Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Applications | Surface Mount | No. of Functions | Output Code | No. of Channels | Technology | Screening Level | Nominal Negative Supply Voltage | No. of Transceivers | Maximum Supply Current | Nominal Supply Voltage | Hybrid | Input Code | Power Supplies (V) | ISDN Access Rate | Package Style (Meter) | Package Equivalence Code | Sub-Category | Carrier Type-3 | Terminal Pitch | Maximum Operating Temperature | Resolution (um) | Battery Supply (V) | Minimum Output High Voltage | Maximum Output Low Voltage | Standard | Minimum Operating Temperature | Maximum Gain Tolerance | Terminal Finish | Maximum Output Voltage | Terminal Position | Data Rate | JESD-30 Code | Reference Point | Output (V) | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Linear Coding | Carrier Type-2 | Carrier Type-1 | Width | Qualification | Maximum Output Low Current | Companding Law | Input Type | Additional Features | Battery Feed | Maximum Analog Input | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Filter |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
TELECOM CIRCUIT |
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Microchip Technology |
TELECOM CIRCUIT |
INDUSTRIAL |
36 |
RECTANGULAR |
UNSPECIFIED |
1 |
TS 16949 |
3.3 V |
85 Cel |
-40 Cel |
2.7 mm |
21 mm |
31 mm |
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Microchip Technology |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
36 |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
TS 16949 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
DUAL |
R-XDMA-N36 |
2.7 mm |
21 mm |
31 mm |
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Microchip Technology |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
36 |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
TS 16949 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
DUAL |
R-XDMA-N36 |
2.7 mm |
21 mm |
31 mm |
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Microchip Technology |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
36 |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
TS 16949 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
DUAL |
R-XDMA-N36 |
2.7 mm |
21 mm |
31 mm |
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Microchip Technology |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
37 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
TS 16949 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
UNSPECIFIED |
R-XXMA-N37 |
2.286 mm |
17.78 mm |
26.67 mm |
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|
Onsemi |
TELECOM CIRCUIT |
AUTOMOTIVE |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
12 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.65 mm |
125 Cel |
-40 Cel |
MATTE TIN |
DUAL |
S-PDSO-N8 |
1 |
1 mm |
3 mm |
e3 |
30 |
260 |
3 mm |
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|
U-blox Ag |
TELECOM CIRCUIT |
4 |
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|
U-blox Ag |
TELECOM CIRCUIT |
4 |
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|
U-blox Ag |
TELECOM CIRCUIT |
4 |
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|
U-blox Ag |
TELECOM CIRCUIT |
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|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
10 |
DIE |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
25 mA |
3.3 V |
3.3 |
UNCASED CHIP |
DIE OR CHIP |
Other Telecom ICs |
85 Cel |
-40 Cel |
UPPER |
4250 Mbps |
R-XUUC-N10 |
Not Qualified |
Data rate is 4.25 Gbps |
NOT SPECIFIED |
NOT SPECIFIED |
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|
Texas Instruments |
TELECOM CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
2 |
5 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD SILVER |
DUAL |
S-PDSO-G8 |
2 |
1.1 mm |
3 mm |
Not Qualified |
e4 |
30 |
260 |
3 mm |
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|
Texas Instruments |
TELECOM CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
.008 mA |
5 V |
3/5 |
SMALL OUTLINE |
SOP8,.25 |
Other Telecom ICs |
1.27 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G8 |
2 |
1.75 mm |
3.9 mm |
Not Qualified |
e4 |
30 |
260 |
4.9 mm |
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|
Psemi |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
10 |
VQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
2.6 V |
CHIP CARRIER, VERY THIN PROFILE |
LCC10,.08SQ,20 |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-XQCC-N10 |
1 |
.5 mm |
2 mm |
e4 |
10 |
260 |
2 mm |
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NXP Semiconductors |
TELECOM CIRCUIT |
NO LEAD |
40 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3 V |
CHIP CARRIER |
.5 mm |
QUAD |
S-PQCC-N40 |
1 mm |
6 mm |
Not Qualified |
6 mm |
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|
NXP Semiconductors |
TELECOM CIRCUIT |
OTHER |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3 V |
1.8/3.3,2.5/3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-30 Cel |
TIN/NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N32 |
1 mm |
5 mm |
Not Qualified |
e3/e4 |
5 mm |
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|
NXP Semiconductors |
TELECOM CIRCUIT |
NICKEL PALLADIUM GOLD |
3 |
e4 |
30 |
260 |
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Qorvo |
TELECOM CIRCUIT |
INDUSTRIAL |
BUTT |
28 |
LFLGA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.6 V |
GRID ARRAY, LOW PROFILE, FINE PITCH |
.676 mm |
85 Cel |
-40 Cel |
BOTTOM |
R-XBGA-B28 |
1.25 mm |
5 mm |
5.5 mm |
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Qorvo |
TELECOM CIRCUIT |
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Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
20 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3.3/5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP20,.25,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G20 |
1.2 mm |
4.4 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
6.5 mm |
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|
Microchip Technology |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
TS 16949 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
MODULE,32LEAD(UNSPEC) |
1 mm |
85 Cel |
-40 Cel |
GOLD OVER NICKEL |
UNSPECIFIED |
3 Mbps |
R-XXMA-N32 |
2.4 mm |
13.4 mm |
e4 |
25.8 mm |
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Silicon Labs |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
79 |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
