TELECOM CIRCUIT Other Function Telecom Interface ICs 2,400+

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
IA3223-C-FUR	Silicon Labs	TELECOM CIRCUIT	OTHER	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		SMALL OUTLINE, SHRINK PITCH			.635 mm	85 Cel	-25 Cel		DUAL		R-PDSO-G16		1.7272 mm	3.8989 mm				NOT SPECIFIED	NOT SPECIFIED	4.8895 mm
IC880A-SPI	Imst	TELECOM CIRCUIT		NO LEAD	26	QMA	RECTANGULAR	UNSPECIFIED	YES					5 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		QUAD		R-XQMA-N26			67.3 mm						79.8 mm
JODY-W263-00A	U-blox Ag	TELECOM CIRCUIT
LBEE5CJ1XK-687	Murata Manufacturing	TELECOM CIRCUIT		NO LEAD	81	XMA	RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED	54 Mbps	R-XXMA-N81		1.345 mm	8.3 mm						9.1 mm
LM3290TME/NOPB	Texas Instruments	TELECOM CIRCUIT	OTHER	BALL	30	VFBGA	RECTANGULAR	UNSPECIFIED	YES	1						GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel	TIN SILVER COPPER	BOTTOM		R-XBGA-B30	1	.675 mm				e1	30	260
LMX8410RGZT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	QUAD		S-PQCC-N48	3	1 mm	7 mm			e4	30	260	7 mm
LNBH26SPQR	STMicroelectronics	TELECOM CIRCUIT	OTHER	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1				12 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	0 Cel		QUAD		S-XQCC-N24	1	1 mm	4 mm						4 mm
LTC5586IUH#PBF	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel	MATTE TIN	QUAD		S-PQCC-N32		.8 mm	6 mm			e3			6 mm
LTC5587IDD#TRPBF	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	12	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.3 V		SMALL OUTLINE			.45 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL		S-PDSO-N12	1	.8 mm	3 mm	Not Qualified		e3	30	260	3 mm
LXMS31ACNA-010	Murata Manufacturing	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	2	QCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1						CHIP CARRIER				85 Cel	-40 Cel		BOTTOM		R-PBCC-N2		.7 mm	1.6 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	3.2 mm
MAX1472AKA-T	Maxim Integrated	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	8	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		.0164 mA	2.7 V	2.7	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	TSSOP8,.1	Other Telecom ICs	.65 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G8	1	1.45 mm	1.625 mm	Not Qualified		e4		245	2.9 mm
MAX1472AKA+T	Analog Devices	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	8	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		.0166 mA	2.7 V	2.7	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	TSSOP8,.1	Other Telecom ICs	.65 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G8	1	1.45 mm	1.625 mm	Not Qualified		e4	30	260	2.9 mm
MAX3120ESA	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel	TIN LEAD	DUAL		R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified		e0			4.9 mm
MAX3120ESA+	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL		R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified		e3	30	260	4.9 mm
MAX9152EUE	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		.07 mA	3.3 V	3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL		R-PDSO-G16	1	1.1 mm	4.4 mm	Not Qualified		e0			5 mm
MAX9152EUE+	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL		R-PDSO-G16	1	1.1 mm	4.4 mm	Not Qualified		e3	30	260	5 mm
MC100SX1230FN	Onsemi	TELECOM CIRCUIT	OTHER	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR			5 V	-4.2/-5.46	CHIP CARRIER	LDCC28,.5SQ	Network Interfaces	1.27 mm	85 Cel	0 Cel	TIN LEAD	QUAD		S-PQCC-J28		4.57 mm	11.505 mm	Not Qualified		e0		235	11.505 mm
MD0100DK6-G	Microchip Technology	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1		TS 16949				SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.16SQ,40		1 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-N8		1 mm	4 mm			e3			4 mm
MDBT42Q-512K	Raytac	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	41		RECTANGULAR	UNSPECIFIED	YES	1				3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N41		2.2 mm	10 mm						16 mm
