TELECOM CIRCUIT Other Function Telecom Interface ICs 2,400+

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Nominal Negative Supply Voltage	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
LXMS31ACNA-012	Murata Manufacturing	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	2	QCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1							CHIP CARRIER				85 Cel	-40 Cel		BOTTOM		R-PBCC-N2		.7 mm	1.6 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	3.2 mm
PI2EQX4402DNBE	Diodes Incorporated	TELECOM CIRCUIT	COMMERCIAL	BALL	84	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.8 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B84	3	1.46 mm	9 mm	Not Qualified		e1			9 mm
RS9113-NB0-S1C-X78	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	79	XMA	RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED	54 Mbps	R-XXMA-N79		3.3 mm	16 mm		ALSO HAS BLUETOOTH DATA RATE= 1,2,3 Mbps and ZIGBEE DATA RATE= 250 kbps; ESD for WURX pin=1C				27 mm
SI4732-A10-GSR	Silicon Labs	TELECOM CIRCUIT																					MATTE TIN				3						40	260
SKY65725-11	Skyworks Solutions	TELECOM CIRCUIT																															NOT SPECIFIED	NOT SPECIFIED
SKY66114-11	Skyworks Solutions	TELECOM CIRCUIT																					NICKEL PALLADIUM GOLD				3					e4		260
SKY85717-21	Skyworks Solutions	TELECOM CIRCUIT		NO LEAD	16	QCCN	SQUARE	UNSPECIFIED	YES	1					5 V		CHIP CARRIER							QUAD		S-XQCC-N16							NOT SPECIFIED	NOT SPECIFIED
SKY85806-11	Skyworks Solutions	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28	HVQCCN	RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel		QUAD		R-XQCC-N28		.9 mm	3 mm				NOT SPECIFIED	NOT SPECIFIED	4 mm
SR040HN/B02BY	NXP Semiconductors	TELECOM CIRCUIT		NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.23SQ,20		.5 mm	85 Cel	-30 Cel		QUAD		S-PQCC-N40	2A	1 mm	6 mm					260	6 mm
T5761-TGS	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V	5	SMALL OUTLINE	SOP20,.4	Other Telecom ICs	1.27 mm	105 Cel	-40 Cel	TIN LEAD	DUAL		R-PDSO-G20		2.6 mm	7.4 mm	Not Qualified		e0			12.825 mm
TC9560XBG	Toshiba	TELECOM CIRCUIT
WFM200S022XNN3	Silicon Labs	TELECOM CIRCUIT																									3						40	260
WFM200SS22XNN3	Silicon Labs	TELECOM CIRCUIT																									3						40	260
ACPL-C799-000E	Broadcom	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE			1.27 mm	105 Cel	-40 Cel	TIN	DUAL		R-PDSO-G8	1	3.607 mm	5.85 mm			e3		260	6.807 mm
ACPL-C799-500E	Broadcom	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE			1.27 mm	105 Cel	-40 Cel	TIN	DUAL		R-PDSO-G8	1	3.607 mm	5.85 mm			e3		260	6.807 mm
BC63B239A04-IQD-E4	Qualcomm	TELECOM CIRCUIT		NO LEAD	40	QCCN	SQUARE	UNSPECIFIED	YES	1					1.5 V		CHIP CARRIER							QUAD		S-XQCC-N40
BGM11S12F256GA-V2	Silicon Labs	TELECOM CIRCUIT
BGX13S22GA-V31	Silicon Labs	TELECOM CIRCUIT																									3						40	260
CY7B923-JC	Cypress Semiconductor	TELECOM CIRCUIT	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS			85 mA	5 V	5	CHIP CARRIER	LDCC28,.5SQ	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	TIN LEAD	QUAD		S-PQCC-J28	3	4.57 mm	11.53 mm	Not Qualified		e0			11.53 mm
CYW20706UA1KFFB1G	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	49	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				3.3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-30 Cel		BOTTOM		R-PBGA-B49		1 mm	4 mm						4.5 mm
CYW4343WKUBGT	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	74	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	70 Cel	-30 Cel		BOTTOM		R-PBGA-B74	1	.55 mm	2.87 mm						4.87 mm
EFR32BG1B132F256GM32-C0	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N32	2	.9 mm	5 mm			e3	40	260	5 mm
EFR32BG1V132F256GM32-C0	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N32	2	.9 mm	5 mm			e3	40	260	5 mm
EFR32FG25B111F1152IM56-B	Silicon Labs	TELECOM CIRCUIT
EFR32FG25B121F1152IM56-B	Silicon Labs	TELECOM CIRCUIT
EYSKDNZWB	Taiyo Yuden	TELECOM CIRCUIT																															NOT SPECIFIED	NOT SPECIFIED
