Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Applications | Surface Mount | No. of Functions | Output Code | No. of Channels | Technology | Screening Level | Nominal Negative Supply Voltage | No. of Transceivers | Maximum Supply Current | Nominal Supply Voltage | Hybrid | Input Code | Power Supplies (V) | ISDN Access Rate | Package Style (Meter) | Package Equivalence Code | Sub-Category | Carrier Type-3 | Terminal Pitch | Maximum Operating Temperature | Resolution (um) | Battery Supply (V) | Minimum Output High Voltage | Maximum Output Low Voltage | Standard | Minimum Operating Temperature | Maximum Gain Tolerance | Terminal Finish | Maximum Output Voltage | Terminal Position | Data Rate | JESD-30 Code | Reference Point | Output (V) | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Linear Coding | Carrier Type-2 | Carrier Type-1 | Width | Qualification | Maximum Output Low Current | Companding Law | Input Type | Additional Features | Battery Feed | Maximum Analog Input | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Filter |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Silicon Labs |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
79 |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
UNSPECIFIED |
54 Mbps |
R-XXMA-N79 |
3.3 mm |
16 mm |
ALSO HAS BLUETOOTH DATA RATE= 1,2,3 Mbps and ZIGBEE DATA RATE= 250 kbps |
27 mm |
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|
NXP Semiconductors |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
20 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3 V |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G20 |
1.5 mm |
4.4 mm |
Not Qualified |
40 |
260 |
6.5 mm |
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NXP Semiconductors |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
20 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3 V |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G20 |
1.5 mm |
4.4 mm |
Not Qualified |
40 |
260 |
6.5 mm |
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|
U-blox Ag |
TELECOM CIRCUIT |
4 |
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|
NXP Semiconductors |
TELECOM CIRCUIT |
NICKEL PALLADIUM GOLD SILVER |
2 |
e4 |
30 |
260 |
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|
STMicroelectronics |
TELECOM CIRCUIT |
NOT SPECIFIED |
NOT SPECIFIED |
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STMicroelectronics |
TELECOM CIRCUIT |
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|
STMicroelectronics |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
QCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CHIP CARRIER |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N |
NOT SPECIFIED |
NOT SPECIFIED |
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|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
28 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
2.7 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G28 |
1 |
1.2 mm |
4.4 mm |
Not Qualified |
SINGLE-ENDED |
e4 |
30 |
260 |
9.7 mm |
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|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
5 V |
SMALL OUTLINE |
1.27 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G28 |
2.65 mm |
7.5 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
17.9 mm |
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|
Silicon Labs |
TELECOM CIRCUIT |
NO LEAD |
52 |
LGA |
SQUARE |
UNSPECIFIED |
YES |
1 |
1.8 V |
GRID ARRAY |
LGA52(UNSPEC) |
.5 mm |
105 Cel |
-40 Cel |
BOTTOM |
72.2 Mbps |
S-XLGA-N52 |
3 |
1.4 mm |
6.5 mm |
40 |
260 |
6.5 mm |
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Texas Instruments |
TELECOM CIRCUIT |
OTHER |
BALL |
130 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3.7 V |
GRID ARRAY |
70 Cel |
-20 Cel |
BOTTOM |
R-PBGA-B130 |
2 mm |
13.3 mm |
13.4 mm |
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|
Silicon Labs |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
28 |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
1.5 mm |
85 Cel |
-40 Cel |
DUAL |
R-XDMA-N28 |
2.86 mm |
14.5 mm |
35.75 mm |
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|
Taiyo Yuden |
TELECOM CIRCUIT |
1 |
3.3 V |
NOT SPECIFIED |
NOT SPECIFIED |
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Digi International |
TELECOM CIRCUIT |
UNSPECIFIED |
XMA |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
SPECIAL SHAPE |
85 Cel |
-40 Cel |
UNSPECIFIED |
1 Mbps |
R-XXMA-X |
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|
Digi International |
TELECOM CIRCUIT |
NO LEAD |
37 |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
UNSPECIFIED |
.25 Mbps |
R-XXMA-N37 |
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Atmel |
TELECOM CIRCUIT |
AUTOMOTIVE |
GULL WING |
10 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.5 mm |
125 Cel |
-40 Cel |
DUAL |
S-PDSO-G10 |
1.1 mm |
3 mm |
3 mm |
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|
Microchip Technology |
TELECOM CIRCUIT |
AUTOMOTIVE |
GULL WING |
10 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP10,.19,20 |
.5 mm |
125 Cel |
-40 Cel |
MATTE TIN |
DUAL |
.04 Mbps |
S-PDSO-G10 |
2 |
1.1 mm |
3 mm |
e3 |
40 |
260 |
3 mm |
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Microchip Technology |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
49 |
HLGA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
TS 16949 |
3.6 V |
GRID ARRAY, HEAT SINK/SLUG |
85 Cel |
-40 Cel |
BOTTOM |
R-XBGA-N49 |
1.4 mm |
4.5 mm |
5.5 mm |
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|
Texas Instruments |
TELECOM CIRCUIT |
AUTOMOTIVE |
NO LEAD |
40 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N40 |
3 |
1 mm |
6 mm |
Not Qualified |
e4 |
30 |
260 |
6 mm |
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|
Qualcomm |
TELECOM CIRCUIT |
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|
Silicon Labs |
TELECOM CIRCUIT |
NOT SPECIFIED |
NOT SPECIFIED |
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Zarlink Semiconductor |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
48 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3 V |
3/5 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP48,.35SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-PQFP-G48 |
3 |
