TELECOM CIRCUIT Other Function Telecom Interface ICs 2,400+

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Input Type	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
TSC2200IRHB	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				2.7 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N32	2	1 mm	5 mm	Not Qualified	SINGLE-ENDED	e4	30	260	5 mm
UBX-G6010-ST	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56	QCCN	SQUARE	UNSPECIFIED	YES	1		AEC-Q100; TS 16949		1.8 V		CHIP CARRIER				85 Cel	-40 Cel		QUAD		S-XQCC-N56
WFI32E01PC-I	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	54	QMA	RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY	MODULE,54LEAD,.7		1.27 mm	85 Cel	-40 Cel		QUAD		R-XQMA-N54		2.6 mm	20.5 mm						24.5 mm
WGM160P022KGA3	Silicon Labs	TELECOM CIRCUIT
WP3161F5NFEI-320B1	Microchip Technology	TELECOM CIRCUIT		BALL	672	BGA	SQUARE	PLASTIC/EPOXY	YES	1						GRID ARRAY							BOTTOM		S-PBGA-B672
WT32I-E-AI6-APTX	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	50		RECTANGULAR	UNSPECIFIED	YES	1						MICROELECTRONIC ASSEMBLY			1 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N50		2.55 mm	15.9 mm						23.9 mm
XB24CZ7UITB003	Digi International	TELECOM CIRCUIT
XB3-24APT	Digi International	TELECOM CIRCUIT		UNSPECIFIED		XMA	RECTANGULAR	UNSPECIFIED	NO	1						SPECIAL SHAPE				85 Cel	-40 Cel		UNSPECIFIED	1 Mbps	R-XXMA-X
XB3-24ARS-J	Digi International	TELECOM CIRCUIT		UNSPECIFIED		XMA	RECTANGULAR	UNSPECIFIED	NO	1						SPECIAL SHAPE				85 Cel	-40 Cel		UNSPECIFIED	1 Mbps	R-XXMA-X
XB9X-DMUS-021	Digi International	TELECOM CIRCUIT		NO LEAD	37	XMA	RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED	.25 Mbps	R-XXMA-N37
2612011024000	Wurth Elektronik	TELECOM CIRCUIT
453-00046C	Laird Technologies	TELECOM CIRCUIT																														50	250
80HCPS1848CRMI	Renesas Electronics	TELECOM CIRCUIT																				Tin/Silver/Copper (Sn/Ag/Cu)				4					e1	NOT SPECIFIED	250
AD73360ARZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G28	3	2.65 mm	7.5 mm	Not Qualified		e3	30	260	17.9 mm
AD9081BBPZ-4D4AB	Analog Devices	TELECOM CIRCUIT
ADA2200ARUZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	Matte Tin (Sn)	DUAL		R-PDSO-G16	1	1.2 mm	4.4 mm			e3	30	260	5 mm
ADA2200ARUZ-REEL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	Tin (Sn)	DUAL		R-PDSO-G16	1	1.2 mm	4.4 mm			e3	30	260	5 mm
ADF7023BCPZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3 V	2/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N32	3	.8 mm	5 mm	Not Qualified		e4	30	260	5 mm
ADN2892ACPZ-500RL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1			.054 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.12SQ,20	ATM/SONET/SDH ICs	.5 mm	95 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N16	3	.9 mm	3 mm	Not Qualified		e3	30	260	3 mm
ADRF6516ACPZ-R7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N32	3	.8 mm	5 mm			e3		260	5 mm
ADRF6850BCPZ-R7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		.44 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD		S-XQCC-N56	3	1 mm	8 mm	Not Qualified		e3	30	260	8 mm
ANNA-B412-00B	U-blox Ag	TELECOM CIRCUIT
AP22804BM8-13	Diodes Incorporated	TELECOM CIRCUIT																				MATTE TIN									e3	30	260
ATA5291-GJQW	Microchip Technology	TELECOM CIRCUIT		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.28SQ,20		.5 mm				QUAD	2 Mbps	S-XQCC-N48		.95 mm	7 mm						7 mm
ATBTLC1000-MR110CA	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	XMA	RECTANGULAR	UNSPECIFIED	YES	1				3.6 V		MICROELECTRONIC ASSEMBLY	MODULE,24LEAD(UNSPEC)		.9 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N24		2.165 mm	12.7 mm						20.157 mm
BCM8727	Broadcom	TELECOM CIRCUIT		BALL	324	BGA	SQUARE	PLASTIC/EPOXY	YES	1				1 V		GRID ARRAY							BOTTOM		S-PBGA-B324				Not Qualified
BGA751N7E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	6	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR			2.8 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel	TIN	DUAL		R-PDSO-N6	1	.4 mm	1.3 mm			e3			2 mm
