TELECOM CIRCUIT Other Function Telecom Interface ICs 2,400+

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Maximum Gain Tolerance	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Linear Coding	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Filter
SA5224D	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				.035 mA	5 V	5	SMALL OUTLINE	SOP16,.25	ATM/SONET/SDH ICs	1.27 mm	85 Cel	-40 Cel			DUAL		R-PDSO-G16		1.75 mm		3.9 mm	Not Qualified				9.9 mm
SARA-G450-01C	U-blox Ag	TELECOM CIRCUIT
SARA-G450-01C-01	U-blox Ag	TELECOM CIRCUIT
ST60-2230C-U	Laird Technologies	TELECOM CIRCUIT
TMS3705BDRG4	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				.02 mA	5 V	5	SMALL OUTLINE	SOP16,.25	Other Telecom ICs	1.27 mm	105 Cel	-40 Cel		NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G16	3	1.75 mm		3.91 mm	Not Qualified	e4	30	260	9.9 mm
VSC8491YJU-17	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	1					1 V		GRID ARRAY, LOW PROFILE	BGA196,14X14,40		1 mm	110 Cel	-40 Cel			BOTTOM	10000 Mbps	S-PBGA-B196		1.4 mm		15 mm					15 mm
W2SG0084I-B-T	Wi2wi	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	QMA	RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY			1.5 mm	85 Cel	-40 Cel			QUAD		R-XQMA-N24	1	2.3 mm		11.2 mm				245	12 mm
WF111-N-V1	Silicon Labs	TELECOM CIRCUIT
XBP9X-DMRS-021	Digi International	TELECOM CIRCUIT		NO LEAD	37	XMA	RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel			UNSPECIFIED	.25 Mbps	R-XXMA-N37
XR2211ACDTR-F	Exar	TELECOM CIRCUIT	COMMERCIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BIPOLAR			12 V		SMALL OUTLINE			1.27 mm	70 Cel	0 Cel		MATTE TIN	DUAL		R-PDSO-G14	2	1.75 mm		3.9 mm	Not Qualified	e3			8.65 mm
090-02789-012	Microchip Technology	TELECOM CIRCUIT		PIN/PEG	9	DMA	RECTANGULAR	UNSPECIFIED	NO	1					3.3 V		MICROELECTRONIC ASSEMBLY			5.1 mm	80 Cel	-40 Cel			DUAL		R-XDMA-P9		11.68 mm		35.3 mm					40.64 mm
AD73311ARS	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS			3 V	3/5	SMALL OUTLINE, SHRINK PITCH	SSOP20,.3	Codecs	.65 mm	85 Cel	-40 Cel	1 dB	Tin/Lead (Sn85Pb15)	DUAL		R-PDSO-G20	1	2 mm	16-BIT	5.3 mm	Not Qualified	e0	30	240	7.2 mm	YES
AD8312ACBZ-P2	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		TIN SILVER COPPER	BOTTOM		R-PBGA-B6	1	.675 mm		.95 mm	Not Qualified	e1	40	260	1.45 mm
ADF7012BRUZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS			3 V	2.5/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel		MATTE TIN	DUAL		R-PDSO-G24	1	1.2 mm		4.4 mm	Not Qualified	e3		260	7.8 mm
ADRF6821ACPZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1		BICMOS			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N56	3	.8 mm		8 mm		e4	30	260	8 mm
ADRV9008BBCZ-2REEL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.3 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel			BOTTOM		S-PBGA-B196	3	1.27 mm		12 mm				260	12 mm
ATA5744N-TKQY	Atmel	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				.0087 mA	5 V	5	SMALL OUTLINE, SHRINK PITCH	SSOP20,.25	Other Telecom ICs	.65 mm	105 Cel	-40 Cel		MATTE TIN	DUAL		R-PDSO-G20	1			4.4 mm	Not Qualified	e3		260	6.625 mm
ATA5746-PXPW	Atmel	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1				.01 mA	3 V	3,5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.2SQ,25	Other Telecom ICs	.65 mm	105 Cel	-40 Cel			QUAD		S-XQCC-N24		1 mm		5 mm	Not Qualified				5 mm
ATSAMW25H18-MR210PB1952	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	51		RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY			1.2 mm	85 Cel	-40 Cel			UNSPECIFIED		R-XXMA-N51		2.138 mm		14.908 mm					33.864 mm
CC1121RHBR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD SILVER	QUAD	.2 Mbps	S-PQCC-N32	3	1 mm		5 mm	Not Qualified	e4	30	260	5 mm
CC2564BRVMR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	76	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1					3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.6 mm	85 Cel	-40 Cel		MATTE TIN	QUAD		R-PQCC-N76	3	.9 mm		7.73 mm		e3	30	260	8 mm
CC430F6137IRGC	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	64	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1					2.2 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N64	3	1 mm		9 mm	Not Qualified	e4	30	260	9 mm
