TELECOM CIRCUIT Other Function Telecom Interface ICs 2,400+

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
MGM12P22F1024GA-V2	Silicon Labs	TELECOM CIRCUIT
MRF24WG0MB-I/RM10C	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36		RECTANGULAR	UNSPECIFIED	NO	1		TS 16949		3.3 V		MICROELECTRONIC ASSEMBLY			1.27 mm	85 Cel	-40 Cel		DUAL		R-XDMA-N36		2.7 mm	21 mm					31 mm
NCV7428D13R2G	Onsemi	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100		12 V		SMALL OUTLINE			1.27 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G8	2	1.72 mm	3.937 mm		e3	30	260	4.927 mm
NEO-M8L-03A	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24		RECTANGULAR	UNSPECIFIED	NO	1		AEC-Q100		3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		DUAL		R-XDMA-N24						NOT SPECIFIED	NOT SPECIFIED
NEO-M8L-05B	U-blox Ag	TELECOM CIRCUIT
PN5180A0HN/C3Y	NXP Semiconductors	TELECOM CIRCUIT																				NICKEL PALLADIUM GOLD				3				e4	30	260
SIM28ML	Simcom Wireless Solutions	TELECOM CIRCUIT
WGM110E1MV2R	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40		RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY			1.25 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N40		2.1 mm	14.4 mm					21 mm
WT11U-A-AI4	Silicon Labs	TELECOM CIRCUIT		NO LEAD	28	DMA	RECTANGULAR	UNSPECIFIED	NO	1	CMOS			3.3 V		MICROELECTRONIC ASSEMBLY			1.5 mm	85 Cel	-40 Cel		DUAL	3 Mbps	R-XDMA-N28		2.7 mm	14.5 mm					35.75 mm
XE1205I074TRLF	Semtech	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS		.075 mA	3.3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	Matte Tin (Sn)	QUAD		S-XQCC-N48		.9 mm	8 mm	Not Qualified	e3			8 mm
XR2211ACD-F	Exar	TELECOM CIRCUIT	COMMERCIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		.009 mA	12 V	12	SMALL OUTLINE	SOP14,.25	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	MATTE TIN	DUAL		R-PDSO-G14	2	1.75 mm	3.9 mm	Not Qualified	e3			8.65 mm
ZGM130S037HGN2	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	64	QCCN	SQUARE		YES					1.8 V		CHIP CARRIER	LCC64,.35SQ,20		.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N64	3	1.3 mm	9 mm			40	260	9 mm
450-0064R	Ls Research	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	52		RECTANGULAR	UNSPECIFIED	YES	1				3.6 V		MICROELECTRONIC ASSEMBLY			1 mm	85 Cel	-40 Cel		QUAD		R-XQMA-N52	4	1.9 mm	13 mm					18 mm
AD73311ARZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G20	1	2.65 mm	7.5 mm	Not Qualified	e3	30	260	12.8 mm
AD73311ARZ-REEL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G20	1	2.65 mm	7.5 mm	Not Qualified	e3	30	260	12.8 mm
AD73311LARS	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		.0125 mA	3 V	3	SMALL OUTLINE, SHRINK PITCH	SSOP20,.3	Modems	.65 mm	105 Cel	-40 Cel	Tin/Lead (Sn85Pb15)	DUAL		R-PDSO-G20	1	2 mm	5.3 mm	Not Qualified	e0	30	240	7.2 mm
AD73311LARSZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		.0125 mA	3 V	3	SMALL OUTLINE, SHRINK PITCH	SSOP20,.3	Modems	.65 mm	105 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G20	1	2 mm	5.3 mm	Not Qualified	e3		260	7.2 mm
AD73311LARSZ-REEL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		.0125 mA	3 V	3	SMALL OUTLINE, SHRINK PITCH	SSOP20,.3	Modems	.65 mm	105 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G20	1	2 mm	5.3 mm	Not Qualified	e3	40	260	7.2 mm
AD8015ARZ-REEL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			26 mA	5 V		SMALL OUTLINE				85 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G8				Not Qualified	e3
ADRF6850BCPZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		.44 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD		S-XQCC-N56	3	1 mm	8 mm	Not Qualified	e3			8 mm
ADRV9003BBCZ-RL	Analog Devices	TELECOM CIRCUIT																													NOT SPECIFIED	NOT SPECIFIED
ATA5745-PXPW	Atmel	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1			.01 mA	3 V	3,5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.2SQ,25	Other Telecom ICs	.65 mm	105 Cel	-40 Cel		QUAD		S-XQCC-N24		1 mm	5 mm	Not Qualified				5 mm
ATA8401C-6AQY66	Atmel	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1			11.6 mA	3 V	3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19	Other Telecom ICs	.65 mm	85 Cel	-40 Cel		DUAL		S-PDSO-G8		1.05 mm	3 mm	Not Qualified				3 mm
