TELECOM CIRCUIT Other Function Telecom Interface ICs 2,400+

Reset All

Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Output Code	No. of Channels	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Resolution (um)	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Output (V)	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Input Type	Additional Features	Maximum Analog Input	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
ADN2892ACPZ-RL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1					.054 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.12SQ,20	ATM/SONET/SDH ICs	.5 mm	95 Cel		-40 Cel	MATTE TIN	QUAD		S-XQCC-N16		3	.9 mm	3 mm	Not Qualified				e3		260	3 mm
ADN2892ACPZ-RL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1					.054 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.12SQ,20	ATM/SONET/SDH ICs	.5 mm	95 Cel		-40 Cel	MATTE TIN	QUAD		S-XQCC-N16		3	.9 mm	3 mm	Not Qualified				e3	30	260	3 mm
AFE4300PN	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BINARY/TWOS COMP	2			.00097 mA	3.3 V	3	FLATPACK, LOW PROFILE, FINE PITCH	QFP80,.55SQ,20	Codecs	.5 mm	70 Cel	16	0 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQFP-G80	VOLTAGE	3	1.6 mm	12 mm	Not Qualified	DIFFERENTIAL		3.4 V	e4	30	260	12 mm
ATA5577M3330C-DDB	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	UNSPECIFIED	2	DIE	RECTANGULAR	UNSPECIFIED		1								UNCASED CHIP	DIE OR CHIP		.524 mm	85 Cel		-40 Cel		UPPER		R-XUUC-N2			.162 mm	1 mm								1.35 mm
BGM210P032JIA2	Silicon Labs	TELECOM CIRCUIT
BGS110MN20E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	BUTT	20	BCC	SQUARE	UNSPECIFIED	YES	1						3.5 V		CHIP CARRIER			.4 mm	85 Cel		-30 Cel		BOTTOM		S-XBCC-B20		1	.77 mm	2.3 mm								2.3 mm
BLUENRG-345VC	STMicroelectronics	TELECOM CIRCUIT		BALL	49	BGA	SQUARE	UNSPECIFIED	YES	1						1.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel		-40 Cel		BOTTOM	2 Mbps	S-XBGA-B49			.42 mm	3.14 mm								3.14 mm
BMD-341-A-R-00	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	68	XMA	RECTANGULAR	UNSPECIFIED	YES	1						3 V		MICROELECTRONIC ASSEMBLY				85 Cel		-40 Cel		UNSPECIFIED	2 Mbps	R-XXMA-N68		3	1.9 mm	10.2 mm							250	15 mm
BT860-ST	Laird Technologies	TELECOM CIRCUIT																																				NOT SPECIFIED	NOT SPECIFIED
CC1201RHBR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	QUAD	1.25 Mbps	S-PQCC-N32		3	1 mm	5 mm	Not Qualified				e4	NOT SPECIFIED	260	5 mm
CC2541F256TRHARQ1	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD	2 Mbps	S-PQCC-N40		3	1 mm	6 mm					e4	30	260	6 mm
CY7B9234-270JXCT	Cypress Semiconductor	TELECOM CIRCUIT	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1			BICMOS			5 V		CHIP CARRIER			1.27 mm	70 Cel		0 Cel	MATTE TIN	QUAD		S-PQCC-J28		3	4.572 mm	11.5316 mm	Not Qualified				e3	20	260	11.5316 mm
CYBT-483056-02	Infineon Technologies	TELECOM CIRCUIT																												3								30	260
D52MD2M8IA-TRAY	Garmin Canada	TELECOM CIRCUIT	INDUSTRIAL	BALL	35	XMA	RECTANGULAR	UNSPECIFIED	YES	1								MICROELECTRONIC ASSEMBLY			1.5 mm	85 Cel		-40 Cel		UNSPECIFIED	.06 Mbps	R-XXMA-B35			2.11 mm	9.8 mm								14 mm
