TELECOM CIRCUIT Other Function Telecom Interface ICs 2,400+

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

CYBLE-212019-00

Cypress Semiconductor

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

31

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

1.27 mm

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N31

2 mm

14.52 mm

NOT SPECIFIED

NOT SPECIFIED

19.2 mm

CYBLE-212023-10

Cypress Semiconductor

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

31

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

1.27 mm

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N31

2 mm

14.52 mm

NOT SPECIFIED

NOT SPECIFIED

19.2 mm

CYW43364KUBGT

Infineon Technologies

TELECOM CIRCUIT

OTHER

BALL

74

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

1.2 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

70 Cel

-30 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B74

1

.55 mm

2.87 mm

e1

4.87 mm

EMMY-W163-00B

U-blox Ag

TELECOM CIRCUIT

INDUSTRIAL

BUTT

46

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

QUAD

R-XQMA-B46

13.8 mm

40

245

19.8 mm

ENW89823A2KF

Panasonic

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

24

XMA

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

2.178 Mbps

R-XXMA-N24

2 mm

9 mm

50

250

9.5 mm

ENW89835A3KF

Panasonic

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N

2 mm

8.7 mm

10

250

15.6 mm

EQCO31R20.3

Microchip Technology

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

UNSPECIFIED

YES

1

1.2 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.65 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-XQCC-N16

1

.9 mm

4 mm

e4

30

260

4 mm

ESP8285N08

Espressif Systems (Shanghai)

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

.5 mm

85 Cel

-40 Cel

TIN

QUAD

72.2 Mbps

S-XQCC-N32

3

.9 mm

5 mm

e3

30

250

5 mm

HMC625BLP5ETR

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQCC-N32

3

1 mm

5 mm

e3

30

260

5 mm

HT2MOA4S20/E/3/RJ

NXP Semiconductors

TELECOM CIRCUIT

PLASTIC/EPOXY

HYBRID

MICROELECTRONIC ASSEMBLY

MODULE(UNSPEC)

