Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Applications | Surface Mount | No. of Functions | Output Code | No. of Channels | Technology | Screening Level | Nominal Negative Supply Voltage | No. of Transceivers | Maximum Supply Current | Nominal Supply Voltage | Hybrid | Input Code | Power Supplies (V) | ISDN Access Rate | Package Style (Meter) | Package Equivalence Code | Sub-Category | Carrier Type-3 | Terminal Pitch | Maximum Operating Temperature | Resolution (um) | Battery Supply (V) | Minimum Output High Voltage | Maximum Output Low Voltage | Standard | Minimum Operating Temperature | Maximum Gain Tolerance | Terminal Finish | Maximum Output Voltage | Terminal Position | Data Rate | JESD-30 Code | Reference Point | Output (V) | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Linear Coding | Carrier Type-2 | Carrier Type-1 | Width | Qualification | Maximum Output Low Current | Companding Law | Input Type | Additional Features | Battery Feed | Maximum Analog Input | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Filter |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Silicon Labs |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
56 |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
UNSPECIFIED |
S-XXMA-N56 |
3 |
1.4 mm |
6.5 mm |
40 |
260 |
6.5 mm |
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|
Silicon Labs |
TELECOM CIRCUIT |
OTHER |
NO LEAD |
21 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
MICROELECTRONIC ASSEMBLY |
1.1 mm |
85 Cel |
-30 Cel |
UNSPECIFIED |
R-XXMA-N21 |
2.31 mm |
9.3 mm |
13.05 mm |
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|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3 V |
3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N32 |
3 |
.9 mm |
5 mm |
Not Qualified |
e4 |
30 |
260 |
5 mm |
||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-XQCC-N48 |
3 |
.9 mm |
7 mm |
Not Qualified |
e4 |
30 |
260 |
7 mm |
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|
Texas Instruments |
TELECOM CIRCUIT |
AUTOMOTIVE |
NO LEAD |
40 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N40 |
3 |
1 mm |
6 mm |
Not Qualified |
e4 |
30 |
260 |
6 mm |
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|
Panasonic |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
UNSPECIFIED |
2.178 Mbps |
R-XXMA-N24 |
2 mm |
9 mm |
40 |
250 |
9.5 mm |
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|
U-blox Ag |
TELECOM CIRCUIT |
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|
Microchip Technology |
TELECOM CIRCUIT |
INDUSTRIAL |
BALL |
289 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1.8 V |
GRID ARRAY |
BGA289,17X17,40 |
1 mm |
85 Cel |
-40 Cel |
BOTTOM |
100 Mbps |
S-PBGA-B289 |
2.36 mm |
19 mm |
19 mm |
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|
Quectel Wireless Solutions |
TELECOM CIRCUIT |
NO LEAD |
24 |
DMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
DUAL |
R-XDMA-N24 |
2.4 mm |
12.2 mm |
OPERATES FROM 2.8V TO 3.4V SUPPLY |
16 mm |
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|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
72 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
SILVER |
QUAD |
S-PQCC-N72 |
1 mm |
10 mm |
e4 |
10 mm |
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|
Silicon Labs |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
31 |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
1.2 mm |
85 Cel |
-40 Cel |
UNSPECIFIED |
.25 Mbps |
R-XXMA-N31 |
2.1 mm |
12.9 mm |
15 mm |
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|
Microchip Technology |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
40 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC40,.24SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQCC-N40 |
1 |
1 mm |
6 mm |
Not Qualified |
e3 |
260 |
6 mm |
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Microchip Technology |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
36 |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
TS 16949 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
DUAL |
R-XDMA-N36 |
2.7 mm |
21 mm |
31 mm |
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|
U-blox Ag |
TELECOM CIRCUIT |
4 |
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|
Texas Instruments |
TELECOM CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 |
5 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD SILVER |
DUAL |
S-PDSO-G8 |
2 |
1.1 mm |
3 mm |
Not Qualified |
e4 |
30 |
260 |
3 mm |
||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
OTHER |
1 |
70 Cel |
-25 Cel |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
OTHER |
1 |
70 Cel |
-25 Cel |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
TS 16949 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
GOLD OVER NICKEL |
UNSPECIFIED |
R-XXMA-N32 |
2.4 mm |
13.4 mm |
e4 |
25.8 mm |
||||||||||||||||||||||||||||||||||||||||||
Microchip Technology |
TELECOM CIRCUIT |
COMMERCIAL EXTENDED |
NO LEAD |
30 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
TS 16949 |
MICROELECTRONIC ASSEMBLY |
MODULE,30LEAD(UNSPEC) |
70 Cel |
-20 Cel |
UNSPECIFIED |
R-XXMA-N30 |
1.8 mm |
12 mm |
15 mm |
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Silicon Labs |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
79 |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
UNSPECIFIED |
54 Mbps |
R-XXMA-N79 |
3.3 mm |
16 mm |
ALSO HAS BLUETOOTH DATA RATE= 1,2,3 Mbps and ZIGBEE DATA RATE= 250 kbps |
27 mm |
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NXP Semiconductors |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
20 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3 V |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G20 |