DP1203C4333LF	Semtech	TELECOM CIRCUIT	INDUSTRIAL	UNSPECIFIED	21		RECTANGULAR	UNSPECIFIED	NO	1						3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel		-40 Cel	MATTE TIN	UNSPECIFIED		R-XXMA-X21					Not Qualified				e3
DS2174Q	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1					.06 mA	3.3 V	3.3	CHIP CARRIER	LDCC44,.7SQ	Other Telecom ICs	1.27 mm	70 Cel		0 Cel	TIN LEAD	QUAD		S-PQCC-J44		3	4.57 mm	16.585 mm	Not Qualified				e0			16.585 mm
DS2174Q+	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1					.06 mA	3.3 V	3.3	CHIP CARRIER	LDCC44,.7SQ	Other Telecom ICs	1.27 mm	70 Cel		0 Cel	MATTE TIN	QUAD		S-PQCC-J44		3	4.57 mm	16.585 mm	Not Qualified				e3		245	16.585 mm
EFR32BG12P432F1024GM48-C	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1						3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20		.5 mm	85 Cel		-40 Cel		QUAD	2 Mbps	S-XQCC-N48			.9 mm	7 mm								7 mm
EFR32BG1B232F256GJ43-C0	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	BALL	43	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1						3.3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel		-40 Cel		BOTTOM		R-PBGA-B43			.54 mm	3.143 mm								3.295 mm
ESP32-S0WD	Espressif Systems (Shanghai)	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1			CMOS			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.35 mm	125 Cel		-40 Cel		QUAD		S-XQCC-N48			.9 mm	5 mm								5 mm
ETRX2HR	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	38		RECTANGULAR	UNSPECIFIED	YES	1						3 V		MICROELECTRONIC ASSEMBLY			2.54 mm	85 Cel		-40 Cel		UNSPECIFIED		R-XXMA-N38				20.5 mm								37.5 mm
GS2971-IBE3	Semtech	TELECOM CIRCUIT	OTHER	BALL	100	LBGA	SQUARE	PLASTIC/EPOXY	YES	1						1.2 V		GRID ARRAY, LOW PROFILE			1 mm	85 Cel		-20 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B100		1	1.7 mm	11 mm					e1		260	11 mm
HMC560LM3	Analog Devices	TELECOM CIRCUIT	OTHER	NO LEAD	6	HQCCN	SQUARE	PLASTIC/EPOXY	YES	1								CHIP CARRIER, HEAT SINK/SLUG			1 mm	85 Cel		-55 Cel	GOLD OVER NICKEL	QUAD		S-PQCC-N6		1	1.14 mm	5.08 mm	Not Qualified				e4		250	5.08 mm
HMC572LC5TR	Analog Devices	TELECOM CIRCUIT	OTHER	NO LEAD	32	HQCCN	SQUARE	UNSPECIFIED	YES	1						3.5 V		CHIP CARRIER, HEAT SINK/SLUG			.5 mm	85 Cel		-55 Cel		QUAD		S-XQCC-N32			1.12 mm	5 mm						NOT SPECIFIED	NOT SPECIFIED	5 mm
HTSH4801ETK,118	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	2	SON	RECTANGULAR	PLASTIC/EPOXY	YES	1								SMALL OUTLINE	LCC2(UNSPEC)	Other Telecom ICs		85 Cel		-25 Cel		DUAL		R-PDSO-N2		1			Not Qualified					30	260
LTC4400-1ES6#TRMPBF	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	6	VSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						3.6 V		SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH			.95 mm	85 Cel		-40 Cel	MATTE TIN	DUAL		R-PDSO-G6		1	1 mm	1.6 mm	Not Qualified				e3			2.9 mm
LTC5800IWR-IPRB#PBF	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	72	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			CMOS			3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	SILVER	QUAD		S-PQCC-N72			1 mm	10 mm					e4			10 mm
MAX5980AGTJ+	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1			BICMOS			54 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel		-40 Cel	Matte Tin (Sn) - annealed	QUAD		S-XQCC-N32		1	.8 mm	5 mm					e3	30	260	5 mm
