TELECOM CIRCUIT Other Function Telecom Interface ICs 2,400+

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Maximum Gain Tolerance	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Linear Coding	Width	Qualification	Companding Law	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Filter
BG95M5LA-64-SGNS	Quectel Wireless Solutions	TELECOM CIRCUIT		NO LEAD	102	LGA	RECTANGULAR	UNSPECIFIED	YES	1				3.8 V		GRID ARRAY	LGA102(UNSPEC)			75 Cel	-35 Cel			BOTTOM	1.119 Mbps	R-XBGA-N102		2.2 mm		19.9 mm							23.6 mm
BGSF18DM20E6327XUMA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	BUTT	20	HLGA	RECTANGULAR	UNSPECIFIED	YES	1	CMOS			3.5 V		GRID ARRAY, HEAT SINK/SLUG			.4 mm	85 Cel	-30 Cel		GOLD NICKEL	BOTTOM		R-XBGA-B20	3	.98 mm		2.8 mm				e4			3.2 mm
CC1175RHBT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	QUAD	.2 Mbps	S-PQCC-N32	3	1 mm		5 mm	Not Qualified			e4	NOT SPECIFIED	260	5 mm
MGM240PB32VNN3	Silicon Labs	TELECOM CIRCUIT
NINA-B301-00B-00	U-blox Ag	TELECOM CIRCUIT																									4
RN41-I/RM630	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32		RECTANGULAR	UNSPECIFIED	YES	1		TS 16949		3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		GOLD OVER NICKEL	UNSPECIFIED		R-XXMA-N32		2.1 mm		13.2 mm				e4			25.8 mm
453-00060C	Laird Technologies	TELECOM CIRCUIT																																	30	260
BLE113-A-V1	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36	XMA	RECTANGULAR	UNSPECIFIED	YES	1						MICROELECTRONIC ASSEMBLY			.8 mm	85 Cel	-40 Cel			UNSPECIFIED		R-XXMA-N36	3	2.09 mm		9.15 mm			Operates from 2V to 3.6V supply		40	260	15.725 mm
RN4870-I/RM130	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	YES	1		TS 16949		3.3 V		MICROELECTRONIC ASSEMBLY	MODULE,33LEAD(UNSPEC)		1.1 mm	85 Cel	-40 Cel			UNSPECIFIED	.01 Mbps	R-XXMA-N33		2.46 mm		12 mm							22 mm
SI4463-C2A-GM	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL
ZM3102AE-CME1	Silicon Labs	TELECOM CIRCUIT		NO LEAD	18	XMA	RECTANGULAR	UNSPECIFIED	YES	1						MICROELECTRONIC ASSEMBLY								UNSPECIFIED	.04 Mbps	R-XXMA-N18
450-0162C	Laird Technologies	TELECOM CIRCUIT																																	NOT SPECIFIED	NOT SPECIFIED
453-00060R	Laird Technologies	TELECOM CIRCUIT																																	30	260
A2235-H	Lantronix	TELECOM CIRCUIT	INDUSTRIAL	UNSPECIFIED			RECTANGULAR	UNSPECIFIED	NO	1				3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel			UNSPECIFIED		R-XXMA-X
BGT24MTR12E6327XUMA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel		TIN	QUAD		R-PQCC-N32	3	.9 mm		4.5 mm				e3			5.5 mm
MDBT50Q-P1MV2	Raytac	TELECOM CIRCUIT		NO LEAD	61	XMA	RECTANGULAR	UNSPECIFIED	YES	1				3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel			UNSPECIFIED	2 Mbps	R-XXMA-N61		2 mm		10.5 mm							15.5 mm
MGM240PB22VNA3	Silicon Labs	TELECOM CIRCUIT
PN5120A0HN1/C1,118	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V	1.8/3.3,2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-30 Cel		NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N32	1	1 mm		5 mm	Not Qualified			e4		260	5 mm
WL1807MODGIMOCT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BUTT	100	LGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.7 V	2.9/4.8	GRID ARRAY	LGA100(UNSPEC)	Other Telecom ICs	.7 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	BOTTOM	100 Mbps	R-PBGA-B100	3	2 mm		13.3 mm	Not Qualified			e4	30	260	13.4 mm
XBP9X-DMRS-001	Digi International	TELECOM CIRCUIT		NO LEAD	37	XMA	RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel			UNSPECIFIED	.25 Mbps	R-XXMA-N37
CC2564BYFVR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	54	VFBGA	RECTANGULAR	UNSPECIFIED	YES	1				3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel		TIN SILVER COPPER	BOTTOM	4 Mbps	R-XBGA-B54	1	.575 mm		2.93 mm				e1	30	260	3.26 mm
