TELECOM CIRCUIT Other Function Telecom Interface ICs 2,400+

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
MRF24J40MDT-I/RM	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	12		RECTANGULAR	UNSPECIFIED	NO	1					3.3 V		MICROELECTRONIC ASSEMBLY			2.54 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		R-XDMA-N12		3.3528 mm	22.86 mm			e3			33.02 mm
NRF24LE1-F16Q48-T	Nordic Semiconductor Asa	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.28SQ,20		.5 mm	85 Cel	-40 Cel		QUAD	2 Mbps	S-XQCC-N48		.9 mm	7 mm						7 mm
PN7160B1HN/C100Y	NXP Semiconductors	TELECOM CIRCUIT		NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.23SQ,20		.5 mm	85 Cel	-25 Cel		QUAD	.848 Mbps	S-PQCC-N40	3	1 mm	6 mm		ALSO AVAILABLE WTH 3.3 SUPPLY			260	6 mm
SARA-G450-00C	U-blox Ag	TELECOM CIRCUIT
UCC3750DWTRG4	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BICMOS			5 V		SMALL OUTLINE			1.27 mm	70 Cel	0 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G28	2	2.65 mm	7.5 mm	Not Qualified		e4	30	260	17.9 mm
ADRV9003BBCZ	Analog Devices	TELECOM CIRCUIT																															NOT SPECIFIED	NOT SPECIFIED
ADRV9008BBCZ-1REEL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.3 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B196	3	1.27 mm	12 mm					260	12 mm
BT860-SA-T/R	Laird Technologies	TELECOM CIRCUIT																															30	260
CC2640F128RGZT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD		S-PQCC-N48	3	1 mm	7 mm			e4	NOT SPECIFIED	260	7 mm
CY7B923-SXC	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BICMOS		.085 mA	5 V	5	SMALL OUTLINE	SOP28,.4	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	NICKEL PALLADIUM GOLD	DUAL	400 Mbps	R-PDSO-G28	3	2.67 mm	7.505 mm	Not Qualified		e4	20	260	17.905 mm
ISL32275EFVZ-T	Renesas Electronics	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BICMOS			3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G16	2	1.2 mm	4.4 mm			e3	30	260	5 mm
MCP2120-I/P	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	14	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1		CMOS	TS 16949	.016 mA	5 V	3/5	IN-LINE	DIP14,.3	Other Telecom ICs	2.54 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		R-PDIP-T14		5.334 mm	7.62 mm	Not Qualified		e3			19.05 mm
RN4678APL-V/RM111	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	YES	1			TS 16949		1.9 V		MICROELECTRONIC ASSEMBLY	MODULE,33LEAD(UNSPEC)		1.1 mm	70 Cel	-20 Cel		UNSPECIFIED		R-XXMA-N33		2.46 mm	12 mm						22 mm
RS9113-N00-D1W	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	79	XMA	RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED	54 Mbps	R-XXMA-N79		3.3 mm	16 mm		ALSO HAS BLUETOOTH DATA RATE= 1,2,3 Mbps and ZIGBEE DATA RATE= 250 kbps				27 mm
WF111-E-V1	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	33	QMA	RECTANGULAR	UNSPECIFIED	YES	1					1.5 V		MICROELECTRONIC ASSEMBLY			1.27 mm	85 Cel	-40 Cel		QUAD	72.2 Mbps	R-XQMA-N33	3	2.3 mm	12 mm				40	260	19 mm
AS3933-BTST	Ams Ag	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G16	3	1.2 mm	4.4 mm					260	5 mm
BGM15HA12E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	12	VQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1					2.8 V		CHIP CARRIER, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel	GOLD NICKEL	BOTTOM		R-PBCC-N12	1	.65 mm	1.1 mm			e4			1.9 mm
BGS12PN10E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	10	VQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS			2.85 V		CHIP CARRIER, VERY THIN PROFILE			.4 mm	85 Cel	-30 Cel		BOTTOM		R-PBCC-N10	1	.4 mm	1.1 mm						1.5 mm
MAYA-W160-00B	U-blox Ag	TELECOM CIRCUIT
MCP2140-I/SO	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	18	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS	TS 16949		3 V		SMALL OUTLINE	SOP18,.4		1.27 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G18	2	2.64 mm	7.49 mm	Not Qualified		e3			11.53 mm
MGM240PB32VNA3R	Silicon Labs	TELECOM CIRCUIT
NINA-B112-01B-00	U-blox Ag	TELECOM CIRCUIT
SA602AD,602	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					6 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G8		1.75 mm	3.9 mm	Not Qualified					4.9 mm
SN65LVCP114ZJA	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	167	LFBGA	SQUARE	PLASTIC/EPOXY	YES	4	8				2.5 V	2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA167,14X14,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	14200 Mbps	S-PBGA-B167	3	1.35 mm	12 mm	Not Qualified		e1	30	260	12 mm
SX1243IULTRT	Semtech	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100		3.3 V	3.3	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.11,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-N8	1	.6 mm	2 mm	Not Qualified		e3		260	3 mm
