Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Applications | Surface Mount | No. of Functions | Output Code | No. of Channels | Technology | Screening Level | Nominal Negative Supply Voltage | No. of Transceivers | Maximum Supply Current | Nominal Supply Voltage | Hybrid | Input Code | Power Supplies (V) | ISDN Access Rate | Package Style (Meter) | Package Equivalence Code | Sub-Category | Carrier Type-3 | Terminal Pitch | Maximum Operating Temperature | Resolution (um) | Battery Supply (V) | Minimum Output High Voltage | Maximum Output Low Voltage | Standard | Minimum Operating Temperature | Maximum Gain Tolerance | Terminal Finish | Maximum Output Voltage | Terminal Position | Data Rate | JESD-30 Code | Reference Point | Output (V) | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Linear Coding | Carrier Type-2 | Carrier Type-1 | Width | Qualification | Maximum Output Low Current | Companding Law | Input Type | Additional Features | Battery Feed | Maximum Analog Input | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Filter |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Cypress Semiconductor |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
31 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
1.27 mm |
85 Cel |
-40 Cel |
UNSPECIFIED |
R-XXMA-N31 |
2 mm |
14.52 mm |
NOT SPECIFIED |
NOT SPECIFIED |
19.2 mm |
||||||||||||||||||||||||||||||||||||||||||
|
Cypress Semiconductor |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
31 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
1.27 mm |
85 Cel |
-40 Cel |
UNSPECIFIED |
R-XXMA-N31 |
2 mm |
14.52 mm |
NOT SPECIFIED |
NOT SPECIFIED |
19.2 mm |
||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
TELECOM CIRCUIT |
OTHER |
BALL |
74 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1.2 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
70 Cel |
-30 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B74 |
1 |
.55 mm |
2.87 mm |
e1 |
4.87 mm |
||||||||||||||||||||||||||||||||||||||||
|
U-blox Ag |
TELECOM CIRCUIT |
INDUSTRIAL |
BUTT |
46 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
QUAD |
R-XQMA-B46 |
13.8 mm |
40 |
245 |
19.8 mm |
||||||||||||||||||||||||||||||||||||||||||||
|
Panasonic |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
UNSPECIFIED |
2.178 Mbps |
R-XXMA-N24 |
2 mm |
9 mm |
50 |
250 |
9.5 mm |
|||||||||||||||||||||||||||||||||||||||||
|
Panasonic |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
UNSPECIFIED |
R-XXMA-N |
2 mm |
8.7 mm |
10 |
250 |
15.6 mm |
||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
1.2 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.65 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-XQCC-N16 |
1 |
.9 mm |
4 mm |
e4 |
30 |
260 |
4 mm |
||||||||||||||||||||||||||||||||||||||
|
Espressif Systems (Shanghai) |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
.5 mm |
85 Cel |
-40 Cel |
TIN |
QUAD |
72.2 Mbps |
S-XQCC-N32 |
3 |
.9 mm |
5 mm |
e3 |
30 |
250 |
5 mm |
||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQCC-N32 |
3 |
1 mm |
5 mm |
e3 |
30 |
260 |
5 mm |
||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
TELECOM CIRCUIT |
PLASTIC/EPOXY |
HYBRID |
MICROELECTRONIC ASSEMBLY |
MODULE(UNSPEC) |
Other Telecom ICs |
SILVER |
Not Qualified |
e4 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Rf Monolithics |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
64 |
TFQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
FLATPACK, THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
R-PQFP-G64 |
1 |
1.2 mm |
10 mm |
Not Qualified |
260 |
10 mm |
|||||||||||||||||||||||||||||||||||||||||
|
Impinj |
TELECOM CIRCUIT |
OTHER |
NO LEAD |
8 |
VQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
1.6 V |
CHIP CARRIER, VERY THIN PROFILE |
LCC8,0.079,25 |
.9 mm |
95 Cel |
-25 Cel |
QUAD |
.4 Mbps |
S-XQCC-N8 |
1 |
.35 mm |
2 mm |
30 |
260 |
2 mm |
||||||||||||||||||||||||||||||||||||||
|
Renesas Electronics |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
16 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
3.3 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G16 |
2 |
1.2 mm |
4.4 mm |
e3 |
30 |
260 |
5 mm |
|||||||||||||||||||||||||||||||||||||
Murata Manufacturing |
TELECOM CIRCUIT |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Telit Communications Plc |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
LGA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.8 V |
GRID ARRAY |
85 Cel |
-40 Cel |
BOTTOM |
R-XBGA-N |
2.2 mm |
15 mm |
25 mm |
||||||||||||||||||||||||||||||||||||||||||||||
|
Telit Communications Plc |
TELECOM CIRCUIT |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
U-blox Ag |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
28 |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
AEC-Q100 |
3 V |
MICROELECTRONIC ASSEMBLY |
1.1 mm |
85 Cel |
-40 Cel |
DUAL |
R-XDMA-N28 |
2.7 mm |
17 mm |
NOT SPECIFIED |
NOT SPECIFIED |
22.4 mm |
|||||||||||||||||||||||||||||||||||||||||
|
U-blox Ag |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
28 |
SON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100; TS 16949 |
3 V |
SMALL OUTLINE |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-N28 |
||||||||||||||||||||||||||||||||||||||||||||||
|
U-blox Ag |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
28 |
SON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100; TS 16949 |
3 V |
SMALL OUTLINE |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-N28 |
||||||||||||||||||||||||||||||||||||||||||||||
