TELECOM CIRCUIT Other Function Telecom Interface ICs 2,400+

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Nominal Negative Supply Voltage	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Maximum Analog Input	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
HMC1119LP4ME	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N16	3	1 mm	4 mm			e4	30	260	4 mm
HMC263LP4E	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQCC-N24	3	1 mm	4 mm	Not Qualified		e3	30	260	4 mm
HMC572LC5	Analog Devices	TELECOM CIRCUIT	OTHER	NO LEAD	32	HQCCN	SQUARE	UNSPECIFIED	YES	1					3.5 V		CHIP CARRIER, HEAT SINK/SLUG			.5 mm	85 Cel	-55 Cel	GOLD OVER NICKEL	QUAD		S-XQCC-N32		1.12 mm	5 mm	Not Qualified		e4			5 mm
HMC700LP4ETR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQCC-N24	1	1 mm	4 mm			e3	30	260	4 mm
HMC8108LC5	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HQCCN	SQUARE	UNSPECIFIED	YES	1							CHIP CARRIER, HEAT SINK/SLUG			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N32	3	1.12 mm	4.9 mm				30	260	4.9 mm
HMC981LP3ETR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQCC-N16	1	1 mm	3 mm			e3	30	260	3 mm
KSZ8695X	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	GULL WING	208	FQFP	SQUARE	PLASTIC/EPOXY	YES	1					1.8 V		FLATPACK, FINE PITCH			.5 mm	70 Cel	0 Cel		QUAD		S-PQFP-G208		4.1 mm	28 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	28 mm
LTC5596IDC#TRPBF	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-N8	1	.8 mm	2 mm			e3		260	2 mm
LXMSAPHA08-136	Murata Manufacturing	TELECOM CIRCUIT	OTHER	NO LEAD			SQUARE	UNSPECIFIED	YES	1							MICROELECTRONIC ASSEMBLY				70 Cel	-40 Cel		UNSPECIFIED		S-XXMA-N		.8 mm	8.3 mm				NOT SPECIFIED	NOT SPECIFIED	8.3 mm
MCP2150-I/SO	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	18	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	TS 16949			3.3 V		SMALL OUTLINE	SOP18,.4		1.27 mm	85 Cel	-40 Cel	Matte Tin (Sn)	DUAL		R-PDSO-G18	2	2.64 mm	7.49 mm	Not Qualified		e3	40	260	17.87 mm
PD69108ILQ-TR	Microsemi	TELECOM CIRCUIT
PE613050A-Z	Psemi	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	12	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS				2.75 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N12	1	.55 mm	2 mm			e4	30	260	2 mm
PM5981B-FEI	Microchip Technology	TELECOM CIRCUIT		BALL	1932	BGA	SQUARE	PLASTIC/EPOXY	YES	1							GRID ARRAY							BOTTOM		S-PBGA-B1932
SI4060-B1B-FMR	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N20		.9 mm	4 mm				NOT SPECIFIED	NOT SPECIFIED	4 mm
SI4060-C2A-GMR	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N20		.9 mm	4 mm						4 mm
SI4330-B1-FMR	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N20	1	.9 mm	4 mm	Not Qualified		e3	40	260	4 mm
SI4431-B1-FMR	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N20		.9 mm	4 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	4 mm
SI4455-C2A-GM	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N20		.9 mm	3 mm						3 mm
SY88053CLMG-TR	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.12SQ,20		.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	1250 Mbps	S-XQCC-N16	2	.9 mm	3 mm			e4	40	260	3 mm
TM1062TX3DUA	Pulse Electronics	TELECOM CIRCUIT	MILITARY	GULL WING	28		RECTANGULAR	PLASTIC/EPOXY	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY				125 Cel	-55 Cel		DUAL		R-PDMA-G28				Not Qualified			30	225
TM1062TX3DUAT	Pulse Electronics	TELECOM CIRCUIT
VSC8484YJP	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	BALL	324	BGA	SQUARE	PLASTIC/EPOXY	YES	1					1.2 V		GRID ARRAY			1 mm	105 Cel	-40 Cel		BOTTOM		S-PBGA-B324		2.74 mm	18.6 mm						18.6 mm
WF121-E	Silicon Labs	TELECOM CIRCUIT
WT41-A-AI5	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	59		RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY			1.5 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N59		5.65 mm	14 mm						35.3 mm
ZL30100QDG1	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	TFQFP	SQUARE	PLASTIC/EPOXY	YES	1					1.8 V		FLATPACK, THIN PROFILE, FINE PITCH	PQFP64,.40SQ,20		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQFP-G64	1	1.2 mm	10 mm			e3		260	10 mm
ZL30102QDG1	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	TFQFP	SQUARE	PLASTIC/EPOXY	YES	1					1.8 V		FLATPACK, THIN PROFILE, FINE PITCH	PQFP64,.40SQ,20		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQFP-G64		1.2 mm	10 mm			e3			10 mm
ZM5202AU-CME3R	Silicon Labs	TELECOM CIRCUIT		NO LEAD	18	QMA	RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-10 Cel		QUAD	.1 Mbps	R-XQMA-N18			12.5 mm						13.6 mm