DA16600MOD-AAC4WA32	Renesas Electronics	TELECOM CIRCUIT																																NOT SPECIFIED	NOT SPECIFIED
ENW89823C4KF	Panasonic	TELECOM CIRCUIT
ENW89837A3KF	Panasonic	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	58		RECTANGULAR	UNSPECIFIED	YES	1					1.8 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel			UNSPECIFIED		R-XXMA-N58		2 mm		8.7 mm			10	250	15.6 mm
ETRX2-PA	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	38		RECTANGULAR	UNSPECIFIED	YES	1					3 V		MICROELECTRONIC ASSEMBLY			2.54 mm	85 Cel	-40 Cel			UNSPECIFIED		R-XXMA-N38				20.5 mm					37.5 mm
HT2DC20S20/F/RSP	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD			RECTANGULAR	PLASTIC/EPOXY	YES	1		HYBRID					SPECIAL SHAPE	MODULE(UNSPEC)	Other Telecom ICs		85 Cel	-40 Cel		SILVER	UNSPECIFIED		R-PXSS-N					Not Qualified	e4
MAX2851ITK+	Analog Devices	TELECOM CIRCUIT	OTHER	NO LEAD	68	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		BICMOS			2.85 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-25 Cel		Matte Tin (Sn) - annealed	QUAD		S-PQCC-N68	3	.8 mm		10 mm	Not Qualified	e3	30	260	10 mm
MAX3658AETA-T	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	SQUARE	UNSPECIFIED	YES	1				.026 mA	3.3 V	3.3	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel		TIN LEAD	DUAL		S-XDSO-N8	1	.8 mm		3 mm	Not Qualified	e0			3 mm
MAX3658AETA+T	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	SQUARE	UNSPECIFIED	YES	1				.026 mA	3.3 V	3.3	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel		Matte Tin (Sn) - annealed	DUAL		S-XDSO-N8	1	.8 mm		3 mm	Not Qualified	e3	30	260	3 mm
MAYA-W271-00B	U-blox Ag	TELECOM CIRCUIT																										4
MC12311CHN	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	60	LGA	SQUARE	PLASTIC/EPOXY	YES							2/3.3	GRID ARRAY	LGA60,16X16,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		NICKEL GOLD	BOTTOM		S-PBGA-N60	3				Not Qualified	e4	40	260
MFRC63002HN	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-25 Cel			QUAD		S-PQCC-N32	1	1 mm		5 mm					5 mm
MFRC63002HN,157	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-25 Cel			QUAD		S-PQCC-N32	1	1 mm		5 mm			30	260	5 mm
MFRC63003HNY	NXP Semiconductors	TELECOM CIRCUIT																						NICKEL PALLADIUM GOLD SILVER				2					e4	30	260
MGM12P32F1024GA-V2	Silicon Labs	TELECOM CIRCUIT
NINA-W102-00B	U-blox Ag	TELECOM CIRCUIT																										4
OPA380AIDR	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	1			.008 mA	5 V	3/5	SMALL OUTLINE	SOP8,.25	Other Telecom ICs	1.27 mm	125 Cel	-40 Cel		NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G8	2	1.75 mm		3.9 mm	Not Qualified	e4	30	260	4.9 mm
PE42426A-Z	Psemi	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	12	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N12	1	.8 mm		3 mm		e4	30	260	3 mm
PN5180A0HN/C2Y	NXP Semiconductors	TELECOM CIRCUIT																										3							260
PN5180A0HN/C4Y	NXP Semiconductors	TELECOM CIRCUIT																						NICKEL PALLADIUM GOLD				3					e4	30	260
RFFC5072SR	Qorvo	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS			3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel			QUAD		S-XQCC-N32		.95 mm		5 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	5 mm
RN42U-I/RM	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32		RECTANGULAR	UNSPECIFIED	YES	1			TS 16949		3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel			UNSPECIFIED		R-XXMA-N32		2.4 mm		13.4 mm			NOT SPECIFIED	NOT SPECIFIED	25.8 mm
RS9116N-SB00-AA1-X00	Silicon Labs	TELECOM CIRCUIT
SARA-G350-02S	U-blox Ag	TELECOM CIRCUIT																										4
SC1894A-00M13E	Analog Devices	TELECOM CIRCUIT		NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS			1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm					QUAD		S-XQCC-N64		.9 mm		9 mm			NOT SPECIFIED	NOT SPECIFIED	9 mm
SL2S2102FTB,115	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	3	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS					SMALL OUTLINE, VERY THIN PROFILE			.55 mm	85 Cel	-40 Cel		TIN	DUAL		R-PDSO-N3	1	.5 mm		1 mm		e3	30	260	1.45 mm
SX1509QBIULTRT	Semtech	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel			QUAD		S-XQCC-N28		.6 mm		4 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	4 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.