TELECOM CIRCUIT Other Function Telecom Interface ICs 2,400+

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Maximum Gain Tolerance	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Linear Coding	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Filter
SX1250IMLTRT	Semtech	TELECOM CIRCUIT																				MATTE TIN				1						e3		260
AD8314ARMZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		MATTE TIN	DUAL		S-PDSO-G8	1	1.1 mm		3 mm	Not Qualified		e3		260	3 mm
ADTR1107ACCZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	TFLGA	SQUARE	UNSPECIFIED	YES	1			5 V		GRID ARRAY, THIN PROFILE, FINE PITCH	LCC24,.2SQ,25		.65 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	BOTTOM		S-XBGA-N24	3	1.13 mm		5 mm			e4		260	5 mm
BGM240PA22VNA3R	Silicon Labs	TELECOM CIRCUIT
CC3135MODRNMMOBR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BUTT	63	XMA	RECTANGULAR	UNSPECIFIED	YES	1			3.3 V		MICROELECTRONIC ASSEMBLY			1.27 mm	85 Cel	-40 Cel		NICKEL GOLD	QUAD		R-XQMA-B63	3	2.4 mm		17.5 mm			e4	30	260	20.5 mm
CC430F6137IRGCT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	64	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1			2.2 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD SILVER	QUAD	.25 Mbps	S-PQCC-N64	3	1 mm		9 mm	Not Qualified		e4	30	260	9 mm
EC21AFA-512-STD	Quectel Wireless Solutions	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD		QMA	RECTANGULAR	UNSPECIFIED	YES	1			3.8 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel			QUAD		R-XQMA-N		2.4 mm		29 mm		SEATED HEIGHT NOM				32 mm
LBEE5KL1YN-814	Murata Manufacturing	TELECOM CIRCUIT
MAX7042ATJ	Analog Devices	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS	.0086 mA	3 V	3/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	125 Cel	-40 Cel		TIN LEAD	QUAD		S-XQCC-N32	1	.8 mm		5 mm	Not Qualified		e0			5 mm
MAX7042ATJ+	Analog Devices	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS	.0092 mA	3 V	3/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	125 Cel	-40 Cel		Matte Tin (Sn) - annealed	QUAD		S-XQCC-N32	1	.8 mm		5 mm	Not Qualified		e3	30	260	5 mm
MGM12P32F1024GA-V4R	Silicon Labs	TELECOM CIRCUIT		UNSPECIFIED		XMA	RECTANGULAR	UNSPECIFIED	NO	1			3.3 V		SPECIAL SHAPE				85 Cel	-40 Cel			UNSPECIFIED	1 Mbps	R-XXMA-X				12.9 mm						17.8 mm
RN4870-I/RM128	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	NO	1			3.3 V		MICROELECTRONIC ASSEMBLY	MODULE,33LEAD(UNSPEC)		1.1 mm	85 Cel	-40 Cel			UNSPECIFIED	.01 Mbps	R-XXMA-N33		2.46 mm		12 mm						22 mm
SA616DK/01	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel			DUAL		R-PDSO-G20		1.5 mm		4.4 mm	Not Qualified					6.5 mm
SE2431L-R	Skyworks Solutions	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	RECTANGULAR	UNSPECIFIED	YES	1			3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.12X.16,16	Other Telecom ICs	.4 mm	85 Cel	-40 Cel			QUAD		R-XQCC-N24	1	.9 mm		3 mm	Not Qualified				260	4 mm
SKY66111-11	Skyworks Solutions	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	RECTANGULAR	UNSPECIFIED	YES	1			3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.25 mm	85 Cel	-40 Cel			QUAD		R-XQCC-N20	3	.9 mm		3 mm					260	3.3 mm
SL2S2002FTB	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	3	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				SMALL OUTLINE, VERY THIN PROFILE			.55 mm	85 Cel	-40 Cel		TIN	DUAL		R-PDSO-N3	1	.5 mm		1 mm	Not Qualified		e3	30	260	1.45 mm
UJA1023T/2R04/C,512	NXP Semiconductors	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					SMALL OUTLINE			1.27 mm	125 Cel	-40 Cel			DUAL		R-PDSO-G16		1.75 mm		3.9 mm						9.9 mm
XB3-24ARM	Digi International	TELECOM CIRCUIT		UNSPECIFIED		XMA	RECTANGULAR	UNSPECIFIED	NO	1					SPECIAL SHAPE				85 Cel	-40 Cel			UNSPECIFIED	1 Mbps	R-XXMA-X
XB3-24AUT	Digi International	TELECOM CIRCUIT		UNSPECIFIED		XMA	RECTANGULAR	UNSPECIFIED	NO	1					SPECIAL SHAPE				85 Cel	-40 Cel			UNSPECIFIED	1 Mbps	R-XXMA-X
XCC3135MODRNMMOBR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	63	QCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V		CHIP CARRIER			1.27 mm	85 Cel	-40 Cel			QUAD		R-PQCC-N63		2.45 mm		17.5 mm						20.5 mm
