TELECOM CIRCUIT Other Function Telecom Interface ICs 2,400+

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Maximum Gain Tolerance	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Linear Coding	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Filter
090-02789-002	Microchip Technology	TELECOM CIRCUIT		PIN/PEG	9	DMA	RECTANGULAR	UNSPECIFIED	NO	1				3.3 V		MICROELECTRONIC ASSEMBLY			5.1 mm	80 Cel	-40 Cel			DUAL		R-XDMA-P9		11.68 mm		35.3 mm						40.64 mm
090-02789-011	Microchip Technology	TELECOM CIRCUIT		PIN/PEG	9	DMA	RECTANGULAR	UNSPECIFIED	NO	1				3.3 V		MICROELECTRONIC ASSEMBLY			5.1 mm	65 Cel	-10 Cel			DUAL		R-XDMA-P9		11.68 mm		35.3 mm						40.64 mm
451-00002C	Laird Technologies	TELECOM CIRCUIT		NO LEAD	71	XMA	RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel			UNSPECIFIED	2 Mbps	R-XXMA-N71		2.35 mm		10 mm				NOT SPECIFIED	NOT SPECIFIED	15 mm
80HCPS1848CHMGI	Renesas Electronics	TELECOM CIRCUIT																					Tin/Silver/Copper (Sn/Ag/Cu)				4						e1	NOT SPECIFIED	250
AD73311AR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3 V	3/5	SMALL OUTLINE	SOP20,.4	Codecs	1.27 mm	85 Cel	-40 Cel	1 dB	TIN LEAD	DUAL		R-PDSO-G20	1	2.65 mm	16-BIT	7.5 mm	Not Qualified		e0		240	12.8 mm	YES
AD73311LARS-REEL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		.0125 mA	3 V	3	SMALL OUTLINE, SHRINK PITCH	SSOP20,.3	Modems	.65 mm	105 Cel	-40 Cel		TIN LEAD	DUAL		R-PDSO-G20	1	2 mm		5.3 mm	Not Qualified		e0		240	7.2 mm
AD73311LARS-REEL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		.0125 mA	3 V	3	SMALL OUTLINE, SHRINK PITCH	SSOP20,.3	Modems	.65 mm	105 Cel	-40 Cel		TIN LEAD	DUAL		R-PDSO-G20	1	2 mm		5.3 mm	Not Qualified		e0		240	7.2 mm
AD73360ARZ-REEL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		MATTE TIN	DUAL		R-PDSO-G28	3	2.65 mm		7.5 mm	Not Qualified		e3	30	260	17.9 mm
AD974BRZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		MATTE TIN	DUAL		R-PDSO-G28	3	2.65 mm		7.5 mm	Not Qualified		e3	30	260	17.9 mm
ADF7023BCPZ-RL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3 V	2/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N32	3	.8 mm		5 mm	Not Qualified		e4	30	260	5 mm
ADF7030-1BCPZN-RL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel			QUAD		S-XQCC-N40	3	.8 mm		6 mm				30	260	6 mm
ADRV9004BBCZ	Analog Devices	TELECOM CIRCUIT		BALL	196	BGA	SQUARE	PLASTIC/EPOXY	YES	2				1 V		GRID ARRAY			.8 mm	85 Cel	-40 Cel			BOTTOM		S-PBGA-B196	3	1.25 mm		12 mm				30	260	12 mm
AFE7903IABJ	Texas Instruments	TELECOM CIRCUIT		BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	1				.925 V		GRID ARRAY	BGA400,20X20,32		.8 mm	85 Cel	-40 Cel		TIN SILVER COPPER	BOTTOM	29500 Mbps	S-PBGA-B400	3	2.65 mm		17 mm		ALSO VNOM IS 1.2V & 1.8V; RF Frequency Max is 7400 MHz; RF Frequency Min is 5 MHz	e1		260	17 mm
AMW037	Silicon Labs	TELECOM CIRCUIT		NO LEAD	44	QMA	RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY			1.27 mm	85 Cel	-40 Cel			UNSPECIFIED	54 Mbps	R-XQMA-N44		2.72 mm		16.51 mm						24.77 mm
AP22814AM8-13	Diodes Incorporated	TELECOM CIRCUIT																					MATTE TIN										e3	30	260
AT88RF1354-ZU	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1			.25 mA	3.3 V	3.3/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		MATTE TIN	QUAD	.106 Mbps	S-XQCC-N36		.9 mm		6 mm	Not Qualified		e3			6 mm
ATA8202C-PXQW-1	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.20SQ,25		.65 mm	85 Cel	-40 Cel		MATTE TIN	QUAD	.02 Mbps	S-XQCC-N24		.9 mm		5 mm			e3			5 mm
ATA8520E-GHPW	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	85 Cel	-40 Cel		Matte Tin (Sn)	QUAD	.0006 Mbps	S-XQCC-N32		.9 mm		5 mm			e3			5 mm
ATSAMW25H18-MR210PB	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	51		RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY			1.2 mm	85 Cel	-40 Cel			UNSPECIFIED		R-XXMA-N51		2.138 mm		14.908 mm						33.864 mm
ATSAMW25H18-MR210PB1944	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	51		RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY			1.2 mm	85 Cel	-40 Cel			UNSPECIFIED		R-XXMA-N51		2.138 mm		14.908 mm						33.864 mm
ATSAMW25H18-MR210PB1961	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	51		RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY			1.2 mm	85 Cel	-40 Cel			UNSPECIFIED		R-XXMA-N51		2.138 mm		14.908 mm						33.864 mm
ATZB-S1-256-3-0-CR	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	42		RECTANGULAR	UNSPECIFIED	YES	1				3 V		MICROELECTRONIC ASSEMBLY			1 mm	85 Cel	-40 Cel			UNSPECIFIED		R-XXMA-N42		3.2 mm		20 mm						30 mm
BGM240SB22VNA2	Silicon Labs	TELECOM CIRCUIT