|
Rf Monolithics |
TELECOM CIRCUIT |
INDUSTRIAL |
UNSPECIFIED |
36 |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
DUAL |
R-XDMA-X36 |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||||||||||||||||||||||||||
|
Rf Monolithics |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
36 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
QUAD |
R-XQMA-N36 |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
.5 mm |
105 Cel |
-40 Cel |
MATTE TIN |
QUAD |
R-PQCC-N24 |
.8 mm |
6 mm |
e3 |
6 mm |
||||||||||||||||||||||||||||||||||||||||
Maxim Integrated |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
28 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BIPOLAR |
25 mA |
3 V |
3/5 |
SMALL OUTLINE, SHRINK PITCH |
SSOP28,.25 |
Other Telecom ICs |
.635 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G28 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e0 |
9.89 mm |
|||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
28 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
25 mA |
3 V |
SMALL OUTLINE, SHRINK PITCH |
.635 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G28 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e3 |
30 |
260 |
9.89 mm |
||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
NICKEL GOLD PALLADIUM |
1 |
30 |
260 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Maxim Integrated |
TELECOM CIRCUIT |
AUTOMOTIVE |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
2.7 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
125 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N24 |
1 |
.8 mm |
4 mm |
Not Qualified |
e3 |
30 |
260 |
4 mm |
||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
TELECOM CIRCUIT |
OTHER |
GULL WING |
32 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE |
1.27 mm |
85 Cel |
-25 Cel |
DUAL |
R-PDSO-G32 |
2.65 mm |
7.5 mm |
Not Qualified |
20.5 mm |
|||||||||||||||||||||||||||||||||||||||||||
Silicon Labs |
TELECOM CIRCUIT |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Microchip Technology |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
40 |
VQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
3.3 V |
CHIP CARRIER, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQCC-N40 |
1 mm |
6 mm |
6 mm |
|||||||||||||||||||||||||||||||||||||||||||
Microchip Technology |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
36 |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
TS 16949 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
DUAL |
R-XDMA-N36 |
2.7 mm |
21 mm |
31 mm |
|||||||||||||||||||||||||||||||||||||||||||||
|
U-blox Ag |
TELECOM CIRCUIT |
4 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
U-blox Ag |
TELECOM CIRCUIT |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
U-blox Ag |
TELECOM CIRCUIT |
4 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
U-blox Ag |
TELECOM CIRCUIT |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
U-blox Ag |
TELECOM CIRCUIT |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
U-blox Ag |
TELECOM CIRCUIT |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
U-blox Ag |
TELECOM CIRCUIT |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
New Japan Radio |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
10 |
DMA |
SQUARE |
UNSPECIFIED |
YES |
1 |
1.8 V |
MICROELECTRONIC ASSEMBLY |
.5 mm |
105 Cel |
-40 Cel |
DUAL |
S-XDMA-N10 |
.63 mm |
2.5 mm |
HEAT SINK AVAILABLE |
2.5 mm |
||||||||||||||||||||||||||||||||||||||||||
New Japan Radio |
TELECOM CIRCUIT |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Broadcom |
TELECOM CIRCUIT |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
90 mA |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
11300 Mbps |
S-PQCC-N20 |
3 |
1 mm |
4 mm |
Not Qualified |
e4 |
NOT SPECIFIED |
260 |
4 mm |
|||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
.0011 mA |
5 V |
3/5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Other Telecom ICs |
.65 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
S-PDSO-G8 |
2 |
1.1 mm |
3 mm |
Not Qualified |
e4 |
30 |
260 |
3 mm |
|||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 |
5 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD SILVER |
DUAL |
S-PDSO-G8 |
2 |
1.1 mm |
3 mm |
Not Qualified |
e4 |
30 |
260 |
3 mm |
||||||||||||||||||||||||||||||||||||
|
Renesas Electronics |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
56 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.4 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N56 |
3 |
1 mm |
7 mm |
e3 |
260 |
7 mm |
|||||||||||||||||||||||||||||||||||||||
|
Renesas Electronics |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
56 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.4 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N56 |
3 |
1 mm |
7 mm |
e3 |
260 |
7 mm |
|||||||||||||||||||||||||||||||||||||||
|
Psemi |
TELECOM CIRCUIT |
AUTOMOTIVE |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
125 Cel |
-40 Cel |
QUAD |
S-XQCC-N16 |
3 |
.9 mm |
3 mm |
3 mm |
|||||||||||||||||||||||||||||||||||||||||
|
Psemi |
TELECOM CIRCUIT |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
TELECOM CIRCUIT |
NICKEL PALLADIUM GOLD |
3 |
e4 |
30 |
260 |
Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.
Some common types of Other Function Telecom Interface ICs include:
1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.
2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.
3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.
4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.