TELECOM CIRCUIT Other Function Telecom Interface ICs 2,400+

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

RS9113-NB0-D1W

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

79

XMA

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

54 Mbps

R-XXMA-N79

3.3 mm

16 mm

ALSO HAS BLUETOOTH DATA RATE= 1,2,3 Mbps and ZIGBEE DATA RATE= 250 kbps

27 mm

SA606DK

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

20

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G20

1.5 mm

4.4 mm

Not Qualified

40

260

6.5 mm

SA606DK,112

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

20

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G20

1.5 mm

4.4 mm

Not Qualified

40

260

6.5 mm

SARA-G340-02S

U-blox Ag

TELECOM CIRCUIT

4

SLRC61003HNE

NXP Semiconductors

TELECOM CIRCUIT

NICKEL PALLADIUM GOLD SILVER

2

e4

30

260

STA5635A

STMicroelectronics

TELECOM CIRCUIT

NOT SPECIFIED

NOT SPECIFIED

STA5635ATR

STMicroelectronics

TELECOM CIRCUIT

STID135

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

QCCN

SQUARE

UNSPECIFIED

YES

1

CHIP CARRIER

85 Cel

-40 Cel

QUAD

S-XQCC-N

NOT SPECIFIED

NOT SPECIFIED

TSC2200IPWR

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

28

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

2.7 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G28

1

1.2 mm

4.4 mm

Not Qualified

SINGLE-ENDED

e4

30

260

9.7 mm

UCC2750DWTRG4

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

28

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BICMOS

5 V

SMALL OUTLINE

1.27 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G28

2.65 mm

7.5 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

17.9 mm

WFM200SS22XNA2

Silicon Labs

TELECOM CIRCUIT

NO LEAD

52

LGA

SQUARE

UNSPECIFIED

YES

1

1.8 V

GRID ARRAY

LGA52(UNSPEC)

.5 mm

105 Cel

-40 Cel

BOTTOM

72.2 Mbps

S-XLGA-N52

3

1.4 mm

6.5 mm

40

260

6.5 mm

WL1801MODGBMOC

Texas Instruments

TELECOM CIRCUIT

OTHER

BALL

130

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.7 V

GRID ARRAY

70 Cel

-20 Cel

BOTTOM

R-PBGA-B130

2 mm

13.3 mm

13.4 mm

WT11I-E-AI5

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

28

RECTANGULAR

UNSPECIFIED

NO

1

3.3 V

MICROELECTRONIC ASSEMBLY

1.5 mm

85 Cel

-40 Cel

DUAL

R-XDMA-N28

2.86 mm

14.5 mm

35.75 mm

WYSBMVGXB

Taiyo Yuden

TELECOM CIRCUIT

1

3.3 V

NOT SPECIFIED

NOT SPECIFIED

XB3-24AST

Digi International

TELECOM CIRCUIT

UNSPECIFIED

XMA

RECTANGULAR

UNSPECIFIED

NO

1

SPECIAL SHAPE

85 Cel

-40 Cel

UNSPECIFIED

1 Mbps

R-XXMA-X

XB9X-DMUS-011

Digi International

TELECOM CIRCUIT

NO LEAD

37

XMA

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

.25 Mbps

R-XXMA-N37

ATA5749C-6DQY

Atmel

TELECOM CIRCUIT

AUTOMOTIVE

GULL WING

10

TSSOP

SQUARE

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.5 mm

125 Cel

-40 Cel

DUAL

S-PDSO-G10

1.1 mm

3 mm

3 mm

ATA5749C-6DQY-64

Microchip Technology

TELECOM CIRCUIT

AUTOMOTIVE

GULL WING

10

TSSOP

SQUARE

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP10,.19,20

.5 mm

125 Cel

-40 Cel

MATTE TIN

DUAL

.04 Mbps

S-PDSO-G10

2

1.1 mm

3 mm

e3

40

260

3 mm

ATSAMB11-XR2100A

Microchip Technology

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

49

HLGA

RECTANGULAR

UNSPECIFIED

YES

1

TS 16949

3.6 V

GRID ARRAY, HEAT SINK/SLUG

85 Cel

-40 Cel

BOTTOM

R-XBGA-N49

1.4 mm

4.5 mm

5.5 mm

CC2531F128RHAT

Texas Instruments

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

40

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N40

3

1 mm

6 mm

Not Qualified

e4

30

260

6 mm

CSR1012A05-IQQP-R

Qualcomm

TELECOM CIRCUIT

ETRX357HR-LRSCB

Silicon Labs

TELECOM CIRCUIT

NOT SPECIFIED

NOT SPECIFIED

GP2015/IG/FP1Q

Zarlink Semiconductor

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

48

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3 V

3/5

FLATPACK, LOW PROFILE, FINE PITCH

QFP48,.35SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-PQFP-G48

3

1.6 mm

7 mm

Not Qualified

e0

260

7 mm

ISL32275EIBZ-T

Renesas Electronics

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BICMOS

3.3 V

SMALL OUTLINE

1.27 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G16

3

1.75 mm

3.9 mm

e3

30

260

9.9 mm

MRF24J40T-I/ML

Microchip Technology

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

40

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC40,.24SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQCC-N40

