TELECOM CIRCUIT Other Function Telecom Interface ICs 2,400+

Reset All
Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

XB3-24APT-J

Digi International

TELECOM CIRCUIT

UNSPECIFIED

XMA

RECTANGULAR

UNSPECIFIED

NO

1

SPECIAL SHAPE

85 Cel

-40 Cel

UNSPECIFIED

1 Mbps

R-XXMA-X

XB3-24AUM-J

Digi International

TELECOM CIRCUIT

UNSPECIFIED

XMA

RECTANGULAR

UNSPECIFIED

NO

1

SPECIAL SHAPE

85 Cel

-40 Cel

UNSPECIFIED

1 Mbps

R-XXMA-X

XCC2564MODNCMOET

Texas Instruments

TELECOM CIRCUIT

OTHER

BUTT

33

BCC

SQUARE

UNSPECIFIED

YES

1

3.6 V

CHIP CARRIER

70 Cel

-20 Cel

BOTTOM

S-XBCC-B33

1.4 mm

7 mm

7 mm

450-0106C

Laird Technologies

TELECOM CIRCUIT

NOT SPECIFIED

NOT SPECIFIED

453-00012R

Laird Technologies

TELECOM CIRCUIT

NOT SPECIFIED

NOT SPECIFIED

AD9832BRUZ-REEL

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

16

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

5 mA

3.3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G16

1

1.1 mm

4.4 mm

Not Qualified

e3

30

260

5 mm

ADL5240ACPZ-R7

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N32

3

1 mm

5 mm

Not Qualified

e3

40

260

5 mm

ADRF6821ACPZ-RL7

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

56

HVQCCN

SQUARE

UNSPECIFIED

YES

1

BICMOS

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

105 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-XQCC-N56

3

.8 mm

8 mm

e4

30

260

8 mm

ADV7480WBBCZ

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

BALL

100

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

1.8 V

GRID ARRAY, LOW PROFILE, FINE PITCH

.8 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B100

3

1.4 mm

9 mm

e1

9 mm

AS3911-BQFT

Ams Ag

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

12.5 mA

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

Other Telecom ICs

.5 mm

125 Cel

-40 Cel

QUAD

S-XQCC-N32

1 mm

5 mm

Not Qualified

5 mm

ATA5743P3-TKQY

Microchip Technology

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

20

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

.0091 mA

5 V

5

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

SSOP20,.25

Other Telecom ICs

.65 mm

105 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G20

1

1.35 mm

4.4 mm

Not Qualified

e3

6.75 mm

ATA5743P6-TGQY

Atmel

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

20

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

.0091 mA

5 V

5

SMALL OUTLINE

SOP20,.4

Other Telecom ICs

1.27 mm

105 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G20

1

7.4 mm

Not Qualified

e3

260

12.825 mm

BGM240PA32VNA3R

Silicon Labs

TELECOM CIRCUIT

BGM240PA32VNN3R

Silicon Labs

TELECOM CIRCUIT

BLUENRG-332AC

STMicroelectronics

TELECOM CIRCUIT

NOT SPECIFIED

NOT SPECIFIED

BM78SPP05MC2-0002AA

Microchip Technology

TELECOM CIRCUIT

COMMERCIAL

NO LEAD

30

XMA

RECTANGULAR

UNSPECIFIED

YES

1

1.9 V

MICROELECTRONIC ASSEMBLY

MODULE,30LEAD(UNSPEC)