XCC3235MODSM2MOBR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	63	QCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V		CHIP CARRIER			1.27 mm	85 Cel	-40 Cel			QUAD		R-PQCC-N63		2.45 mm		17.5 mm						20.5 mm
ADL5391ACPZ-R7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BIPOLAR		5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		MATTE TIN	QUAD		S-XQCC-N16	3	.9 mm		3 mm	Not Qualified		e3	30	260	3 mm
ATA8510-GHQW	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1		.046 mA	3 V	2/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		MATTE TIN	QUAD	.08 Mbps	S-XQCC-N32		.9 mm		5 mm	Not Qualified		e3			5 mm
BGM240PB32VNN3R	Silicon Labs	TELECOM CIRCUIT
BM832	Fanstel	TELECOM CIRCUIT		NO LEAD	47	LGA	RECTANGULAR	UNSPECIFIED	YES	1					GRID ARRAY				85 Cel	-40 Cel			BOTTOM	8 Mbps	R-XLGA-N47		1.95 mm		10.2 mm						15 mm
LBEE5XV1YM-574	Murata Manufacturing	TELECOM CIRCUIT
LMX9838SBX	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	70	LGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	.065 mA	3.3 V	3.3	GRID ARRAY	LGA70(UNSPEC)	Other Telecom ICs	1 mm	85 Cel	-40 Cel			BOTTOM		R-PBGA-N70	4	2.1 mm		10 mm	Not Qualified			30	250	17 mm
LNBH26LPQR	STMicroelectronics	TELECOM CIRCUIT	OTHER	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1			12 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	0 Cel			QUAD		S-XQCC-N24		1 mm		4 mm				NOT SPECIFIED	NOT SPECIFIED	4 mm
MGM240SD22VNA2R	Silicon Labs	TELECOM CIRCUIT
PN5190B1EV/C121E	NXP Semiconductors	TELECOM CIRCUIT																								3								260
SARA-U201-04B	U-blox Ag	TELECOM CIRCUIT
ATA8210-GHQW	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	85 Cel	-40 Cel		MATTE TIN	QUAD	.08 Mbps	S-XQCC-N32		.9 mm		5 mm			e3			5 mm
ATA8215-GHQW	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	85 Cel	-40 Cel		MATTE TIN	QUAD	.08 Mbps	S-XQCC-N32		.9 mm		5 mm			e3			5 mm
GS2988-INE3	Semtech	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS		2.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel		Matte Tin (Sn)	QUAD		S-XQCC-N16	3	.9 mm		4 mm			e3	40	260	4 mm
LMX9838SB	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	70	LGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V		GRID ARRAY			1 mm	85 Cel	-40 Cel		TIN LEAD	BOTTOM		R-PBGA-N70		2.1 mm		10 mm	Not Qualified		e0			17 mm
LTC5596IDC#PBF	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel		Matte Tin (Sn) - annealed	DUAL		S-PDSO-N8	1	.8 mm		2 mm			e3			2 mm
MGC3030-I/SS	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V		SMALL OUTLINE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		MATTE TIN	DUAL		R-PDSO-G28	2	2 mm		5.3 mm			e3	40	260	10.2 mm
SI32170-C-GM1R	Silicon Labs	TELECOM CIRCUIT
SI4461-C2A-GM	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL
SIM900B	Simcom Wireless Solutions	TELECOM CIRCUIT	INDUSTRIAL	UNSPECIFIED	60	XMA	RECTANGULAR	UNSPECIFIED	NO	1					MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel			UNSPECIFIED	.0856 Mbps	R-XXMA-X60						Operates with 3.2-4.8 V supply
WF111-A-V1-ETSI	Silicon Labs	TELECOM CIRCUIT
XB3-24Z8US	Digi International	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	37		RECTANGULAR	UNSPECIFIED	YES	1					MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel			UNSPECIFIED		R-XXMA-N37
AD73311ARS-REEL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		3 V	3/5	SMALL OUTLINE, SHRINK PITCH	SSOP20,.3	Codecs	.65 mm	85 Cel	-40 Cel	1 dB	TIN LEAD	DUAL		R-PDSO-G20	1	2 mm	16-BIT	5.3 mm	Not Qualified		e0		240	7.2 mm	YES
ATA8404C-6DQY-66	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20		.5 mm	50 Cel	0 Cel		MATTE TIN	DUAL		S-PDSO-G10	2	1.1 mm		3 mm			e3	40	260	3 mm
BB-485LDRC9	Advantech	TELECOM CIRCUIT		UNSPECIFIED		XMA	UNSPECIFIED	PLASTIC/EPOXY	NO	1					MICROELECTRONIC ASSEMBLY				80 Cel	-40 Cel			UNSPECIFIED	.1152 Mbps	X-PXMA-X		78.8 mm		25.1 mm						95.2 mm
BGM240PB22VNA3R	Silicon Labs	TELECOM CIRCUIT
EFR32BG13P732F512GM48-B	Silicon Labs	TELECOM CIRCUIT
EYAGJNZXX	Taiyo Yuden	TELECOM CIRCUIT	COMMERCIAL EXTENDED	NO LEAD	28		RECTANGULAR	UNSPECIFIED	YES	1			3 V		MICROELECTRONIC ASSEMBLY			.4 mm	75 Cel	-25 Cel			UNSPECIFIED		R-XXMA-N28		1.5 mm		5.1 mm				NOT SPECIFIED	NOT SPECIFIED	11.3 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.