INDUSTRIAL Other Function Telecom Interface ICs 2,400+

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Output Code	No. of Channels	Technology	Maximum Supply Current	Nominal Supply Voltage	Input Code	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Resolution (um)	Minimum Operating Temperature	Terminal Finish	Maximum Output Voltage	Terminal Position	Data Rate	JESD-30 Code	Output (V)	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Maximum Output Low Current	Input Type	Additional Features	Maximum Analog Input	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
TCA5013ZAHR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	48	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V			GRID ARRAY, THIN PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		S-PBGA-B48		3	1.2 mm	5 mm						e1	30	260	5 mm
HPA02232ARGER	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		QUAD		S-PQCC-N24		2	1 mm	4 mm						e4	NOT SPECIFIED	260	4 mm
XTNETA1622DW	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V			SMALL OUTLINE			1.27 mm	85 Cel		-40 Cel			DUAL		R-PDSO-G20			2.65 mm	7.5 mm	Not Qualified								12.8 mm
TLK1501AIRCPR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	HVFQFP	SQUARE	PLASTIC/EPOXY	YES	1					2.5 V			FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD		S-PQFP-G64		3	1 mm	10 mm	Not Qualified					e4	30	260	10 mm
TPS657051YZHT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	16	VFBGA	SQUARE	UNSPECIFIED	YES	1					3.6 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM		S-XBGA-B16		1	.625 mm	2.3 mm	Not Qualified					e1	30	260	2.3 mm
CC3135RNMRGKR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD		S-PQCC-N64		3	1 mm	9 mm						e4	30	260	9 mm
ADC32RF80IRRHT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	72	HVQCCN	SQUARE	UNSPECIFIED	YES	1					1.15 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC72,.39SQ,20		.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD	12500 Mbps	S-XQCC-N72		3	.9 mm	10 mm						e4	30	260	10 mm
TLK10081CTR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	144	HBGA	SQUARE	PLASTIC/EPOXY	YES	1					1 V			GRID ARRAY, HEAT SINK/SLUG			1 mm	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	10000 Mbps	S-PBGA-B144		4	3.25 mm	13.05 mm						e1	30	260	13.05 mm
RI-TMS37126	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	30	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1								SMALL OUTLINE				85 Cel		-40 Cel			DUAL		R-PDSO-G30					Not Qualified
TLK1501IRCPRG4	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	HVFQFP	SQUARE	PLASTIC/EPOXY	YES	1			TTL		2.5 V		2.5	FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH	TQFP64,.47SQ	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD		S-PQFP-G64		3	1 mm	10 mm	Not Qualified					e4	30	260	10 mm
ONET2591TAYS	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	11	DIE	RECTANGULAR	UNSPECIFIED	YES	1				.023 mA	3.3 V		3.3	UNCASED CHIP	DIE OR CHIP	Other Telecom ICs		85 Cel		-40 Cel			UPPER		R-XUUC-N11					Not Qualified						NOT SPECIFIED	NOT SPECIFIED
ADC32RF80IRRHR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	72	HVQCCN	SQUARE	UNSPECIFIED	YES	1					1.15 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC72,.39SQ,20		.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD	12500 Mbps	S-XQCC-N72		3	.9 mm	10 mm						e4	30	260	10 mm
CC8531RHAT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		QUAD	5 Mbps	S-PQCC-N40		3	1 mm	6 mm	Not Qualified					e4	NOT SPECIFIED	260	6 mm
PCM3793ARHBR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			CMOS		3.3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD		S-PQCC-N32		2	1 mm	5 mm	Not Qualified					e4	30	260	5 mm
TRF2432IRTQR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				.125 mA	3.3 V		3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN		QUAD		S-PQCC-N56		3	1 mm	8 mm	Not Qualified					e3	30	260	8 mm
CC1020-STB1	Texas Instruments		INDUSTRIAL	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES				CMOS		3 V		3	CHIP CARRIER	LCC32,.27SQ,25	Other Telecom ICs	.635 mm	85 Cel		-40 Cel			QUAD		S-PQCC-N32					Not Qualified
PCM3793ARHBTG4	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			CMOS		3.3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD		S-PQCC-N32		2	1 mm	5 mm	Not Qualified					e4	30	260	5 mm
ADC32RF80IRMPR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	72	HVQCCN	SQUARE	UNSPECIFIED	YES	1					1.15 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		QUAD	12500 Mbps	S-XQCC-N72		3	.9 mm	10 mm						e4	30	260	10 mm
GC4114-PQ	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			CMOS		3.3 V			FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel			QUAD		S-PQFP-G100			1.6 mm	14 mm	Not Qualified						NOT SPECIFIED	NOT SPECIFIED	14 mm
ONET8501PBRGTR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	100 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		QUAD	11300 Mbps	S-PQCC-N16		2	1 mm	3 mm	Not Qualified					e4	NOT SPECIFIED	260	3 mm
ADS58J63IRMPT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	72	HVQCCN	SQUARE	UNSPECIFIED	YES	1					1.9 V		1.9,3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC72,.39SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD	10000 Mbps	S-XQCC-N72		3	.9 mm	10 mm	Not Qualified				2 V	e4	30	260	10 mm
UCC2751N	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1			BICMOS		12 V		12	IN-LINE	DIP16,.3	Telephone Circuits	2.54 mm	85 Cel		-40 Cel	TIN LEAD		DUAL		R-PDIP-T16			5.08 mm	7.62 mm	Not Qualified					e0			19.31 mm
TRF2443IPFP	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	80	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		3.3	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP80,.55SQ	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD		S-PQFP-G80		3	1.2 mm	12 mm	Not Qualified					e4	30	260	12 mm
PCM3793ARHBRG4	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			CMOS		3.3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD		S-PQCC-N32		2	1 mm	5 mm	Not Qualified					e4	30	260	5 mm
