TELECOM CIRCUIT Other Function Telecom Interface ICs 2,400+

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Maximum Gain Tolerance	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Linear Coding	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Filter
FC20-Q93	Quectel Wireless Solutions	TELECOM CIRCUIT		NO LEAD	52	QCCN	RECTANGULAR		YES	1				3.3 V		CHIP CARRIER				85 Cel	-40 Cel			QUAD	433 Mbps	R-XQCC-N52		2.05 mm		13 mm		SEATED HGT NOMINAL				16.6 mm
MAX3799ETJ+T	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BIPOLAR			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		Matte Tin (Sn) - annealed	QUAD		S-XQCC-N32	1	.8 mm		5 mm			e3	30	260	5 mm
MCP2140A-I/SO	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	18	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	TS 16949		3 V		SMALL OUTLINE	SOP18,.4		1.27 mm	85 Cel	-40 Cel		Matte Tin (Sn)	DUAL		R-PDSO-G18	2	2.65 mm		7.5 mm	Not Qualified		e3	40	260	11.55 mm
RFFC5072TR13	Qorvo	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS			3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel			QUAD		S-XQCC-N32		.95 mm		5 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	5 mm
SARA-G450-00C-00	U-blox Ag	TELECOM CIRCUIT	OTHER	NO LEAD	96		RECTANGULAR	UNSPECIFIED	YES	1				3.8 V		MICROELECTRONIC ASSEMBLY				70 Cel	-20 Cel			UNSPECIFIED		R-XXMA-N96		2.65 mm		16 mm						26 mm
SI4010-C2-GTR	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.3 V		SMALL OUTLINE			.5 mm	85 Cel	-40 Cel			DUAL		S-PDSO-G10		1.1 mm		3 mm	Not Qualified					3 mm
SPBTLE-RF0	STMicroelectronics	TELECOM CIRCUIT																																NOT SPECIFIED	NOT SPECIFIED
SX8651ICSTRT	Semtech	TELECOM CIRCUIT	INDUSTRIAL	BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	BOTTOM		R-PBGA-B12	1	.625 mm		1.5 mm			e4		260	2 mm
WL1807MODGIMOCR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BUTT	100	LGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.7 V	2.9/4.8	GRID ARRAY	LGA100(UNSPEC)	Other Telecom ICs	.7 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	BOTTOM	100 Mbps	R-PBGA-B100	3	2 mm		13.3 mm	Not Qualified		e4	30	260	13.4 mm
AD73311ARSZ-REEL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3 V	3/5	SMALL OUTLINE, SHRINK PITCH	SSOP20,.3	Codecs	.65 mm	85 Cel	-40 Cel	1 dB	MATTE TIN	DUAL		R-PDSO-G20	1	2 mm	16-BIT	5.3 mm	Not Qualified		e3	40	260	7.2 mm	YES
AD8015ARZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			26 mA	5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		MATTE TIN	DUAL		R-PDSO-G8	1	1.75 mm		3.9 mm	Not Qualified		e3	30	260	4.9 mm
AP22814BSN-7	Diodes Incorporated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	HVSON	SQUARE	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	DUAL		S-PDSO-N6		.63 mm		2 mm			e4	30	260	2 mm
BLUENRG-234N	STMicroelectronics	TELECOM CIRCUIT
BM71BLES1FC2-0B05BA	Microchip Technology	TELECOM CIRCUIT		NO LEAD	16	XMA	RECTANGULAR	UNSPECIFIED	YES	1				3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel			UNSPECIFIED	.0086 Mbps	R-XXMA-X16		2.1 mm		9 mm						11.5 mm
CC2538SF53RTQR	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	56	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD	12 Mbps	S-PQCC-N56	3	1 mm		8 mm			e4	30	260	8 mm
EFR32BG12P432F1024GM48-B	Silicon Labs	TELECOM CIRCUIT																																NOT SPECIFIED	NOT SPECIFIED
LXMS33HCNG-134	Murata Manufacturing	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD		VSON	SQUARE	PLASTIC/EPOXY	YES	1						SMALL OUTLINE, VERY THIN PROFILE				85 Cel	-40 Cel			DUAL		S-PDSO-N		.7 mm		3.2 mm				NOT SPECIFIED	NOT SPECIFIED	3.2 mm
MCP2140A-I/P	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	TS 16949		3 V		IN-LINE	DIP18,.3		2.54 mm	85 Cel	-40 Cel		MATTE TIN	DUAL		R-PDIP-T18		5.334 mm		7.62 mm	Not Qualified		e3			22.86 mm
MGM240PA22VNA3R	Silicon Labs	TELECOM CIRCUIT
MGM240SA22VNA2	Silicon Labs	TELECOM CIRCUIT
PN5190B1EV/C121Y	NXP Semiconductors	TELECOM CIRCUIT																									3								260
PN7161B1HN/C100E	NXP Semiconductors	TELECOM CIRCUIT																									3							NOT SPECIFIED	260
SC1894A-00C13E	Analog Devices	TELECOM CIRCUIT		NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1				1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm					QUAD		S-XQCC-N64		.9 mm		9 mm				NOT SPECIFIED	NOT SPECIFIED	9 mm
SST12LF02-QXCE	Microchip Technology	TELECOM CIRCUIT	OTHER	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-20 Cel		MATTE TIN	QUAD		S-XQCC-N16		.5 mm		3 mm			e3			3 mm
