TELECOM CIRCUIT Other Function Telecom Interface ICs 2,400+

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
FC20-Q73	Quectel Wireless Solutions	TELECOM CIRCUIT		NO LEAD	52	QCCN	RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		CHIP CARRIER	LCC52(UNSPEC)			85 Cel	-40 Cel		QUAD	433 Mbps	R-XQCC-N52		2.1 mm	13 mm		SEATED HEIGHT NOM CONSIDERED				16.6 mm
FC20N-Q73B	Quectel Wireless Solutions	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	52	XMA	RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED	433 Mbps	R-XXMA-N52		2.1 mm	13 mm		Seated Hgt-Nom				16.6 mm
LTC5100EUF#PBF	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQCC-N16	1	.8 mm	4 mm	Not Qualified		e3	30	260	4 mm
MICRF009YM	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE	SOP16,.25		1.27 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	.002 Mbps	R-PDSO-G16	1	1.895 mm	3.9 mm		Operates from 4.75V to 5.5V	e3	30	260	9.9 mm
MRF24J40MET-I/RM	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	12		RECTANGULAR	UNSPECIFIED	NO	1		TS 16949		3.3 V		MICROELECTRONIC ASSEMBLY			2.54 mm	85 Cel	-40 Cel		DUAL		R-XDMA-N12		3.48 mm	22.86 mm						33.02 mm
NEO-7N-0	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24		RECTANGULAR	UNSPECIFIED	NO	1		AEC-Q100		3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel	SILVER OVER NICKEL	DUAL		R-XDMA-N24		2.6 mm	12.2 mm			e4			16 mm
PGA5807ARGCR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N64	3	1 mm	9 mm			e4	30	260	9 mm
QN9080CHN	NXP Semiconductors	TELECOM CIRCUIT		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16		.4 mm	85 Cel	-40 Cel		QUAD	2 Mbps	S-PQCC-N48		1 mm	6 mm						6 mm
RFPA5201ESR	Qorvo	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	14	HTSON	SQUARE	UNSPECIFIED	YES	1				5 V		SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE				85 Cel	-40 Cel		DUAL		S-XDSO-N14		1.05 mm	7 mm						7 mm
RFPA5201ETR13	Qorvo	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	14	HTSON	SQUARE	UNSPECIFIED	YES	1				5 V		SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE				85 Cel	-40 Cel		DUAL		S-XDSO-N14		1.05 mm	7 mm						7 mm
RM191-SM	Laird Technologies	TELECOM CIRCUIT																														NOT SPECIFIED	NOT SPECIFIED
RS9113-N00-D1W-X68	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	79	XMA	RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED	54 Mbps	R-XXMA-N79		3.3 mm	16 mm		ALSO HAS BLUETOOTH DATA RATE= 1,2,3 Mbps and ZIGBEE DATA RATE= 250 kbps; ESD for WURX pin=1C				27 mm
RS9113-N00-D1W-X72	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	79	XMA	RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED	54 Mbps	R-XXMA-N79		3.3 mm	16 mm		ALSO HAS BLUETOOTH DATA RATE= 1,2,3 Mbps and ZIGBEE DATA RATE= 250 kbps; ESD for WURX pin=1C				27 mm
RS9113-N00-D1W-X74	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	79	XMA	RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED	54 Mbps	R-XXMA-N79		3.3 mm	16 mm		ALSO HAS BLUETOOTH DATA RATE= 1,2,3 Mbps and ZIGBEE DATA RATE= 250 kbps; ESD for WURX pin=1C				27 mm
SARA-U270-03S	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	BUTT	96		RECTANGULAR	UNSPECIFIED	YES	1				3.8 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-B96	4	3.25 mm	16 mm						26 mm
SI4313-B1-FMR	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V		CHIP CARRIER			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N20	1	.9 mm	4 mm	Not Qualified		e3	40	260	4 mm
SI4362-B1B-FMR	Silicon Labs	TELECOM CIRCUIT																														NOT SPECIFIED	NOT SPECIFIED
SIM7000E-N	Simcom Wireless Solutions	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	68	QMA	SQUARE	UNSPECIFIED	YES	1				3.8 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		QUAD	.066 Mbps	S-XQMA-N68
SL2S2102FUD,003	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	4	DIE	UNSPECIFIED	UNSPECIFIED	YES	1	CMOS					UNCASED CHIP				85 Cel	-40 Cel		UPPER		X-XUUC-N4							NOT SPECIFIED	NOT SPECIFIED
SX1303IMLTRT	Semtech	TELECOM CIRCUIT																				MATTE TIN				3					e3		260
TDK5100XUMA1	Infineon Technologies	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		.0095 mA	3 V	2.1/4	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	Other Telecom ICs	.65 mm	125 Cel	-40 Cel		DUAL		R-PDSO-G16	3	1.2 mm	4.4 mm	Not Qualified					5 mm
TDK5110XUMA1	Infineon Technologies	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	125 Cel	-40 Cel		DUAL		R-PDSO-G16	3	1.2 mm	4.4 mm	Not Qualified					5 mm