ADC32RF83IRRHT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	72	HVQCCN	SQUARE	UNSPECIFIED	YES	1					1.15 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC72,.39SQ,20		.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD	12500 Mbps	S-XQCC-N72		3	.9 mm	10 mm						e4	30	260	10 mm
TLC320AD535IPM	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	TWOS COMPLEMENT	2	CMOS		3.3 V	TWOS COMPLEMENT	5	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	Codecs	.5 mm	85 Cel	16	-40 Cel		1.78 V	QUAD		S-PQFP-G64	VOLTAGE		1.6 mm	10 mm	Not Qualified		DIFFERENTIAL		3 V		NOT SPECIFIED	NOT SPECIFIED	10 mm
ADS58J64IRRHR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	72	HQCCN	RECTANGULAR	UNSPECIFIED	YES	1					1.15 V			CHIP CARRIER, HEAT SINK/SLUG				85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD		R-XQCC-N72		3							2 V	e4	30	260
ISO150AU/1K	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	12	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	2			BICMOS		5 V			SMALL OUTLINE			1.27 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		DUAL		R-PDSO-G12		3	2.65 mm	7.5 mm	Not Qualified					e4	30	260	17.9 mm
CC2430F64RTC	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1			CMOS		3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD	.25 Mbps	S-XQCC-N48		3	.9 mm	7 mm	Not Qualified					e4	30	260	7 mm
ISO150AU	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	12	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	2			BICMOS		5 V			SMALL OUTLINE			1.27 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		DUAL		R-PDSO-G12		3	2.65 mm	7.5 mm	Not Qualified					e4	30	260	17.9 mm
CC2431ZRTC	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	QCCN	SQUARE	UNSPECIFIED	YES	1								CHIP CARRIER				85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD		S-XQCC-N48		3		7 mm	Not Qualified					e4	30	260	7 mm
TLK4201EARGTT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				.038 mA	3.3 V		3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.12SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD	4250 Mbps	S-PQCC-N16		2	1 mm	3 mm	Not Qualified					e4	30	260	3 mm
UCC2750N	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	14	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1			BICMOS		15 V			IN-LINE			2.54 mm	85 Cel		-40 Cel			DUAL		R-PDIP-T14			5.08 mm	15.24 mm	Not Qualified								36.36 mm
TLK10022CTR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	144	HBGA	SQUARE	PLASTIC/EPOXY	YES	1					1 V			GRID ARRAY, HEAT SINK/SLUG			1 mm	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	10000 Mbps	S-PBGA-B144		4	3.25 mm	13.05 mm						e1	30	260	13.05 mm
CC2430F32RTCG3	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1			CMOS		3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD		S-XQCC-N48		3	.9 mm	7 mm	Not Qualified					e4	30	260	7 mm
CC2431RTC	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	QCCN	SQUARE	UNSPECIFIED	YES	1								CHIP CARRIER				85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD		S-XQCC-N48		3		7 mm	Not Qualified					e4	30	260	7 mm
PCM3794ARHBRG4	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			CMOS		3.3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD		S-PQCC-N32		2	1 mm	5 mm	Not Qualified					e4	30	260	5 mm
TRF37C32IRTVT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		2			3.3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)		QUAD		S-PQCC-N32		2	.8 mm	5 mm				RF frequency(Min)(MHz) is 1700; RF frequency(Max)(MHz) is 3800		e4	30	260	5 mm
SN74AVC6T622PWR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				.015 mA	1.5 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	3.6 V	DUAL	50 Mbps	R-PDSO-G20		1	1.2 mm	4.4 mm	Not Qualified	16 Amp				e4	30	260	6.5 mm
TNETA1630DWR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	20	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1				50 mA	5 V			IN-LINE				85 Cel		-40 Cel			DUAL		R-PDIP-T20					Not Qualified
ADS58J64IRMPT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	72	HVQCCN	SQUARE	UNSPECIFIED	YES	1					1.15 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD		S-XQCC-N72		3	.9 mm	10 mm					2 V	e4	30	260	10 mm
TRF3703IRGET	Texas Instruments		INDUSTRIAL	NO LEAD	24	QCCN	SQUARE	PLASTIC/EPOXY	YES						5 V		5	CHIP CARRIER	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel			QUAD		S-PQCC-N24					Not Qualified
LMX5252LQX/NOPB	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1			CMOS	.055 mA	2.75 V		2.75	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN		QUAD		S-XQCC-N36		3	.8 mm	6 mm	Not Qualified					e3	30	260	6 mm
LMV1099TL	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	25	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					3.6 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel			BOTTOM		R-PBGA-B25			.675 mm	2.644 mm	Not Qualified								2.771 mm
UCC2750DW	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			BICMOS		5 V			SMALL OUTLINE			1.27 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		DUAL	.25 Mbps	R-PDSO-G28		2	2.65 mm	7.5 mm	Not Qualified					e4	30	260	17.9 mm
LM15851NKET	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	68	VQCCN	SQUARE	UNSPECIFIED	YES	1					1.2 V			CHIP CARRIER, VERY THIN PROFILE			.45 mm	85 Cel		-40 Cel	MATTE TIN		QUAD	4000 Mbps	S-XQCC-N68		3	1 mm	10 mm					1.995 V	e3	30	260	10 mm
LMV242MDA	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	10	DIE	RECTANGULAR	UNSPECIFIED	YES	1			BIPOLAR		2.6 V			UNCASED CHIP				85 Cel		-40 Cel			UPPER		R-XUUC-N10		1			Not Qualified
TRF2443IPFPR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	80	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		3.3	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP80,.55SQ	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD		S-PQFP-G80		3	1.2 mm	12 mm	Not Qualified					e4	30	260	12 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.