MC33660EF	NXP Semiconductors	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	8	SON	RECTANGULAR	PLASTIC/EPOXY	YES	1			CMOS			5 V		SMALL OUTLINE			1.27 mm	125 Cel		-40 Cel		DUAL		R-PDSO-N8			1.75 mm	3.9 mm								4.9 mm
MGM111A256V2	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	31	XMA	RECTANGULAR	UNSPECIFIED	YES	1						3.3 V		MICROELECTRONIC ASSEMBLY			1.2 mm	85 Cel		-40 Cel		UNSPECIFIED	.25 Mbps	R-XXMA-N31			2.1 mm	12.9 mm								15 mm
MGM12P32F1024GE-V4R	Silicon Labs	TELECOM CIRCUIT		UNSPECIFIED		XMA	RECTANGULAR	UNSPECIFIED	NO	1						3.3 V		SPECIAL SHAPE				85 Cel		-40 Cel		UNSPECIFIED	1 Mbps	R-XXMA-X				12.9 mm								17.8 mm
MGM210P022JIA2	Silicon Labs	TELECOM CIRCUIT
MGM210P032JIA2	Silicon Labs	TELECOM CIRCUIT
MGM240SA22VNA2R	Silicon Labs	TELECOM CIRCUIT
NINA-B111-04B	U-blox Ag	TELECOM CIRCUIT																												4
NINA-B111-05B	U-blox Ag	TELECOM CIRCUIT
NINA-B311-00B	U-blox Ag	TELECOM CIRCUIT
NRF52832-CHAA-R	Nordic Semiconductor Asa	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1						3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel		-40 Cel		QUAD		S-XQCC-N48			.95 mm	6 mm						NOT SPECIFIED	NOT SPECIFIED	6 mm
NXH3670UK/A1Z	NXP Semiconductors	TELECOM CIRCUIT																												1									260
ODIN-W262	U-blox Ag	TELECOM CIRCUIT		UNSPECIFIED		XMA	RECTANGULAR	UNSPECIFIED	NO	1						3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel		-40 Cel		UNSPECIFIED		R-XXMA-X
OPA381AIDGKTG4	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1					.0011 mA	5 V	3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19	Other Telecom ICs	.65 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL		S-PDSO-G8		2	1.1 mm	3 mm	Not Qualified				e4	30	260	3 mm
PEF7072HLV16	Intel	TELECOM CIRCUIT		GULL WING	64	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1								FLATPACK								QUAD		R-PQFP-G64
PM5991B-FEI	Microchip Technology	TELECOM CIRCUIT		BALL	1932	BGA	SQUARE	PLASTIC/EPOXY	YES	1								GRID ARRAY								BOTTOM		S-PBGA-B1932
RI-I03-112A-03	Texas Instruments	TELECOM CIRCUIT																																				NOT SPECIFIED	NOT SPECIFIED
RI-I11-112A-03	Texas Instruments	TELECOM CIRCUIT	OTHER							1												70 Cel		-25 Cel									Not Qualified					NOT SPECIFIED	NOT SPECIFIED
RN4020BCN-V/RM120	Microchip Technology	TELECOM CIRCUIT	OTHER	NO LEAD	24	XMA	RECTANGULAR	UNSPECIFIED	YES	1				TS 16949		3.3 V		MICROELECTRONIC ASSEMBLY	MODULE,24LEAD(UNSPEC)		1.2 mm	85 Cel		-30 Cel	GOLD OVER NICKEL	UNSPECIFIED	1 Mbps	R-XXMA-N24			2.38 mm	11.5 mm					e4			19.5 mm
RN4677-V/RM112	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	YES	1				TS 16949		3.3 V		MICROELECTRONIC ASSEMBLY	MODULE,33LEAD(UNSPEC)		1.1 mm	70 Cel		-20 Cel	GOLD OVER NICKEL	UNSPECIFIED	.4 Mbps	R-XXMA-N33			2.46 mm	12 mm					e4			22 mm
RS9113-NB0-D1C-X68	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	79	XMA	RECTANGULAR	UNSPECIFIED	YES	1						3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel		-40 Cel		UNSPECIFIED	54 Mbps	R-XXMA-N79			3.3 mm	16 mm			ALSO HAS BLUETOOTH DATA RATE= 1,2,3 Mbps and ZIGBEE DATA RATE= 250 kbps; ESD for WURX pin=1C					27 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.