IA3222B-F-FTR	Silicon Labs	TELECOM CIRCUIT	OTHER	GULL WING	10	VSSOP	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH			.508 mm	85 Cel	-25 Cel		DUAL		S-PDSO-G10		.9652 mm	3.048 mm				NOT SPECIFIED	NOT SPECIFIED	3.048 mm
MC13155DR2	Motorola	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		-5 V				SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G16		1.75 mm	3.9 mm	Not Qualified					9.9 mm
MC33742PEP/R2	NXP Semiconductors	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1					5 V	5.5/18	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		Network Interfaces	.5 mm	125 Cel	-40 Cel	Matte Tin (Sn)	QUAD		S-XQCC-N48	3	.9 mm	7 mm	Not Qualified		e3	40	260	7 mm
MGA-43024-BLKG	Broadcom	TELECOM CIRCUIT		NO LEAD	28		SQUARE	UNSPECIFIED	YES	1					5 V		MICROELECTRONIC ASSEMBLY			.5 mm				QUAD		S-XQMA-N28	3	.92 mm	5 mm					260	5 mm
MGM12P02F1024GA-V4R	Silicon Labs	TELECOM CIRCUIT		UNSPECIFIED		XMA	RECTANGULAR	UNSPECIFIED	NO	1					3.3 V		SPECIAL SHAPE				85 Cel	-40 Cel		UNSPECIFIED	1 Mbps	R-XXMA-X			12.9 mm						17.8 mm
MGM13S12F512GA-V3R	Silicon Labs	TELECOM CIRCUIT
RS9113-N00-S0N-X00	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	101	XMA	RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED	54 Mbps	R-XXMA-N101		2.3 mm	14 mm		ALSO HAS BLUETOOTH DATA RATE= 1,2,3 Mbps and ZIGBEE DATA RATE= 250 kbps; ESD for WURX pin=1C				15 mm
RS9116W-SB00-AA0-X2A	Silicon Labs	TELECOM CIRCUIT
SE2576L-R	Skyworks Solutions	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1					5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N16		.9 mm	3 mm				NOT SPECIFIED	NOT SPECIFIED	3 mm
SE2593A20-R	Skyworks Solutions	TELECOM CIRCUIT	OTHER	BUTT	30	TFLGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					3.3 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.625 mm	85 Cel	0 Cel		BOTTOM		R-PBGA-B30		1.1 mm	5 mm				NOT SPECIFIED	NOT SPECIFIED	6 mm
SE5516A-R	Skyworks Solutions	TELECOM CIRCUIT	INDUSTRIAL	BUTT	24	HLGA	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		GRID ARRAY, HEAT SINK/SLUG			.5 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B24		1.15 mm	4 mm				NOT SPECIFIED	NOT SPECIFIED	4 mm
SI3462-E01-GMR	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	11	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N11		1 mm	3 mm						3 mm
SI4010-C2-ATR	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				3.3 V		SMALL OUTLINE			.5 mm	85 Cel	-40 Cel		DUAL		S-PDSO-G10		1.1 mm	3 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	3 mm
SI4012-C1001GTR	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			.0198 mA	3.3 V	2/3.3	SMALL OUTLINE	TSSOP10,.19,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		DUAL		S-PDSO-G10		1.1 mm	3 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	3 mm
SI4063-B1B-FMR	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N20		.9 mm	4 mm				NOT SPECIFIED	NOT SPECIFIED	4 mm
SI4063-C2A-GMR	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N20		.9 mm	4 mm						4 mm
SI4355-B1A-FMR	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	QCCN	SQUARE	UNSPECIFIED	YES	1					3.3 V		CHIP CARRIER				85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N20	2					e3	40	260
SI4455-B1A-FM	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N20	2	.9 mm	3 mm			e3	40	260	3 mm
SI4737-C40-GM	Silicon Labs	TELECOM CIRCUIT	OTHER	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-20 Cel	MATTE TIN	QUAD		S-XQCC-N20	3	.6 mm	3 mm			e3	40	260	3 mm
SI4737-C40-GU	Silicon Labs	TELECOM CIRCUIT	OTHER	GULL WING	24	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				3.3 V		SMALL OUTLINE, SHRINK PITCH			.635 mm	85 Cel	-20 Cel	MATTE TIN	DUAL		R-PDSO-G24	3	2 mm	3.9 mm			e3	40	260	8.65 mm
SI4743-C10-GM	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N24	2	.9 mm	4 mm			e3	40	260	4 mm
SJA1105TEL	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	BALL	159	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100			1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B159	3	1.5 mm	12 mm			e1		260	12 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.