ATA8401C-6AQY-66	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1			.0116 mA	3 V	3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19	Other Telecom ICs	.65 mm	85 Cel	-55 Cel	MATTE TIN	DUAL		S-PDSO-G8		1.05 mm	3 mm	Not Qualified	e3			3 mm
AWL9966RS36P8	Ii-vi	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N24	2	.6 mm	4 mm	Not Qualified				4 mm
BGM113A256V1	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36		RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY			.8 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N36		2.09 mm	9.15 mm					15.73 mm
BGS13PN10E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BUTT	10	BCC	RECTANGULAR	UNSPECIFIED	YES	1	CMOS			2.85 V		CHIP CARRIER			.4 mm	85 Cel	-40 Cel	TIN	BOTTOM		R-XBCC-B10	1	.4 mm	1.1 mm		e3			1.5 mm
BGS13S2N9E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BALL	9	VFBGA	SQUARE	UNSPECIFIED	YES	1	MOS			3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel	TIN	BOTTOM		S-XBGA-B9	1	.4 mm	1.1 mm		e3			1.1 mm
BM78SPPS5MC2-0004AA	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	YES	1				1.9 V		MICROELECTRONIC ASSEMBLY	MODULE,33LEAD(UNSPEC)		1.1 mm	70 Cel	-20 Cel	GOLD OVER NICKEL	UNSPECIFIED		R-XXMA-N33		2.46 mm	12 mm		e4	40	255	22 mm
BTM431	Laird Technologies	TELECOM CIRCUIT	INDUSTRIAL	UNSPECIFIED			RECTANGULAR	UNSPECIFIED	NO	1						MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-X						NOT SPECIFIED	NOT SPECIFIED
CSR1013A05-IUUM-R	Qualcomm	TELECOM CIRCUIT
DS2409P+T&R	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	C BEND	6	SOC	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-C6	1	1.5 mm	3.76 mm	Not Qualified	e3	30	260	3.94 mm
DS2409P/T&R	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	C BEND	6	SOC	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel	TIN LEAD	DUAL		R-PDSO-C6	1	1.5 mm	3.76 mm	Not Qualified	e0			3.94 mm
EFR32BG13P532F512GM48-B	Silicon Labs	TELECOM CIRCUIT
EFR32BG21A010F512IM32-B	Silicon Labs	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.16SQ,16		.4 mm	125 Cel	-40 Cel	MATTE TIN	QUAD	2 Mbps	S-XQCC-N32	2	.9 mm	4 mm		e3	40	260	4 mm
EYSGJNAWY-VX	Taiyo Yuden	TELECOM CIRCUIT																													NOT SPECIFIED	NOT SPECIFIED
EYSLCNZWW	Taiyo Yuden	TELECOM CIRCUIT																													NOT SPECIFIED	NOT SPECIFIED
FIDO2100BGA128IR0	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	128	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B128		1.3 mm	10 mm			NOT SPECIFIED	NOT SPECIFIED	10 mm
HMC1023LP5E	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQCC-N32	1	1 mm	5 mm		e3	30	260	5 mm
MAX-8Q	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	18	SON	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100; TS 16949		3 V		SMALL OUTLINE				85 Cel	-40 Cel		DUAL		R-PDSO-N18						NOT SPECIFIED	NOT SPECIFIED
MAX9152ESE	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		.07 mA	3.3 V	3.3	SMALL OUTLINE	SOP16,.25	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	DUAL		R-PDSO-G16	1	1.75 mm	3.9 mm	Not Qualified	e0			9.9 mm
MAX9152ESE+	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3.3 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL		R-PDSO-G16	1	1.75 mm	3.9 mm	Not Qualified	e3	30	260	9.9 mm
MAYA-W276-00B	U-blox Ag	TELECOM CIRCUIT																								4
MFRC63002HN,118	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-25 Cel		QUAD		S-PQCC-N32	1	1 mm	5 mm			30	260	5 mm
MLX90109EDC-AAA-000-TU	Melexis N V	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G8	1	1.72 mm	3.9 mm		e3		260	4.9 mm
PN7161A1HN/C100Y	NXP Semiconductors	TELECOM CIRCUIT																								3					NOT SPECIFIED	260
RN41N-I/RM477	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	35		RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel	MATTE TIN	QUAD		R-XQMA-N35		2.2 mm	13.2 mm		e3			20.1 mm
RN42N-I/RM477	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32		RECTANGULAR	UNSPECIFIED	YES	1		TS 16949		3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel	GOLD OVER NICKEL	UNSPECIFIED		R-XXMA-N32		2.4 mm	13.4 mm		e4			20.5 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.