1.1 mm

70 Cel

-20 Cel

GOLD OVER NICKEL

UNSPECIFIED

R-XXMA-N30

1.86 mm

12 mm

e4

40

255

15 mm

CAM-M8Q

U-blox Ag

TELECOM CIRCUIT

CY7B923-400JXC

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL

J BEND

28

QCCJ

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

.085 mA

5 V

5

CHIP CARRIER

LDCC28,.5SQ

Other Telecom ICs

1.27 mm

70 Cel

0 Cel

MATTE TIN

QUAD

400 Mbps

S-PQCC-J28

3

4.572 mm

11.5316 mm

Not Qualified

e3

20

260

11.5316 mm

CYBLE-012011-00

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

31

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

1.27 mm

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N31

3

2 mm

14.52 mm

19.2 mm

GS2962-IBE3

Semtech

TELECOM CIRCUIT

BALL

100

LBGA

SQUARE

PLASTIC/EPOXY

YES

1

1.2 V

GRID ARRAY, LOW PROFILE

BGA100,10X10,40

1 mm

85 Cel

-20 Cel

TIN SILVER COPPER

BOTTOM

2970 Mbps

S-PBGA-B100

3

1.7 mm

11 mm

e1

30

260

11 mm

HMC862ALP3ETR

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

UNSPECIFIED

YES

1

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N16

3

.9 mm

3 mm

e3

30

260

3 mm

LILY-W131-00B

U-blox Ag

TELECOM CIRCUIT

4

LMX2571NJKT

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

36

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N36

3

.8 mm

6 mm

e3

30

260

6 mm

MAX3120EUA

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

S-PDSO-G8

1

1.1 mm

3 mm

Not Qualified

e0

3 mm

MAX3120EUA+

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

Matte Tin (Sn) - annealed

DUAL

S-PDSO-G8

1

1.1 mm

3 mm

Not Qualified

e3

30

260

3 mm

NINA-W152-03B

U-blox Ag

TELECOM CIRCUIT

4

NINA-W156-03B

U-blox Ag

TELECOM CIRCUIT

4

RFFC5072TR7

Qorvo

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N32

.95 mm

5 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

5 mm

RM024-S10-C-30

Laird Technologies

TELECOM CIRCUIT

INDUSTRIAL

UNSPECIFIED

XMA

RECTANGULAR

UNSPECIFIED

NO

1

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

.5 Mbps

R-XXMA-X

ALSO AVAILABLE WITH 280kbps data rate

NOT SPECIFIED

NOT SPECIFIED

SA612AD,602

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

6 V

SMALL OUTLINE

1.27 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G8

1.75 mm

3.9 mm

Not Qualified

4.9 mm

SA639DH/01,112

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

24

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G24

1

1.1 mm

4.4 mm

Not Qualified

e4

260

7.8 mm

SC1894A-00C13

Analog Devices

TELECOM CIRCUIT

NO LEAD

64

HVQCCN

SQUARE

UNSPECIFIED

YES

1

1.8 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

QUAD

S-XQCC-N64

.9 mm

9 mm

NOT SPECIFIED

NOT SPECIFIED

9 mm

SC1894A-00M13

Analog Devices

TELECOM CIRCUIT

NO LEAD

64

HVQCCN

SQUARE

UNSPECIFIED

YES

1

1.8 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

QUAD

S-XQCC-N64

.9 mm

9 mm

NOT SPECIFIED

NOT SPECIFIED

9 mm

SKY66112-11

Skyworks Solutions

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

22

HQCCN

RECTANGULAR

UNSPECIFIED

YES

1

3 V

CHIP CARRIER, HEAT SINK/SLUG

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

R-XQCC-N22

3

1.1 mm

3 mm

e4

260

3.5 mm

ST60-2230C

Laird Technologies

TELECOM CIRCUIT

STA8089FGAD

STMicroelectronics

TELECOM CIRCUIT

NOT SPECIFIED

NOT SPECIFIED

TUSB211QRWBRQ1

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

12

VQCCN

SQUARE

PLASTIC/EPOXY

YES

1

1

AEC-Q100

.02 mA

3.3 V

CHIP CARRIER, VERY THIN PROFILE

.4 mm

105 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

480 Mbps

S-PQCC-N12

2

.4 mm

1.6 mm

e4

30

260

1.6 mm

UBX-M8030-CT

U-blox Ag

TELECOM CIRCUIT

INDUSTRIAL

BALL

47

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

AEC-Q100

3 V

GRID ARRAY

85 Cel

-40 Cel

BOTTOM

R-PBGA-B47

1

XB3-24ARS

Digi International

TELECOM CIRCUIT

UNSPECIFIED

XMA

RECTANGULAR

UNSPECIFIED

NO

1

SPECIAL SHAPE

85 Cel

-40 Cel

UNSPECIFIED

1 Mbps

R-XXMA-X

XB3-24AUS-J

Digi International

TELECOM CIRCUIT

UNSPECIFIED

XMA

RECTANGULAR

UNSPECIFIED

NO

1

SPECIAL SHAPE

85 Cel

-40 Cel

UNSPECIFIED

1 Mbps

R-XXMA-X

XBP9X-DMUS-011

Digi International

TELECOM CIRCUIT

NO LEAD

37

XMA

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

.25 Mbps

R-XXMA-N37

XBRR-24Z8UT-J

Digi International

TELECOM CIRCUIT

ZM5101A-CME3R

Silicon Labs

TELECOM CIRCUIT

450-0152C

Laird Technologies

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

47

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N47

4

2.14 mm

15.5 mm

245

21 mm

453-00046R

Laird Technologies

TELECOM CIRCUIT

50

250

ADMV4801BCCZ

Analog Devices

TELECOM CIRCUIT

NO LEAD

72

LGA

SQUARE

UNSPECIFIED

YES

1

GRID ARRAY

85 Cel

-40 Cel

BOTTOM

S-XBGA-N72

3

30

260

ADN2830ACP32

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-XQCC-N32

3

1 mm

5 mm

Not Qualified

e0

240

5 mm

ADV7480WBBCZ-RL

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

BALL

100

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

1.8 V

GRID ARRAY, LOW PROFILE, FINE PITCH

.8 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B100

3

1.4 mm

9 mm

e1

9 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.