UNSPECIFIED |
54 Mbps |
R-XXMA-N79 |
3.3 mm |
16 mm |
ALSO HAS BLUETOOTH DATA RATE= 1,2,3 Mbps and ZIGBEE DATA RATE= 250 kbps; ESD for WURX pin=1C |
27 mm |
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Silicon Labs |
TELECOM CIRCUIT |
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Silicon Labs |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
101 |
LGA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
1.85 V |
GRID ARRAY |
85 Cel |
-40 Cel |
BOTTOM |
R-XBGA-N101 |
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Silicon Labs |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
79 |
LGA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
1.85 V |
GRID ARRAY |
85 Cel |
-40 Cel |
BOTTOM |
R-XBGA-N79 |
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Silicon Labs |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
79 |
LGA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
1.85 V |
GRID ARRAY |
85 Cel |
-40 Cel |
BOTTOM |
R-XBGA-N79 |
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|
NXP Semiconductors |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
20 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3 V |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G20 |
1.5 mm |
4.4 mm |
Not Qualified |
40 |
260 |
6.5 mm |
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|
NXP Semiconductors |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
20 |
VQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3 V |
CHIP CARRIER, VERY THIN PROFILE |
LCC20,.16SQ,20 |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQCC-N20 |
1 |
1 mm |
4 mm |
30 |
260 |
4 mm |
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|
NXP Semiconductors |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
20 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3 V |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
SSOP20,.25 |
.65 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G20 |
1 |
1.5 mm |
4.4 mm |
e4 |
30 |
260 |
6.5 mm |
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U-blox Ag |
TELECOM CIRCUIT |
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|
U-blox Ag |
TELECOM CIRCUIT |
INDUSTRIAL |
BUTT |
96 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.8 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
UNSPECIFIED |
R-XXMA-B96 |
4 |
3.25 mm |
16 mm |
26 mm |
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|
Skyworks Solutions |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.4 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N20 |
.6 mm |
3 mm |
NOT SPECIFIED |
NOT SPECIFIED |
3 mm |
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|
Skyworks Solutions |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.4 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N20 |
1 |
.6 mm |
3 mm |
3 mm |
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|
Silicon Labs |
TELECOM CIRCUIT |
COMMERCIAL |
SOP |
1 |
3.3 V |
1.27 mm |
70 Cel |
0 Cel |
1.75 mm |
3.9 mm |
9.9 mm |
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|
Telit Communications Plc |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
SON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
SMALL OUTLINE |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-N24 |
2.4 mm |
12.2 mm |
NOT SPECIFIED |
NOT SPECIFIED |
16 mm |
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|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
2 |
2 |
CMOS |
.12 mA |
3.3 V |
3.3 |
CHIP CARRIER |
LCC24,.16SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
5 Mbps |
S-PQCC-N24 |
2 |
1 mm |
4 mm |
Not Qualified |
e4 |
30 |
260 |
4 mm |
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|
STMicroelectronics |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
23 |
QMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
1.27 mm |
85 Cel |
-40 Cel |
QUAD |
R-XQMA-N23 |
2.2 mm |
11.5 mm |
NOT SPECIFIED |
NOT SPECIFIED |
13.5 mm |
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|
STMicroelectronics |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
11 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
1.27 mm |
85 Cel |
-40 Cel |
UNSPECIFIED |
R-XXMA-N11 |
2.2 mm |
11.5 mm |
NOT SPECIFIED |
NOT SPECIFIED |
13.5 mm |
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|
STMicroelectronics |
TELECOM CIRCUIT |
NOT SPECIFIED |
NOT SPECIFIED |
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|
STMicroelectronics |
TELECOM CIRCUIT |
NOT SPECIFIED |
NOT SPECIFIED |
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|
Semtech |
TELECOM CIRCUIT |
INDUSTRIAL |
MATTE TIN |
3 |
e3 |
260 |
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|
Semtech |
TELECOM CIRCUIT |
MATTE TIN |
3 |
e3 |
260 |
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Atmel |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
.00004 mA |
SMALL OUTLINE |
SOP8,.25 |
Other Telecom ICs |
1.27 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G8 |
3.8 mm |
Not Qualified |
e0 |
4.925 mm |
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|
Toshiba |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
40 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.4 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQCC-N40 |
.9 mm |
5 mm |
NOT SPECIFIED |
NOT SPECIFIED |
5 mm |
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|
Infineon Technologies |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
28 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
105 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD SILVER |
DUAL |
R-PDSO-G28 |
3 |
1.2 mm |
4.4 mm |
Not Qualified |
e4 |
9.7 mm |
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|
NXP Semiconductors |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQCC-N24 |
1 |
1 mm |
4 mm |
260 |
4 mm |
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|
Qorvo |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
14 |
LSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
4.5 V |
SMALL OUTLINE, LOW PROFILE |
1.06 mm |
85 Cel |
-40 Cel |
Gold (Au) - with Nickel (Ni) barrier |
DUAL |
S-PDSO-N14 |
3 |
1.4 mm |
7 mm |
e4 |
NOT SPECIFIED |
NOT SPECIFIED |
7 mm |
Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.
Some common types of Other Function Telecom Interface ICs include:
1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.
2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.
3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.
4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.