CC2431ZRTCRG3	Texas Instruments	TELECOM CIRCUIT		NO LEAD	48	QCCN	SQUARE	UNSPECIFIED	YES	1							CHIP CARRIER						NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N48	3		7 mm	Not Qualified		e4	30	260	7 mm
TLK6201EARGTR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				.067 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.12SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	6250 Mbps	S-PQCC-N16	2	1 mm	3 mm	Not Qualified		e4	NOT SPECIFIED	260	3 mm
TRF8011PWP	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			350 mA	4.8 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G20		1.2 mm	4.4 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	6.5 mm
TLC320AD535PM	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel	0 Cel		QUAD		S-PQFP-G64		1.6 mm	10 mm	Not Qualified					10 mm
ADC32RF82IRMPR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	72	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1					1.15 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	480.24 Mbps	S-PQCC-N72	3	1 mm	10 mm			e4	30	260	10 mm
TRF2436IRTBT	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL EXTENDED	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				.55 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	Other Telecom ICs	.5 mm	85 Cel	-20 Cel	MATTE TIN	QUAD		S-PQCC-N40	3	.9 mm	6 mm	Not Qualified		e3	30	260	6 mm
TRF4140QPHNRQ1	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	48	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100			5 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH			.5 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	12 Mbps	S-PQFP-G48	3	1.2 mm	7 mm			e4	30	260	7 mm
XWL1835MODGAMOCT	Texas Instruments	TELECOM CIRCUIT	OTHER	NO LEAD	100	LGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					3.7 V		GRID ARRAY			.7 mm	70 Cel	-20 Cel		BOTTOM		R-PBGA-N100		2 mm	13.3 mm						13.4 mm
RI-STU-251B-01	Texas Instruments	TELECOM CIRCUIT	OTHER	UNSPECIFIED			RECTANGULAR	UNSPECIFIED	NO	1							SPECIAL SHAPE				70 Cel	-20 Cel		UNSPECIFIED		R-XXSS-X
TL852CDRG4	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR			.045 mA	5 V	5	SMALL OUTLINE	SOP16,.25	Other Telecom ICs	1.27 mm	40 Cel	0 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G16	1	1.75 mm	3.9 mm	Not Qualified		e4	30	260	9.9 mm
ADC32RF80IRMPT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	72	HVQCCN	SQUARE	UNSPECIFIED	YES	1					1.15 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	12500 Mbps	S-XQCC-N72	3	.9 mm	10 mm			e4	30	260	10 mm
DP83840AVCE	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS				5 V		FLATPACK			.65 mm	70 Cel	0 Cel		QUAD		R-PQFP-G100			14 mm						20 mm
LM96550SQX/NOPB	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	80	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		-10 V		10 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD		S-XQCC-N80	3	.8 mm	12 mm			e3	30	260	12 mm
UCC2750QTR	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS				3 V		CHIP CARRIER			1.27 mm	70 Cel	0 Cel		QUAD		S-PQCC-J28		4.57 mm	11.505 mm	Not Qualified					11.505 mm
TNETA1555DWR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				150 mA	5 V		SMALL OUTLINE				85 Cel	-40 Cel		DUAL		R-PDSO-G24				Not Qualified
TRPGR30TGC	Texas Instruments	TELECOM CIRCUIT
ADS58J64IRRHT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	72	HQCCN	RECTANGULAR	UNSPECIFIED	YES	1					1.15 V		CHIP CARRIER, HEAT SINK/SLUG				85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		R-XQCC-N72	3				2 V	e4	30	260
UCC3751N	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	BICMOS				12 V	12	IN-LINE	DIP16,.3	Telephone Circuits	2.54 mm	70 Cel	0 Cel		DUAL		R-PDIP-T16		5.08 mm	7.62 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	19.305 mm
TRF2432IRTQRG3	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				.125 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQCC-N56	3	1 mm	8 mm	Not Qualified		e3	30	260	8 mm
LM98640CILQ	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	68	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	70 Cel	0 Cel		QUAD		S-PQCC-N68		1 mm	10 mm						10 mm
LMX5452SM/NOPB	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	60	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS					3/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA60,6X10,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		R-PBGA-B60	4	1.3 mm	6 mm	Not Qualified		e1	30	260	9 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.