BGS15GA14E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	BUTT	14		SQUARE	UNSPECIFIED	YES	1				3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-30 Cel		GOLD NICKEL	QUAD		S-XQMA-B14	1	.65 mm		2 mm			e4			2 mm
BLE113-A-M256K	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36	XMA	RECTANGULAR	UNSPECIFIED	YES	1				3 V		MICROELECTRONIC ASSEMBLY			.8 mm	85 Cel	-40 Cel			UNSPECIFIED	2 Mbps	R-XXMA-N36		2 mm		9.15 mm						15.73 mm
BLUENRG-132Y	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel			QUAD		S-XQCC-N32		1 mm		5 mm				NOT SPECIFIED	NOT SPECIFIED	5 mm
BM23SPKA1NB9-0B02AA	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	43	XMA	RECTANGULAR	UNSPECIFIED	YES	1				3.7 V		MICROELECTRONIC ASSEMBLY	MODULE,43LEAD(UNSPEC)		1.2 mm	70 Cel	-20 Cel			UNSPECIFIED		R-XXMA-N43		1.9 mm		15 mm						29 mm
CC2550-RTY1	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N16	3	.95 mm		4 mm			e4	30	260	4 mm
CC430F5133IRGZR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1				2.2 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD	.5 Mbps	S-PQCC-N48	3	1 mm		7 mm	Not Qualified		e4	30	260	7 mm
CC430F6135IRGCT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	64	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1				2.2 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD SILVER	QUAD		S-PQCC-N64	3	1 mm		9 mm	Not Qualified		e4	30	260	9 mm
CYBT-483062-02	Infineon Technologies	TELECOM CIRCUIT																									3							30	260
CYW43438KUBGT	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	63	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	70 Cel	-30 Cel			BOTTOM		R-PBGA-B63	1	.55 mm		2.87 mm						4.87 mm
EFR32BG13P732F512GM32-D	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20		.5 mm	85 Cel	-40 Cel			QUAD		S-XQCC-N48	3	.9 mm		7 mm				40	260	7 mm
EFR32BG13P732F512GM48-D	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20		.5 mm	85 Cel	-40 Cel		MATTE TIN	QUAD		S-XQCC-N48	2	.9 mm		7 mm			e3	40	260	7 mm
ENW89823C3KF	Panasonic	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	XMA	RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel			UNSPECIFIED	2.178 Mbps	R-XXMA-N24		2 mm		9 mm						9.5 mm
ENW89829C3KF	Panasonic	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	XMA	RECTANGULAR	UNSPECIFIED	YES	1				3.6 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel			UNSPECIFIED	2.178 Mbps	R-XXMA-N24		2 mm		6.5 mm						9 mm
ENW89846A1KF	Panasonic	TELECOM CIRCUIT	INDUSTRIAL	UNSPECIFIED	28		RECTANGULAR	UNSPECIFIED	NO	1				3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel			UNSPECIFIED		R-XXMA-X28		2 mm		9 mm				50	250	9.5 mm
ETRX2HR-PA	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	38		RECTANGULAR	UNSPECIFIED	YES	1				3 V		MICROELECTRONIC ASSEMBLY			2.54 mm	85 Cel	-40 Cel			UNSPECIFIED		R-XXMA-N38				20.5 mm						37.5 mm
EYSKJNZWB	Taiyo Yuden	TELECOM CIRCUIT																																NOT SPECIFIED	NOT SPECIFIED
IS1678SM-151-TRAY	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1		TS 16949		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20		.5 mm	70 Cel	-20 Cel			QUAD		S-XQCC-N40		.9 mm		6 mm						6 mm
JODY-W263-01A	U-blox Ag	TELECOM CIRCUIT
KGL4195KD	Lapis Semiconductor	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	QCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V		CHIP CARRIER			.5 mm	95 Cel	-40 Cel			QUAD		S-XQCC-N24		1.65 mm		4 mm	Not Qualified					4 mm
LEA-6S-0-001	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	PLASTIC/EPOXY	NO	1		AEC-Q100		3 V		MICROELECTRONIC ASSEMBLY			1.1 mm	85 Cel	-40 Cel			DUAL		R-PDMA-N28	4	2.7 mm		17 mm						22.4 mm
LNBH26LSPQR	STMicroelectronics	TELECOM CIRCUIT		NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1				12 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm					QUAD		S-XQCC-N24	1	1 mm		4 mm						4 mm
MAX-8C-0-10	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	18	XMA	RECTANGULAR	UNSPECIFIED	YES	1				3 V		MICROELECTRONIC ASSEMBLY			1.1 mm	85 Cel	-40 Cel			UNSPECIFIED		R-XXMA-N18	4	2.7 mm		9.7 mm						10.1 mm
MAX9152ESE-T	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3.3 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		TIN LEAD	DUAL		R-PDSO-G16		1.75 mm		3.9 mm	Not Qualified		e0			9.9 mm
MAX9152ESE+T	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3.3 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		Matte Tin (Sn) - annealed	DUAL		R-PDSO-G16	1	1.75 mm		3.9 mm	Not Qualified		e3	30	260	9.9 mm
MGM13P12F512GA-V2	Silicon Labs	TELECOM CIRCUIT

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.