MAX5980GTJ+	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	1	CMOS					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel		Matte Tin (Sn) - annealed	QUAD		S-CQCC-N32	1	.8 mm		5 mm				e3	30	260	5 mm
MGM12P32F1024GA-V4	Silicon Labs	TELECOM CIRCUIT		UNSPECIFIED		XMA	RECTANGULAR	UNSPECIFIED	NO	1				3.3 V		SPECIAL SHAPE				85 Cel	-40 Cel			UNSPECIFIED	1 Mbps	R-XXMA-X				12.9 mm							17.8 mm
RS9116W-SB00-AA1-X2A	Silicon Labs	TELECOM CIRCUIT
SI4461-C2A-GMR	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL
TLV320AIC22CPT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Codecs	.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD		S-PQFP-G48	4	1.6 mm	16-BIT	7 mm	Not Qualified	A/MU-LAW		e4	30	260	7 mm	YES
ZOE-M8G-0	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	BUTT	51	TFLGA	SQUARE	UNSPECIFIED	YES	1		AEC-Q100		1.8 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel			BOTTOM		S-XBGA-B51	3	1.165 mm		4.5 mm					NOT SPECIFIED	NOT SPECIFIED	4.5 mm
2613011037000	Wurth Elektronik	TELECOM CIRCUIT																									3								30	250
AD73311ARSZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3 V	3/5	SMALL OUTLINE, SHRINK PITCH	SSOP20,.3	Codecs	.65 mm	85 Cel	-40 Cel	1 dB	MATTE TIN	DUAL		R-PDSO-G20	1	2 mm	16-BIT	5.3 mm	Not Qualified			e3		260	7.2 mm	YES
CSR1010A05-IQQM-R	Qualcomm	TELECOM CIRCUIT
MGM240PA32VNN3	Silicon Labs	TELECOM CIRCUIT
SN65DSI86ZQER	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	64	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		TIN SILVER COPPER	BOTTOM	5400 Mbps	S-PBGA-B64	3	1 mm		5 mm				e1	30	260	5 mm
SX1302IMLTRT	Semtech	TELECOM CIRCUIT																					MATTE TIN				3							e3		260
TMS3705EDRQ1	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100		5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G16	3	1.75 mm		3.9 mm				e4	30	260	9.9 mm
ADF7012BRUZ-RL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3 V	2.5/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel		MATTE TIN	DUAL		R-PDSO-G24	1	1.2 mm		4.4 mm	Not Qualified			e3	30	260	7.8 mm
BGM240PB32VNN3	Silicon Labs	TELECOM CIRCUIT
BLED112-V1	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	UNSPECIFIED		XMA	RECTANGULAR	UNSPECIFIED	NO	1						MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel			UNSPECIFIED		R-XXMA-X							VBUS= 3.6V TO 5.5V		NOT SPECIFIED	NOT SPECIFIED
CC2640F128RHBR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD		S-PQCC-N32	3	1 mm		5 mm				e4	NOT SPECIFIED	260	5 mm
PN7161A1HN/C100E	NXP Semiconductors	TELECOM CIRCUIT																									3								NOT SPECIFIED	260
TDA5201XUMA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		TIN	DUAL		R-PDSO-G28	3	1.2 mm		4.4 mm	Not Qualified			e3			9.7 mm
2611011024000	Wurth Elektronik	TELECOM CIRCUIT
CC2531F256RHAT	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD	12 Mbps	S-PQCC-N40	3	1 mm		6 mm	Not Qualified			e4	30	260	6 mm
CC2592RGVR	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	125 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N16	2	1 mm		4 mm				e4	30	260	4 mm
TDK5100FHTMA1	Infineon Technologies	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	125 Cel	-40 Cel		MATTE TIN	DUAL		S-PDSO-G10	1	1.1 mm		3 mm	Not Qualified			e3			3 mm
HMC799LP3ETR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	QCCN	SQUARE	PLASTIC/EPOXY	YES	1			80 mA	5 V	5	CHIP CARRIER	LCC16,.12SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		MATTE TIN	QUAD		S-PQCC-N16	1				Not Qualified			e3	30	260
LBEE5QD1ZM-572	Murata Manufacturing	TELECOM CIRCUIT
SA612AN	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1				6 V		IN-LINE			2.54 mm	85 Cel	-40 Cel			DUAL		R-PDIP-T8		4.2 mm		7.62 mm	Not Qualified				40	250	9.5 mm
SA612AN,112	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1				6 V		IN-LINE			2.54 mm	85 Cel	-40 Cel			DUAL		R-PDIP-T8		4.2 mm		7.62 mm	Not Qualified				40	250	9.5 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.