TELECOM CIRCUIT Other Function Telecom Interface ICs 2,400+

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

BGS16GA14E6327XTSA1

Infineon Technologies

TELECOM CIRCUIT

OTHER

NO LEAD

14

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.4 mm

85 Cel

-30 Cel

BOTTOM

S-PBCC-N14

1

.65 mm

2 mm

2 mm

BGSA11GN10E6327XTSA1

Infineon Technologies

TELECOM CIRCUIT

OTHER

BUTT

10

BCC

RECTANGULAR

UNSPECIFIED

YES

1

2.85 V

CHIP CARRIER

.4 mm

85 Cel

-30 Cel

BOTTOM

R-XBCC-B10

1

.4 mm

1.1 mm

1.5 mm

BGX220S22HNA21R

Silicon Labs

TELECOM CIRCUIT

NO LEAD

44

XMA

SQUARE

UNSPECIFIED

YES

1

3 V

MICROELECTRONIC ASSEMBLY

.5 mm

105 Cel

-40 Cel

UNSPECIFIED

2 Mbps

S-XXMA-N44

1.28 mm

6 mm

6 mm

BM70BLE01FC2-0B05BA

Microchip Technology

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

30

XMA

RECTANGULAR

UNSPECIFIED

YES

1

TS 16949

3 V

MICROELECTRONIC ASSEMBLY

MODULE,30LEAD(UNSPEC)

1.1 mm

85 Cel

-40 Cel

Nickel/Gold (Ni/Au)