1.5 mm |
4.4 mm |
Not Qualified |
6.5 mm |
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|
NXP Semiconductors |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
24 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G24 |
1 |
1.1 mm |
4.4 mm |
e4 |
30 |
260 |
7.8 mm |
||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N20 |
.9 mm |
3 mm |
3 mm |
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Pulse Electronics |
TELECOM CIRCUIT |
MILITARY |
GULL WING |
16 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
125 Cel |
-55 Cel |
DUAL |
R-PDMA-G16 |
3 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||
Wurth Elektronik |
TELECOM CIRCUIT |
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|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
BUTT |
3 |
TLGA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
1.8 V |
GRID ARRAY, THIN PROFILE |
1.22 mm |
85 Cel |
-40 Cel |
BOTTOM |
R-XBGA-B3 |
1.08 mm |
2.5 mm |
NOT SPECIFIED |
NOT SPECIFIED |
3.35 mm |
|||||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
31 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
MICROELECTRONIC ASSEMBLY |
1.25 mm |
85 Cel |
-40 Cel |
UNSPECIFIED |
R-XXMA-N31 |
2.3 mm |
12.05 mm |
18.1 mm |
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|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-XQCC-N48 |
3 |
.9 mm |
7 mm |
Not Qualified |
e4 |
30 |
260 |
7 mm |
||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
AUTOMOTIVE |
NO LEAD |
56 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
12 Mbps |
S-PQCC-N56 |
3 |
1 mm |
8 mm |
e4 |
30 |
260 |
8 mm |
|||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQCC-N32 |
1 |
1 mm |
5 mm |
e3 |
30 |
260 |
5 mm |
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|
Telit Communications Plc |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
QCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
1.8 V |
CHIP CARRIER |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N32 |
2.6 mm |
11 mm |
NOT SPECIFIED |
NOT SPECIFIED |
11 mm |
||||||||||||||||||||||||||||||||||||||||||
|
Telit Communications Plc |
TELECOM CIRCUIT |
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|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
12 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
SMALL OUTLINE |
.45 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
S-PDSO-N12 |
1 |
.8 mm |
3 mm |
Not Qualified |
e3 |
30 |
260 |
3 mm |
||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
72 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQCC-N72 |
1 |
1 mm |
10 mm |
30 |
260 |
10 mm |
|||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
OTHER |
1 |
70 Cel |
-25 Cel |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
TELECOM CIRCUIT |
OTHER |
1 |
85 Cel |
-25 Cel |
1 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
TELECOM CIRCUIT |
OTHER |
1 |
85 Cel |
-25 Cel |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
24 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BIPOLAR |
.01 mA |
3 V |
3/5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP24,.25 |
Other Telecom ICs |
.65 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G24 |
1.1 mm |
4.4 mm |
Not Qualified |
40 |
260 |
7.8 mm |
||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
24 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G24 |
1.1 mm |
4.4 mm |
Not Qualified |
7.8 mm |
|||||||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
TELECOM CIRCUIT |
COMMERCIAL EXTENDED |
NO LEAD |
48 |
QCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
1.2 V |
CHIP CARRIER |
75 Cel |
-10 Cel |
MATTE TIN |
QUAD |
S-XQCC-N48 |
2 |
e3 |
40 |
260 |
|||||||||||||||||||||||||||||||||||||||||
Simcom Wireless Solutions |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
68 |
QMA |
SQUARE |
UNSPECIFIED |
YES |
1 |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
QUAD |
7.2 Mbps |
S-XQMA-N68 |
Operates with 3.4V TO 4.4V supply |
|||||||||||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
TELECOM CIRCUIT |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Digi International |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
37 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
UNSPECIFIED |
R-XXMA-N37 |
|||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
TELECOM CIRCUIT |
OTHER |
NO LEAD |
100 |
LGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
GRID ARRAY |
.7 mm |
70 Cel |
-20 Cel |
BOTTOM |
R-PBGA-N100 |
2 mm |
13.3 mm |
13.4 mm |
|||||||||||||||||||||||||||||||||||||||||||||
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3 V |
3/5 |
SMALL OUTLINE |
SOP28,.4 |
Codecs |
1.27 mm |
85 Cel |
-40 Cel |
1.2 dB |
TIN LEAD |
DUAL |
R-PDSO-G28 |
3 |
2.65 mm |
16-BIT |
7.5 mm |
Not Qualified |
e0 |
240 |
17.9 mm |
YES |
||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
S-PDSO-G8 |
1 |
1.1 mm |
3 mm |
Not Qualified |
e3 |
30 |
260 |
3 mm |
|||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
64 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC64,.35SQ,20 |
Modems |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N64 |
3 |
1 mm |
9 mm |
Not Qualified |
e3 |
260 |
9 mm |
||||||||||||||||||||||||||||||||||
|
Atmel |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.65 mm |
105 Cel |
-40 Cel |
QUAD |
S-XQCC-N24 |
1 mm |
5 mm |
Not Qualified |
5 mm |
Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.
Some common types of Other Function Telecom Interface ICs include:
1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.
2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.
3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.
4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.