TLK2711AIRCP	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	HVFQFP	SQUARE	PLASTIC/EPOXY	YES	1					2.5 V	2.5	FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH	TQFP64,.47SQ	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQFP-G64	3	1 mm	10 mm	Not Qualified		e4	30	260	10 mm
TLK2711AIRCPR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	HVFQFP	SQUARE	PLASTIC/EPOXY	YES	1					2.5 V	2.5	FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH	TQFP64,.47SQ	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQFP-G64	3	1 mm	10 mm	Not Qualified		e4	30	260	10 mm
XB3-24ARM-J	Digi International	TELECOM CIRCUIT		UNSPECIFIED		XMA	RECTANGULAR	UNSPECIFIED	NO	1							SPECIAL SHAPE				85 Cel	-40 Cel		UNSPECIFIED	1 Mbps	R-XXMA-X
ADRV9008BBCZ-2	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.3 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B196	3	1.27 mm	12 mm					260	12 mm
ADTR1107ACCZ-R7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	TFLGA	SQUARE	UNSPECIFIED	YES	1					5 V		GRID ARRAY, THIN PROFILE, FINE PITCH	LCC24,.2SQ,25		.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM		S-XBGA-N24	3	1.13 mm	5 mm			e4		260	5 mm
ADV7619KSVZ-P	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	128	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS			1.8 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH			.4 mm	70 Cel	0 Cel	Matte Tin (Sn) - annealed	QUAD		S-PQFP-G128	3	1.2 mm	14 mm			e3		260	14 mm
AP22804ASN-7	Diodes Incorporated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	HVSON	SQUARE	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		S-PDSO-N6		.63 mm	2 mm			e4	30	260	2 mm
RS9116N-SB00-B00-B00	Silicon Labs	TELECOM CIRCUIT
SA612AN/01,112	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1					6 V		IN-LINE			2.54 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDIP-T8		4.2 mm	7.62 mm	Not Qualified		e4			9.5 mm
SX1231HIMLTRT	Semtech	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1			AEC-Q100		3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.19SQ,25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N24	3	1 mm	5 mm	Not Qualified		e3		260	5 mm
TDA7200XUMA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	70 Cel	-20 Cel	TIN	DUAL		R-PDSO-G28	3	1.2 mm	4.4 mm	Not Qualified		e3			9.7 mm
AP22804BW5-7	Diodes Incorporated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	5	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.95 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G5		1.4 mm	1.6 mm			e3	30	260	3 mm
ATWILC1000-MR110UB-T	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28	XMA	RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY			1.016 mm	85 Cel	-40 Cel		UNSPECIFIED	72.2 Mbps	R-XXMA-N28	3	2.113 mm	14.73 mm		Data rate max for 802.11b is 11Mbps and for 802.11g is 54Mbps				21.72 mm
BGS18GA14E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	BUTT	14		SQUARE	UNSPECIFIED	YES	1					3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-30 Cel		QUAD		S-XQMA-B14	1	.65 mm	2 mm						2 mm
BMD-345-A-R	U-blox Ag	TELECOM CIRCUIT
HMC773ALC3BTR-R5	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	12	HVQCCN	SQUARE	UNSPECIFIED	YES	1							CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N12		.9 mm	2.9 mm				NOT SPECIFIED	NOT SPECIFIED	2.9 mm
MRF24WG0MA-I/RM10C	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36		RECTANGULAR	UNSPECIFIED	NO	1			TS 16949		3.3 V		MICROELECTRONIC ASSEMBLY			1.27 mm	85 Cel	-40 Cel		DUAL		R-XDMA-N36		2.7 mm	21 mm						31 mm
RI-TRP-DR2B-40	Texas Instruments	TELECOM CIRCUIT	OTHER	UNSPECIFIED			UNSPECIFIED	UNSPECIFIED		1											85 Cel	-25 Cel
EFR32BG13P632F512GM48-B	Silicon Labs	TELECOM CIRCUIT
NEO-M8T	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	SON	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100; TS 16949		3 V		SMALL OUTLINE				85 Cel	-40 Cel		DUAL		R-PDSO-N24							NOT SPECIFIED	NOT SPECIFIED
PN7160A1HN/C100Y	NXP Semiconductors	TELECOM CIRCUIT																									3						NOT SPECIFIED	260
RN41N-I/RM615	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	35		RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel	MATTE TIN	QUAD		R-XQMA-N35		2.2 mm	13.2 mm			e3			20.1 mm
SPSGRF-915	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	11		RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY			1.27 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N11		2.2 mm	11.5 mm				NOT SPECIFIED	NOT SPECIFIED	13.5 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.