UNSPECIFIED

.0086 Mbps

R-XXMA-N30

1.66 mm

12 mm

e4

15 mm

CY7C924ADX-AXC

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL

GULL WING

100

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

.25 mA

5 V

5

FLATPACK, LOW PROFILE, FINE PITCH

QFP100,.63SQ,20

Other Telecom ICs

.5 mm

70 Cel

0 Cel

MATTE TIN

QUAD

S-PQFP-G100

3

1.6 mm

14 mm

Not Qualified

e3

30

260

14 mm

LTC5551IUF#TRPBF

Analog Devices

TELECOM CIRCUIT

NO LEAD

16

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.65 mm

MATTE TIN

QUAD

S-PQCC-N16

1

.8 mm

4 mm

e3

30

260

4 mm

MICRF005BM

Microchip Technology

TELECOM CIRCUIT

PI3EQX1001XUAEX

Diodes Incorporated

TELECOM CIRCUIT

COMMERCIAL

NO LEAD

18

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.4 mm

70 Cel

0 Cel

QUAD

S-XQCC-N18

.4 mm

2 mm

NOT SPECIFIED

NOT SPECIFIED

2 mm

PI3EQX1004ZHEX

Diodes Incorporated

TELECOM CIRCUIT

COMMERCIAL

NO LEAD

42

HVQCCN

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

70 Cel

0 Cel

QUAD

R-XQCC-N42

.84 mm

3.5 mm

NOT SPECIFIED

NOT SPECIFIED

9 mm

RC1180-MBUS3

Radiocrafts As

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

30

RECTANGULAR

UNSPECIFIED

YES

1

3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

QUAD

R-XQMA-N30

3.3 mm

12.7 mm

25.4 mm

RI-I02-112A-03

Texas Instruments

TELECOM CIRCUIT

OTHER

UNSPECIFIED

UNSPECIFIED

1

70 Cel

-25 Cel

NOT SPECIFIED

NOT SPECIFIED

RI-I02-112B-03

Texas Instruments

TELECOM CIRCUIT

OTHER

UNSPECIFIED

UNSPECIFIED

1

70 Cel

-25 Cel

NOT SPECIFIED

NOT SPECIFIED

RI-I11-112B-03

Texas Instruments

TELECOM CIRCUIT

OTHER

1

70 Cel

-25 Cel

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

RI-I17-114A-01

Texas Instruments

TELECOM CIRCUIT

OTHER

1

70 Cel

-25 Cel

NOT SPECIFIED

NOT SPECIFIED

RTL8139DL-LF

Realtek Semiconductor

TELECOM CIRCUIT

COMMERCIAL

GULL WING

100

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

2.5 V

FLATPACK, LOW PROFILE, FINE PITCH

.5 mm

70 Cel

0 Cel

QUAD

S-PQFP-G100

1.7 mm

14 mm

NOT SPECIFIED

NOT SPECIFIED

14 mm

SA639DH

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

24

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

.01 mA

3 V

3/5

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP24,.25

Other Telecom ICs

.65 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G24

1.1 mm

4.4 mm

Not Qualified

40

260

7.8 mm

SI2166-D60-GM

Silicon Labs

TELECOM CIRCUIT

COMMERCIAL EXTENDED

NO LEAD

48

HQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

1.2 V

CHIP CARRIER, HEAT SINK/SLUG

75 Cel

-10 Cel

QUAD

S-XQCC-N48

SKY13473-569LF

Skyworks Solutions

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

20

HVQCCN

SQUARE

UNSPECIFIED

YES

1

2.85 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.4 mm

90 Cel

-40 Cel

QUAD

S-XQCC-N20

.8 mm

2.4 mm

NOT SPECIFIED

NOT SPECIFIED

2.4 mm

SPWF04SA

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

30

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

1.524 mm

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N30

2.3 mm

15.24 mm

NOT SPECIFIED

NOT SPECIFIED

26.924 mm

XB24CZ7PIS-004

Digi International

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N

NOT SPECIFIED

NOT SPECIFIED

AMMP-6532-TR2G

Broadcom

TELECOM CIRCUIT

BUTT

8

BCC

SQUARE

UNSPECIFIED

YES

1

3 V

CHIP CARRIER

NICKEL GOLD

BOTTOM

S-XBCC-B8

3

2.25 mm

5.215 mm

Not Qualified

e4

20

260

5.215 mm

BGM111E256V2

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

BUTT

31

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

1.2 mm

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-B31

2.15 mm

12.9 mm

15 mm

BGSA13GN10E6327XTSA1

Infineon Technologies

TELECOM CIRCUIT

OTHER

NO LEAD

10

VQCCN

RECTANGULAR

UNSPECIFIED

YES

1

2.85 V

CHIP CARRIER, VERY THIN PROFILE

.4 mm

85 Cel

-30 Cel

BOTTOM

R-XBCC-N10

1

.4 mm

1.1 mm

1.5 mm

BGX13P22GA-V31R

Silicon Labs

TELECOM CIRCUIT

BLE121LR-A-M256K

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

36

RECTANGULAR

UNSPECIFIED

YES

1

3 V

MICROELECTRONIC ASSEMBLY

.9 mm

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N36

1.8 mm

13 mm

14.7 mm

BM23SPKS1NB9-0001AA

Microchip Technology

TELECOM CIRCUIT

COMMERCIAL

NO LEAD

43

XMA

RECTANGULAR

UNSPECIFIED

YES

1

3.7 V

MICROELECTRONIC ASSEMBLY

MODULE,43LEAD(UNSPEC)

1.2 mm

70 Cel

-20 Cel

UNSPECIFIED

R-XXMA-N43

1.9 mm

15 mm

29 mm

BT900-SA-03

Laird Technologies

TELECOM CIRCUIT

INDUSTRIAL

UNSPECIFIED

47

RECTANGULAR

UNSPECIFIED

NO

1

3.3 V

MICROELECTRONIC ASSEMBLY

.8 mm

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-X47

2.4 mm

12.5 mm

NOT SPECIFIED

NOT SPECIFIED

19 mm

EMMY-W161-00B

U-blox Ag

TELECOM CIRCUIT

INDUSTRIAL

BUTT

46

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

QUAD

R-XQMA-B46

13.8 mm

40

245

19.8 mm

ESP32-WROVER-B(M213DH6464PH3Q0)

Espressif Systems (Shanghai)