TLK2711AJRZQE	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	BALL	80	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1				2.5 V	2.5	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA80,9X9,20	Other Telecom ICs	.5 mm	70 Cel	0 Cel		TIN SILVER COPPER	BOTTOM		S-PBGA-B80	3	1 mm		5 mm	Not Qualified		e1	30	260	5 mm
WYSBHVGXG	Taiyo Yuden	TELECOM CIRCUIT	OTHER	NO LEAD	70		RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-30 Cel			UNSPECIFIED		R-XXMA-N70		1.9 mm		8.9 mm				NOT SPECIFIED	NOT SPECIFIED	12.6 mm
XB3-24APS	Digi International	TELECOM CIRCUIT		UNSPECIFIED		XMA	RECTANGULAR	UNSPECIFIED	NO	1						SPECIAL SHAPE				85 Cel	-40 Cel			UNSPECIFIED	1 Mbps	R-XXMA-X
XB9X-DMUS-001	Digi International	TELECOM CIRCUIT		NO LEAD	37	XMA	RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel			UNSPECIFIED	.25 Mbps	R-XXMA-N37
ADV7533BCBZ-RL	Analog Devices	TELECOM CIRCUIT	OTHER	BALL	49	VFBGA	SQUARE	UNSPECIFIED	YES	1	CMOS			1.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-10 Cel		TIN SILVER COPPER	BOTTOM		S-XBGA-B49	1	.66 mm		3.46 mm	Not Qualified		e1	30	260	3.46 mm
ATA8403C-6AQY66	Microchip Technology	TELECOM CIRCUIT	OTHER	GULL WING	8	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES				11 mA	3 V	3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19	Other Telecom ICs	.635 mm	85 Cel	-55 Cel		MATTE TIN	DUAL		R-PDSO-G8					Not Qualified		e3
ATA8403C-6AQY-66	Microchip Technology	TELECOM CIRCUIT	OTHER	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19		.65 mm	85 Cel	-55 Cel		Matte Tin (Sn)	DUAL		S-PDSO-G8		1.05 mm		3 mm			e3	NOT SPECIFIED	NOT SPECIFIED	3 mm
AX-SFEU-1-03-TX30	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2X.27,20		.5 mm	85 Cel	-40 Cel			QUAD		R-PQCC-N40		1 mm		5 mm				NOT SPECIFIED	NOT SPECIFIED	7 mm
BGS14PN10E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	10	VQCCN	RECTANGULAR	UNSPECIFIED	YES	1	CMOS			2.85 V		CHIP CARRIER, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel			QUAD		R-XQCC-N10	1	.4 mm		1.1 mm						1.5 mm
CC2530F32RHAT	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N40	3	1 mm		6 mm	Not Qualified		e4	30	260	6 mm
CY7B933-JXC	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		155 mA	5 V	5	CHIP CARRIER	LDCC28,.5SQ	Other Telecom ICs	1.27 mm	70 Cel	0 Cel		MATTE TIN	QUAD	400 Mbps	S-PQCC-J28	3	4.572 mm		11.5316 mm	Not Qualified		e3	20	260	11.5316 mm
ENW89854C1KF	Panasonic	TELECOM CIRCUIT
HPA00399RHDR	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	28	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD	.25 Mbps	S-PQCC-N28	3	1 mm		5 mm			e4	30	260	5 mm
JODY-W374-00B	U-blox Ag	TELECOM CIRCUIT
LMX2571NJKR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		MATTE TIN	QUAD		S-XQCC-N36	3	.8 mm		6 mm			e3	30	260	6 mm
M66FA-04-STD	Quectel Wireless Solutions	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	44		RECTANGULAR	UNSPECIFIED	YES	1				4 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel			QUAD		R-XQMA-N44		2.3 mm		17.7 mm						15.8 mm
PN7160B1EV/C100K	NXP Semiconductors	TELECOM CIRCUIT																									3							NOT SPECIFIED	260
RM024-S125-C-30	Laird Technologies	TELECOM CIRCUIT	INDUSTRIAL	UNSPECIFIED		XMA	RECTANGULAR	UNSPECIFIED	NO	1						MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel			UNSPECIFIED	.5 Mbps	R-XXMA-X						ALSO AVAILABLE WITH 280kbps data rate		NOT SPECIFIED	NOT SPECIFIED
SI4455-B1A-FMR	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		MATTE TIN	QUAD		S-XQCC-N20	2	.9 mm		3 mm			e3	40	260	3 mm
SIM5320A	Simcom Wireless Solutions	TELECOM CIRCUIT	COMMERCIAL EXTENDED	NO LEAD	80	QMA	SQUARE	UNSPECIFIED	YES	1						MICROELECTRONIC ASSEMBLY				80 Cel	-30 Cel			QUAD	3.6 Mbps	S-XQMA-N80
TDA7100HTMA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	70 Cel	-20 Cel		MATTE TIN	DUAL		S-PDSO-G10	1	1.1 mm		3 mm	Not Qualified		e3			3 mm
XB3-24Z8CM	Digi International	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	34		RECTANGULAR	UNSPECIFIED	YES	1						MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel			UNSPECIFIED		R-XXMA-N34				13 mm						19 mm
ADL5904ACPZN-R7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N16	3	.8 mm		3 mm			e4	30	260	3 mm
AP22804BSN-7	Diodes Incorporated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	HVSON	SQUARE	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	DUAL		S-PDSO-N6		.63 mm		2 mm			e4	30	260	2 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.