1.6 mm |
7 mm |
Not Qualified |
e0 |
260 |
7 mm |
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|
Renesas Electronics |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
3.3 V |
SMALL OUTLINE |
1.27 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G16 |
3 |
1.75 mm |
3.9 mm |
e3 |
30 |
260 |
9.9 mm |
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|
Microchip Technology |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
40 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC40,.24SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQCC-N40 |
1 |
1 mm |
6 mm |
Not Qualified |
e3 |
40 |
260 |
6 mm |
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|
Skyworks Solutions |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
4 V |
4 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N24 |
1 |
.9 mm |
4 mm |
Not Qualified |
e4 |
260 |
4 mm |
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|
Digi International |
TELECOM CIRCUIT |
UNSPECIFIED |
XMA |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
SPECIAL SHAPE |
85 Cel |
-40 Cel |
UNSPECIFIED |
1 Mbps |
R-XXMA-X |
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|
Digi International |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
34 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
UNSPECIFIED |
R-XXMA-N34 |
13 mm |
19 mm |
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|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
64 |
HVFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 |
2.5 V |
2.5 |
FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH |
TQFP64,.47SQ |
Network Interfaces |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
2500 Mbps |
S-PQFP-G64 |
3 |
1 mm |
10 mm |
Not Qualified |
e4 |
30 |
260 |
10 mm |
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Silicon Labs |
TELECOM CIRCUIT |
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|
Skyworks Solutions |
TELECOM CIRCUIT |
NICKEL PALLADIUM GOLD |
3 |
e4 |
260 |
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|
Infineon Technologies |
TELECOM CIRCUIT |
OTHER |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
1.2 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
.5 mm |
85 Cel |
-30 Cel |
PURE TIN |
QUAD |
S-XQCC-N32 |
3 |
1 mm |
5 mm |
5 mm |
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|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
BALL |
6 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
3 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA6,2X3,16 |
.4 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B6 |
1 |
.56 mm |
.79 mm |
e1 |
30 |
260 |
1.19 mm |
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Microchip Technology |
TELECOM CIRCUIT |
BALL |
1932 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
GRID ARRAY |
BOTTOM |
S-PBGA-B1932 |
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|
Infineon Technologies |
TELECOM CIRCUIT |
COMMERCIAL |
GULL WING |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
.155 mA |
5 V |
5 |
SMALL OUTLINE |
SOP28,.4 |
Other Telecom ICs |
1.27 mm |
70 Cel |
0 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
400 Mbps |
R-PDSO-G28 |
3 |
2.67 mm |
7.505 mm |
Not Qualified |
e4 |
20 |
260 |
17.905 mm |
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|
Infineon Technologies |
TELECOM CIRCUIT |
BALL |
140 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1.2 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA140,11X13,16 |
.4 mm |
85 Cel |
-30 Cel |
BOTTOM |
433.3 Mbps |
R-PBGA-B140 |
1 |
.6 mm |
4.47 mm |
5.27 mm |
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|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQCC-N32 |
1 |
.8 mm |
5 mm |
Not Qualified |
e3 |
30 |
260 |
5 mm |
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|
Skyworks Solutions |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N20 |
.9 mm |
4 mm |
NOT SPECIFIED |
NOT SPECIFIED |
4 mm |
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|
Skyworks Solutions |
TELECOM CIRCUIT |
INDUSTRIAL |
NOT SPECIFIED |
NOT SPECIFIED |
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|
Silicon Labs |
TELECOM CIRCUIT |
UNSPECIFIED |
XMA |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
3.3 V |
SPECIAL SHAPE |
85 Cel |
-40 Cel |
UNSPECIFIED |
1 Mbps |
R-XXMA-X |
12.9 mm |
17.8 mm |
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|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
28 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
5 V |
SMALL OUTLINE, SHRINK PITCH |
.65 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G28 |
3 |
2 mm |
5.3 mm |
Not Qualified |
e3 |
260 |
10.2 mm |
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Silicon Labs |
TELECOM CIRCUIT |
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|
Skyworks Solutions |
TELECOM CIRCUIT |
NO LEAD |
16 |
QCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CHIP CARRIER |
QUAD |
S-XQCC-N16 |
NOT SPECIFIED |
NOT SPECIFIED |
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|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
48 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3 V |
FLATPACK, LOW PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G48 |
3 |
1.6 mm |
7 mm |
Not Qualified |
e3 |
30 |
260 |
7 mm |
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|
ROHM |
TELECOM CIRCUIT |
COPPER NICKEL GOLD |
e4 |
40 |
255 |
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Silicon Labs |
TELECOM CIRCUIT |
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|
Silicon Labs |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
11 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N11 |
1 mm |
3 mm |
3 mm |
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|
Murata Manufacturing |
TELECOM CIRCUIT |
OTHER |
UNSPECIFIED |
16 |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
5 V |
MICROELECTRONIC ASSEMBLY |
70 Cel |
-40 Cel |
UNSPECIFIED |
R-XXMA-X16 |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.
Some common types of Other Function Telecom Interface ICs include:
1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.
2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.
3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.
4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.