TLK2711JRGQE	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	BALL	80	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1				2.5 V	2.5	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA80,9X9,20	Other Telecom ICs	.5 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B80		1 mm	5 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	5 mm
TLK2711JRZQE	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	BALL	80	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1				2.5 V	2.5	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA80,9X9,20	Other Telecom ICs	.5 mm	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B80	3	1 mm	5 mm	Not Qualified		e1	30	260	5 mm
UCC3750DWG4	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			5 V		SMALL OUTLINE			1.27 mm	70 Cel	0 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G28	2	2.65 mm	7.5 mm	Not Qualified		e4	30	260	17.9 mm
WP3161D4NFEI-400B1	Microchip Technology	TELECOM CIRCUIT		BALL	672	BGA	SQUARE	PLASTIC/EPOXY	YES	1						GRID ARRAY							BOTTOM		S-PBGA-B672
XB3-24APS-J	Digi International	TELECOM CIRCUIT		UNSPECIFIED		XMA	RECTANGULAR	UNSPECIFIED	NO	1						SPECIAL SHAPE				85 Cel	-40 Cel		UNSPECIFIED	1 Mbps	R-XXMA-X
XM1100_1103874	Sierra Wireless	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	QMA	RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY			1.2 mm	85 Cel	-40 Cel		QUAD		R-XQMA-N20		2.3 mm	9 mm						9.5 mm
AD8285WBCPZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	72	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS	AEC-Q100		1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N72	3	.9 mm	10 mm			e3	30	260	10 mm
AP22814ASN-7	Diodes Incorporated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	HVSON	SQUARE	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		S-PDSO-N6		.63 mm	2 mm			e4	30	260	2 mm
AS3953B-BTWM	Ams Ag	TELECOM CIRCUIT
ATA8710-GHQW	Microchip Technology	TELECOM CIRCUIT		NO LEAD	32		SQUARE	UNSPECIFIED	YES	1				5 V			LCC32(UNSPEC)			85 Cel	-40 Cel		QUAD	.08 Mbps	S-XQCC-N32
ATSAMW25H18-MR210PB1954	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	51		RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY			1.2 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N51		2.138 mm	14.908 mm						33.864 mm
BGS15AN16E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel	TIN	QUAD		S-PQCC-N16	1	.77 mm	2.3 mm			e3			2.3 mm
BM23SPKA1NB9-0001AA	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	43	XMA	RECTANGULAR	UNSPECIFIED	YES	1				3.7 V		MICROELECTRONIC ASSEMBLY	MODULE,43LEAD(UNSPEC)		1.2 mm	70 Cel	-20 Cel		UNSPECIFIED		R-XXMA-N43		1.9 mm	15 mm						29 mm
CC2538NF53RTQT	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	56	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	12 Mbps	S-PQCC-N56	3	1 mm	8 mm			e4	30	260	8 mm
CC8520RHAR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	5 Mbps	S-PQCC-N40	3	1 mm	6 mm	Not Qualified		e4	NOT SPECIFIED	260	6 mm
CY7B933-JI	Cypress Semiconductor	TELECOM CIRCUIT	INDUSTRIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		160 mA	5 V	5	CHIP CARRIER	LDCC28,.5SQ	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	QUAD		S-PQCC-J28	3	4.572 mm	11.5316 mm	Not Qualified		e0			11.5316 mm
CY7B933-JIT	Cypress Semiconductor	TELECOM CIRCUIT	INDUSTRIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		160 mA	5 V	5	CHIP CARRIER	LDCC28,.5SQ	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	QUAD		S-PQCC-J28		4.572 mm	11.5316 mm	Not Qualified		e0			11.5316 mm
DA14583-01F01AT2	Dialog Semiconductor	TELECOM CIRCUIT																								3
DA14AVDDECTSF01	Renesas Electronics	TELECOM CIRCUIT
ENW89829A2KF	Panasonic	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	XMA	RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED	2.178 Mbps	R-XXMA-N24		2 mm	9 mm				50	250	9.5 mm
EYSLSNZWW	Taiyo Yuden	TELECOM CIRCUIT																														NOT SPECIFIED	NOT SPECIFIED
GS2988-INTE3	Semtech	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS			2.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N16	3	.9 mm	4 mm			e3		260	4 mm
GS2988-INTE3Z	Semtech	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS			2.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N16	3	.9 mm	4 mm			e3		260	4 mm
HMC-C200	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	UNSPECIFIED	5		RECTANGULAR	UNSPECIFIED	NO	1				6.5 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel	GOLD OVER NICKEL	UNSPECIFIED		R-XXMA-X5				Not Qualified		e4
HMC1094LP3E	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQCC-N16	1	1 mm	3 mm			e3	30	260	3 mm
HMC862ALP3E	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				5.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQCC-N16	3	1 mm	3 mm			e3	30	260	3 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.