Other Telecom ICs

SILVER

Not Qualified

e4

IC1003

Rf Monolithics

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

64

TFQFP

RECTANGULAR

PLASTIC/EPOXY

YES

1

FLATPACK, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

QUAD

R-PQFP-G64

1

1.2 mm

10 mm

Not Qualified

260

10 mm

IPJ-P6005-X2BT

Impinj

TELECOM CIRCUIT

OTHER

NO LEAD

8

VQCCN

SQUARE

UNSPECIFIED

YES

1

1.6 V

CHIP CARRIER, VERY THIN PROFILE

LCC8,0.079,25

.9 mm

95 Cel

-25 Cel

QUAD

.4 Mbps

S-XQCC-N8

1

.35 mm

2 mm

30

260

2 mm

ISL32273EIVZ-T

Renesas Electronics

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

16

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BICMOS

3.3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G16

2

1.2 mm

4.4 mm

e3

30

260

5 mm

LBEE5PK2AE-564

Murata Manufacturing

TELECOM CIRCUIT

LE866-SV1

Telit Communications Plc

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

LGA

RECTANGULAR

UNSPECIFIED

YES

1

3.8 V

GRID ARRAY

85 Cel

-40 Cel

BOTTOM

R-XBGA-N

2.2 mm

15 mm

25 mm

LE910-EUV2

Telit Communications Plc

TELECOM CIRCUIT

LEA-6H-0

U-blox Ag

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

28

RECTANGULAR

UNSPECIFIED

NO

1

AEC-Q100

3 V

MICROELECTRONIC ASSEMBLY

1.1 mm

85 Cel

-40 Cel

DUAL

R-XDMA-N28

2.7 mm

17 mm

NOT SPECIFIED

NOT SPECIFIED

22.4 mm

LEA-6S-0

U-blox Ag

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

28

SON

RECTANGULAR

PLASTIC/EPOXY

YES

1

AEC-Q100; TS 16949

3 V

SMALL OUTLINE

85 Cel

-40 Cel

DUAL

R-PDSO-N28

LEA-6T-0

U-blox Ag

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

28

SON

RECTANGULAR

PLASTIC/EPOXY

YES

1

AEC-Q100; TS 16949

3 V

SMALL OUTLINE

85 Cel

-40 Cel

DUAL

R-PDSO-N28

LPR2400

Rf Monolithics

TELECOM CIRCUIT

INDUSTRIAL

UNSPECIFIED

36

RECTANGULAR

UNSPECIFIED

NO

1

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

DUAL

R-XDMA-X36

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

LPR2400ERA

Rf Monolithics

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

36

RECTANGULAR

UNSPECIFIED

YES

1

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

QUAD

R-XQMA-N36

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

LTC5589IUF#PBF

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC24,.16SQ,20

.5 mm

105 Cel

-40 Cel

MATTE TIN

QUAD

R-PQCC-N24

.8 mm

6 mm

e3

6 mm

MAX2510EEI

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

28

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

25 mA

3 V

3/5

SMALL OUTLINE, SHRINK PITCH

SSOP28,.25

Other Telecom ICs

.635 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

R-PDSO-G28

1

1.75 mm

3.9 mm

Not Qualified

e0

9.89 mm

MAX2510EEI+

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

28

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

25 mA

3 V

SMALL OUTLINE, SHRINK PITCH

.635 mm

85 Cel

-40 Cel

Matte Tin (Sn) - annealed

DUAL

R-PDSO-G28

1

1.75 mm

3.9 mm

Not Qualified

e3

30

260

9.89 mm

MAX7037EGL+

Analog Devices

TELECOM CIRCUIT

NICKEL GOLD PALLADIUM

1

30

260

MAX7060ATG/V+

Maxim Integrated

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

2.7 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

125 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N24

1

.8 mm

4 mm

Not Qualified

e3

30

260

4 mm

MFRC53101T/0FE

NXP Semiconductors

TELECOM CIRCUIT

OTHER

GULL WING

32

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE

1.27 mm

85 Cel

-25 Cel

DUAL

R-PDSO-G32

2.65 mm

7.5 mm

Not Qualified

20.5 mm

MGM240PA32VNN3R

Silicon Labs

TELECOM CIRCUIT

MRF24J40-I/MLVAO

Microchip Technology

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

40

VQCCN

SQUARE

PLASTIC/EPOXY

YES

1

AEC-Q100

3.3 V

CHIP CARRIER, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-PQCC-N40

1 mm

6 mm

6 mm

MRF24WG0MART-I/RM

Microchip Technology

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

36

RECTANGULAR

UNSPECIFIED

NO

1

TS 16949

3.3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

DUAL

R-XDMA-N36

2.7 mm

21 mm

31 mm

NEO-6Q-0-001

U-blox Ag

TELECOM CIRCUIT

4

NEO-7M-0-000

U-blox Ag

TELECOM CIRCUIT

NINA-B112-02B

U-blox Ag

TELECOM CIRCUIT

4

NINA-B302-00B

U-blox Ag

TELECOM CIRCUIT

NINA-B312-00B

U-blox Ag

TELECOM CIRCUIT

NINA-B316-01B

U-blox Ag

TELECOM CIRCUIT

NINA-W132-04B

U-blox Ag

TELECOM CIRCUIT

NJG1157PCD-TE1

New Japan Radio

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

10

DMA

SQUARE

UNSPECIFIED

YES

1

1.8 V

MICROELECTRONIC ASSEMBLY

.5 mm

105 Cel

-40 Cel

DUAL

S-XDMA-N10

.63 mm

2.5 mm

HEAT SINK AVAILABLE

2.5 mm

NJG1159PHH-TE1

New Japan Radio

TELECOM CIRCUIT

NL7512DVH-500HE

Broadcom

TELECOM CIRCUIT

ONET8501VRGPT

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

20

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

90 mA

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

QUAD

11300 Mbps

S-PQCC-N20

3

1 mm

4 mm

Not Qualified

e4

NOT SPECIFIED

260

4 mm

OPA2381AIDGKTG4

Texas Instruments

TELECOM CIRCUIT

AUTOMOTIVE

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

1

.0011 mA

5 V

3/5

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP8,.19

Other Telecom ICs

.65 mm

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

S-PDSO-G8

2

1.1 mm

3 mm

Not Qualified

e4

30

260

3 mm

OPA381AIDGKT

Texas Instruments

TELECOM CIRCUIT

AUTOMOTIVE

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

1

1

5 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD SILVER

DUAL

S-PDSO-G8

2

1.1 mm

3 mm

Not Qualified

e4

30

260

3 mm

P9038-RNDGI

Renesas Electronics

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

56

HVQCCN

SQUARE

UNSPECIFIED

YES

1

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.4 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N56

3

1 mm

7 mm

e3

260

7 mm

P9038-RNDGI8

Renesas Electronics

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

56

HVQCCN

SQUARE

UNSPECIFIED

YES

1

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.4 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N56

3

1 mm

7 mm

e3

260

7 mm

PE42423B-Z

Psemi

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

16

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

125 Cel

-40 Cel

QUAD

S-XQCC-N16

3

.9 mm

3 mm

3 mm

PE42540E-Z

Psemi

TELECOM CIRCUIT

NOT SPECIFIED

NOT SPECIFIED

PN5180A0HN/C4E

NXP Semiconductors

TELECOM CIRCUIT

NICKEL PALLADIUM GOLD

3

e4

30

260

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.