1

1 mm

6 mm

Not Qualified

e3

40

260

6 mm

SE2435L-R

Skyworks Solutions

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

4 V

4

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC24,.16SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N24

1

.9 mm

4 mm

Not Qualified

e4

260

4 mm

XB3-24AST-J

Digi International

TELECOM CIRCUIT

UNSPECIFIED

XMA

RECTANGULAR

UNSPECIFIED

NO

1

SPECIAL SHAPE

85 Cel

-40 Cel

UNSPECIFIED

1 Mbps

R-XXMA-X

XB3-24Z8RM

Digi International

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

34

RECTANGULAR

UNSPECIFIED

YES

1

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N34

13 mm

19 mm

TLK2501IRCP

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

64

HVFQFP

SQUARE

PLASTIC/EPOXY

YES

1

1

2.5 V

2.5

FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH

TQFP64,.47SQ

Network Interfaces

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

2500 Mbps

S-PQFP-G64

3

1 mm

10 mm

Not Qualified

e4

30

260

10 mm

EFR32FG25A111F1152IM56-B

Silicon Labs

TELECOM CIRCUIT

SKY66403-11

Skyworks Solutions

TELECOM CIRCUIT

NICKEL PALLADIUM GOLD

3

e4

260

CYW20736A1KML2G

Infineon Technologies

TELECOM CIRCUIT

OTHER

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

1.2 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

.5 mm

85 Cel

-30 Cel

PURE TIN

QUAD

S-XQCC-N32

3

1 mm

5 mm

5 mm

ADL5506ACBZ-R7

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

BALL

6

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

BICMOS

3 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA6,2X3,16

.4 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B6

1

.56 mm

.79 mm

e1

30

260

1.19 mm

PM5990B-FEI

Microchip Technology

TELECOM CIRCUIT

BALL

1932

BGA

SQUARE

PLASTIC/EPOXY

YES

1

GRID ARRAY

BOTTOM

S-PBGA-B1932

CY7B933-SXC

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL

GULL WING

28

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BICMOS

.155 mA

5 V

5

SMALL OUTLINE

SOP28,.4

Other Telecom ICs

1.27 mm

70 Cel

0 Cel

NICKEL PALLADIUM GOLD

DUAL

400 Mbps

R-PDSO-G28

3

2.67 mm

7.505 mm

Not Qualified

e4

20

260

17.905 mm

CYW43455XKUBGT

Infineon Technologies

TELECOM CIRCUIT

BALL

140

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

1.2 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA140,11X13,16

.4 mm

85 Cel

-30 Cel

BOTTOM

433.3 Mbps

R-PBGA-B140

1

.6 mm

4.47 mm

5.27 mm

LT5554IUH#PBF

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQCC-N32

1

.8 mm

5 mm

Not Qualified

e3

30

260

5 mm

SE5004L-R

Skyworks Solutions

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

20

HVQCCN

SQUARE

UNSPECIFIED

YES

1

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N20

.9 mm

4 mm

NOT SPECIFIED

NOT SPECIFIED

4 mm

SKY66405-11

Skyworks Solutions

TELECOM CIRCUIT

INDUSTRIAL

NOT SPECIFIED

NOT SPECIFIED

MGM12P02F1024GA-V4

Silicon Labs

TELECOM CIRCUIT

UNSPECIFIED

XMA

RECTANGULAR

UNSPECIFIED

NO

1

3.3 V

SPECIAL SHAPE

85 Cel

-40 Cel

UNSPECIFIED

1 Mbps

R-XXMA-X

12.9 mm

17.8 mm

AD974BRSZ

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

28

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BICMOS

5 V

SMALL OUTLINE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G28

3

2 mm

5.3 mm

Not Qualified

e3

260

10.2 mm

RS9113-N00-D1F-X82

Silicon Labs

TELECOM CIRCUIT

SKY85716-11

Skyworks Solutions

TELECOM CIRCUIT

NO LEAD

16

QCCN

SQUARE

UNSPECIFIED

YES

1

CHIP CARRIER

QUAD

S-XQCC-N16

NOT SPECIFIED

NOT SPECIFIED

AD9856ASTZ

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

48

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3 V

FLATPACK, LOW PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G48

3

1.6 mm

7 mm

Not Qualified

e3

30

260

7 mm

BP35C5

ROHM

TELECOM CIRCUIT

COPPER NICKEL GOLD

e4

40

255

MGM210LA22JNF2

Silicon Labs

TELECOM CIRCUIT

SI3462-E01-GM

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

11

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N11

1 mm

3 mm

3 mm

WIT2410M4G

Murata Manufacturing

TELECOM CIRCUIT

OTHER

UNSPECIFIED

16

RECTANGULAR

UNSPECIFIED

NO

1

5 V

MICROELECTRONIC ASSEMBLY

70 Cel

-40 Cel

UNSPECIFIED

R-XXMA-X16

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.