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

39

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

1.27 mm

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N39

3.4 mm

18 mm

NOT SPECIFIED

NOT SPECIFIED

31.4 mm

IDT82V3010PVG8

Renesas Electronics

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

56

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.3 V

SMALL OUTLINE, SHRINK PITCH

.635 mm

85 Cel

-40 Cel

Matte Tin (Sn) - annealed

DUAL

R-PDSO-G56

1

2.794 mm

7.493 mm

Not Qualified

e3

30

260

18.415 mm

MLX90109CDC-AAA-000-TU

Melexis N V

TELECOM CIRCUIT

COMMERCIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE

1.27 mm

70 Cel

0 Cel

MATTE TIN

DUAL

R-PDSO-G8

1

1.72 mm

3.9 mm

e3

260

4.9 mm

NRF24LE1-F16Q48-R7

Nordic Semiconductor Asa

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC48,.28SQ,20

.5 mm

85 Cel

-40 Cel

QUAD

2 Mbps

S-XQCC-N48

.9 mm

7 mm

7 mm

OL2381AHN/C0B,515

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

.0012 mA

2.7 V

2.7

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

Other Telecom ICs

.5 mm

85 Cel

-25 Cel

QUAD

S-PQCC-N32

2A

.85 mm

5 mm

Not Qualified

260

5 mm

RFFC2071TR7

Qorvo

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N32

1 mm

5 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

5 mm

RTL8139DL

Realtek Semiconductor

TELECOM CIRCUIT

COMMERCIAL

GULL WING

100

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

2.5 V

FLATPACK, LOW PROFILE, FINE PITCH

.5 mm

70 Cel

0 Cel

QUAD

S-PQFP-G100

1.7 mm

14 mm

NOT SPECIFIED

NOT SPECIFIED

14 mm

RTL8139DL-GR

Realtek Semiconductor

TELECOM CIRCUIT

COMMERCIAL

GULL WING

100

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

2.5 V

FLATPACK, LOW PROFILE, FINE PITCH

.5 mm

70 Cel

0 Cel

QUAD

S-PQFP-G100

1.7 mm

14 mm

NOT SPECIFIED

NOT SPECIFIED

14 mm

RYZ012A100FZ00#BD0

Renesas Electronics

TELECOM CIRCUIT

TIN LEAD

3

e0

245

SI32391-B-GM

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N48

.9 mm

7 mm

NOT SPECIFIED

NOT SPECIFIED

7 mm

SI4010-C2-GS

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

SMALL OUTLINE

1.27 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G14

3

2 mm

3.9 mm

Not Qualified

e3

40

260

8.65 mm

SL869L-V2

Telit Communications Plc

TELECOM CIRCUIT

STA8090GATR

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

56

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

1.2 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N56

3

.9 mm

8 mm

e3

250

8 mm

80HCPS1432CHMGI

Renesas Electronics

TELECOM CIRCUIT

INDUSTRIAL

BALL

576

BGA

SQUARE

PLASTIC/EPOXY

YES

1

1 V

GRID ARRAY

1 mm

85 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

S-PBGA-B576

4

2.83 mm

25 mm

e1

NOT SPECIFIED

245

25 mm

AD73311AR-REEL

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

20

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

3 V

3/5

SMALL OUTLINE

SOP20,.4

Codecs

1.27 mm

85 Cel

-40 Cel

1 dB

Tin/Lead (Sn85Pb15)

DUAL

R-PDSO-G20

1

2.65 mm

16-BIT

7.5 mm

Not Qualified

e0

30

240

12.8 mm

YES

AD9864BCPZRL

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC48,.27SQ,20

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

.02 Mbps

S-XQCC-N48

3

1 mm

7 mm

e3

30

260

7 mm

AFE4300PNR

Texas Instruments

TELECOM CIRCUIT

COMMERCIAL

GULL WING

80

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

BINARY/TWOS COMP

2

.00097 mA

3.3 V

3

FLATPACK, LOW PROFILE, FINE PITCH

QFP80,.55SQ,20

Codecs

.5 mm

70 Cel

16

0 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQFP-G80

VOLTAGE

3

1.6 mm

12 mm

Not Qualified

DIFFERENTIAL

3.4 V

e4

30

260

12 mm

BGM121A256V1

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

56

SQUARE

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

S-XXMA-N56

1.4 mm

6.5 mm

6.5 mm

BGM121A256V1R

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

56

SQUARE

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

S-XXMA-N56

1.4 mm

6.5 mm

6.5 mm

BGM13S22F512GA-V2

Silicon Labs

TELECOM CIRCUIT

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.