIP CARRIER	LCC64,.35SQ,20		.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N64	3	1.3 mm	9 mm			40	260	9 mm
80HCPS1848CHMI	Renesas Electronics	TELECOM CIRCUIT																					Tin/Lead (Sn/Pb)				4				e0	NOT SPECIFIED	225
BGM240PA32VNN3	Silicon Labs	TELECOM CIRCUIT
BGM240PB22VNA3	Silicon Labs	TELECOM CIRCUIT
LM2893M	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BIPOLAR			18 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G20		2.642 mm	7.49 mm					12.8 mm
LM2893MX	National Semiconductor	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				79 mA	18 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G20		2.65 mm	7.5 mm	Not Qualified				12.8 mm
M2-MAYA-W166-10C	U-blox Ag	TELECOM CIRCUIT
MGM240PA32VNA3R	Silicon Labs	TELECOM CIRCUIT
MT9041AP	Zarlink Semiconductor	TELECOM CIRCUIT	INDUSTRIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		.3 mA	5 V	5	CHIP CARRIER	LDCC28,.5SQ	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	QUAD		S-PQCC-J28		4.57 mm	11.506 mm	Not Qualified	e0		260	11.506 mm
PD69208T4ILQ-TR	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					55 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20		.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N56	3	1 mm	8 mm			40	260	8 mm
SX1233IMLTRT	Semtech	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1			AEC-Q100		3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.19SQ,25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N24	2	1 mm	5 mm	Not Qualified	e3		260	5 mm
TLE8457BLEXUMA1	Infineon Technologies	TELECOM CIRCUIT		NO LEAD	8	SON	SQUARE	PLASTIC/EPOXY	YES	1		BICMOS	AEC-Q100		8 V		SMALL OUTLINE			.65 mm			TIN	DUAL		S-PDSO-N8	2A	1.15 mm	3 mm		e3			3 mm
ATA8515-GHQW	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1				.046 mA	3 V	2/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	.08 Mbps	S-XQCC-N32		.9 mm	5 mm	Not Qualified	e3			5 mm
AX-SFEU-1-01-TB05	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2X.27,20		.5 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD		R-PQCC-N40	1	1 mm	5 mm		e4		260	7 mm
AX5243-1-TA05	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS			3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	TIN	QUAD		S-XQCC-N20	1	1 mm	4 mm		e3		260	4 mm
BGM240PB32VNA3R	Silicon Labs	TELECOM CIRCUIT
BQ51013AYFPT	Texas Instruments	TELECOM CIRCUIT	OTHER	BALL	28	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	125 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	.002 Mbps	R-PBGA-B28	1	.5 mm	1.88 mm		e1	30	260	3 mm
CC1175RHMT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N32	3	.9 mm	5 mm	Not Qualified	e4	30	260	5 mm
CLRC63201T/0FE,118	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	32	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE			1.27 mm	85 Cel	-25 Cel		DUAL		R-PDSO-G32	1	2.65 mm	7.5 mm				250	20.5 mm
HMC1119LP4METR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N16	3	1 mm	4 mm		e4	30	260	4 mm
MAX-8Q-0-10	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	18	XMA	RECTANGULAR	UNSPECIFIED	YES	1					3 V		MICROELECTRONIC ASSEMBLY			1.1 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N18	4	2.7 mm	9.7 mm					10.1 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.