MGM12P32F1024GE-V4	Silicon Labs	TELECOM CIRCUIT		UNSPECIFIED		XMA	RECTANGULAR	UNSPECIFIED	NO	1				3.3 V		SPECIAL SHAPE				85 Cel	-40 Cel		UNSPECIFIED	1 Mbps	R-XXMA-X			12.9 mm						17.8 mm
MICRF230YQS	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE, SHRINK PITCH	SSOP16,.25		.635 mm	105 Cel	-40 Cel	MATTE TIN	DUAL	.02 Mbps	R-PDSO-G16		1.75 mm	3.91 mm			e3			4.9 mm
NEO-7P-0	U-blox Ag	TELECOM CIRCUIT
NINA-B302-00B-00	U-blox Ag	TELECOM CIRCUIT																								4
NINA-B416-01B	U-blox Ag	TELECOM CIRCUIT
NRF24LE1-F16Q32-T	Nordic Semiconductor Asa	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	85 Cel	-40 Cel		QUAD	2 Mbps	S-XQCC-N32		.9 mm	5 mm						5 mm
QN9021/DY	NXP Semiconductors	TELECOM CIRCUIT																								3							260
RF37S114HTFJB	Texas Instruments	TELECOM CIRCUIT	OTHER	UNSPECIFIED			SQUARE	UNSPECIFIED	YES	1						MICROELECTRONIC ASSEMBLY				70 Cel	-25 Cel		UNSPECIFIED		S-XXMA-X	1	.76 mm	4 mm		SEATED HT-CALCULATED			260	4 mm
RF430CL331HIRGTR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	.848 Mbps	S-PQCC-N16	2	1 mm	3 mm			e4	30	260	3 mm
RS9113-N00-S0W-X78	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	101	XMA	RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED	54 Mbps	R-XXMA-N101		2.3 mm	14 mm		ALSO HAS BLUETOOTH DATA RATE= 1,2,3 Mbps and ZIGBEE DATA RATE= 250 kbps; ESD for WURX pin=1C				15 mm
SA616BS,115	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N20	1	1 mm	4 mm				30	260	4 mm
SE2436L-R	Skyworks Solutions	TELECOM CIRCUIT		NO LEAD	24	QCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1						CHIP CARRIER							QUAD		R-PQCC-N24							NOT SPECIFIED	NOT SPECIFIED
SI4438-B1C-FMR	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N20	1	.9 mm	4 mm			e3	40	260	4 mm
SI4744-C10-GMR	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N24	2	.9 mm	4 mm			e3	40	260	4 mm
SI4777-A20-GMR	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N40		.9 mm	6 mm				NOT SPECIFIED	NOT SPECIFIED	6 mm
SN65DSI85ZQE	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	64	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B64		1 mm	5 mm						5 mm
SN761633RTAR	Texas Instruments	TELECOM CIRCUIT	OTHER	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-20 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N40	2	.8 mm	6 mm	Not Qualified		e4	30	260	6 mm
ST60-2230C-UU	Laird Technologies	TELECOM CIRCUIT
STS1TXQTR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N20		1 mm	4 mm				NOT SPECIFIED	NOT SPECIFIED	4 mm
TDA7116F	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR		.021 mA	3 V	2.1/4	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		DUAL		S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified				260	3 mm
TDA7116FXT	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	85 Cel	-40 Cel		DUAL		S-PDSO-G10		1.1 mm	3 mm				NOT SPECIFIED	NOT SPECIFIED	3 mm
TFF11145HN/N1,118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N24	1	1 mm	4 mm					260	4 mm
TRF3722IRGZT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N48	2	1 mm	7 mm			e4	30	260	7 mm
TRF7970ATB	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL							1				5 V						110 Cel	-40 Cel
VSC8491YJU-13	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	1				1 V		GRID ARRAY, LOW PROFILE			1 mm	110 Cel	-40 Cel		BOTTOM		S-PBGA-B196		1.4 mm	15 mm						15 mm
WP3160W6NFEI-320B1	Microchip Technology	TELECOM CIRCUIT		BALL	672	BGA	SQUARE	PLASTIC/EPOXY	YES	1						GRID ARRAY							BOTTOM		S-PBGA-B672
WP3161W6NFEI-320B1	Microchip Technology	TELECOM CIRCUIT		BALL	672	BGA	SQUARE	PLASTIC/EPOXY	YES	1						GRID ARRAY							BOTTOM		S-PBGA-B672
XB24CZ7PIT-004	Digi International	TELECOM CIRCUIT
090-02789-001	Microchip Technology	TELECOM CIRCUIT		PIN/PEG	9	DMA	RECTANGULAR	UNSPECIFIED	NO	1				3.3 V		MICROELECTRONIC ASSEMBLY			5.1 mm	65 Cel	-10 Cel		DUAL		R-XDMA-P9		11.68 mm	35.3 mm						40.64 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.