BGM111E256V2R	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	BUTT	31		RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY			1.2 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-B31		2.15 mm	12.9 mm						15 mm
BGM11S12F256GA-V2R	Silicon Labs	TELECOM CIRCUIT
BGM121N256V2R	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56		SQUARE	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED		S-XXMA-N56	3	1.4 mm	6.5 mm				40	260	6.5 mm
BGS13GA14E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BUTT	14	BCC	SQUARE	UNSPECIFIED	YES	1	CMOS			3 V		CHIP CARRIER			.4 mm	85 Cel	-40 Cel	GOLD NICKEL	BOTTOM		S-XBCC-B14	1	.65 mm	2 mm			e4			2 mm
BISMS02BI-01	Laird Technologies	TELECOM CIRCUIT																														NOT SPECIFIED	NOT SPECIFIED
BLUENRG-332AT	STMicroelectronics	TELECOM CIRCUIT																														NOT SPECIFIED	NOT SPECIFIED
BM71BLE01FC2-0002AA	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	17	QMA	RECTANGULAR	UNSPECIFIED	YES	1				3 V		MICROELECTRONIC ASSEMBLY	MODULE,17LEAD(UNSPEC)		1.2 mm	70 Cel	-20 Cel	Nickel/Gold (Ni/Au)	QUAD	.0086 Mbps	R-XQMA-N17		1.66 mm	6 mm			e4			8 mm
BM71BLE01FC2-0B02AA	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	17	QMA	RECTANGULAR	UNSPECIFIED	YES	1				3 V		MICROELECTRONIC ASSEMBLY	MODULE,17LEAD(UNSPEC)		1.2 mm	85 Cel	-40 Cel		QUAD	.0086 Mbps	R-XQMA-N17		1.66 mm	6 mm				30	260	8 mm
BMD-301-A-R-00	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	47	XMA	RECTANGULAR	UNSPECIFIED	YES	1				3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED	2 Mbps	R-XXMA-N47		1.9 mm	9.8 mm						14 mm
BMD-301-A-R-10	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	47	XMA	RECTANGULAR	UNSPECIFIED	YES	1				3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED	2 Mbps	R-XXMA-N47		1.9 mm	9.8 mm						14 mm
BQ500211ARGZR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	110 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N48	3	1 mm	7 mm			e4	30	260	7 mm
BQ500211ARGZT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	110 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N48	3	1 mm	7 mm			e4	30	260	7 mm
CC-MX-JN58-Z1	Digi International	TELECOM CIRCUIT
CC2530F128RHAR	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N40	3	1 mm	6 mm	Not Qualified		e4	30	260	6 mm
CC430F5133IRGZT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1				2.2 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	.5 Mbps	S-PQCC-N48	3	1 mm	7 mm	Not Qualified		e4	30	260	7 mm
CC430F6127IRGCR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	64	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1				2.2 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	QUAD	.25 Mbps	S-PQCC-N64	3	1 mm	9 mm	Not Qualified		e4	30	260	9 mm
CC430F6135IRGCR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	64	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1				2.2 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	QUAD	.25 Mbps	S-PQCC-N64	3	1 mm	9 mm	Not Qualified		e4	30	260	9 mm
CLRC632	NXP Semiconductors	TELECOM CIRCUIT		GULL WING	32	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE							DUAL		R-PDSO-G32
CLRC63201T/0FE	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	32	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE			1.27 mm	85 Cel	-25 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G32	1	2.65 mm	7.5 mm	Not Qualified		e4	30	250	20.5 mm
CMX994Q4	Cml Microcircuits	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1			.08 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N40		1 mm	6 mm	Not Qualified					6 mm
CY7B923-SC	Cypress Semiconductor	TELECOM CIRCUIT	COMMERCIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS		85 mA	5 V	5	SMALL OUTLINE	SOP28,.4	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	Tin/Lead (Sn/Pb)	DUAL		R-PDSO-G28	1	2.67 mm	7.5 mm	Not Qualified		e0	30	225	17.905 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.