INDUSTRIAL Other Function Telecom Interface ICs 2,400+

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Technology	Screening Level	No. of Transceivers	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Input Type	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
CC2595RGTT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	1					3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N16	2	1 mm	3 mm			e4	30	260	3 mm
CC2510F8RSPG3	Texas Instruments		INDUSTRIAL	NO LEAD	36	QCCN	SQUARE	PLASTIC/EPOXY	YES			CMOS					2.5/3.3	CHIP CARRIER	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N36	3			Not Qualified		e4	30	260
CC2595RGTR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	1					3 V	3	CHIP CARRIER	LCC16,.12SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N16	2	1 mm	3 mm	Not Qualified		e4	30	260	3 mm
CC2560BYFVT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	54	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1						3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		R-PBGA-B54	1	.575 mm	2.925 mm			e1	30	260	3.265 mm
SN65LVPE502ARGER	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	2				.12 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD		S-PQCC-N24	2	1 mm	4 mm	Not Qualified		e4	NOT SPECIFIED	260	4 mm
CC2560BRVMR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	76	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1						3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.6 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	4 Mbps	R-PQCC-N76	3	.9 mm	7.73 mm			e3	30	260	8 mm
SN65DSI86ZQET	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	64	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1						1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B64		1 mm	5 mm						5 mm
CC2640F128RGZ	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N48	3	1 mm	7 mm			e4			7 mm
TLK2501IRCPRG4	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	HVFQFP	SQUARE	PLASTIC/EPOXY	YES	1				1		2.5 V	2.5	FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH	TQFP64,.47SQ	Network Interfaces	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	2500 Mbps	S-PQFP-G64	3	1 mm	10 mm	Not Qualified		e4	30	260	10 mm
TLK2701IRCPG4	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	HVFQFP	SQUARE	PLASTIC/EPOXY	YES	1						2.5 V	2.5	FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH	TQFP64,.47SQ	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQFP-G64	3	1 mm	10 mm	Not Qualified		e4	30	260	10 mm
TSC2200IRHBR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						2.7 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N32	2	1 mm	5 mm	Not Qualified	SINGLE-ENDED	e4	30	260	5 mm
SN65LVCP40RGZR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					.254 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	4000 Mbps	S-PQCC-N48	3	1 mm	7 mm	Not Qualified		e4	NOT SPECIFIED	260	7 mm
BQ51010BYFPR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	28	VFBGA	RECTANGULAR	UNSPECIFIED	YES	1								GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		R-XBGA-B28	1	.5 mm	1.88 mm			e1	30	260	3 mm
TMS37145TEAIEG	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	UNSPECIFIED			UNSPECIFIED	PLASTIC/EPOXY	NO	1								SPECIAL SHAPE				85 Cel	-40 Cel		UNSPECIFIED		X-PXSS-X	1						30	260
TSC2200IRHBRG4	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						2.7 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N32	2	1 mm	5 mm	Not Qualified		e4	30	260	5 mm
CC430F6135IRGC	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	64	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1						2.2 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N64	3	1 mm	9 mm	Not Qualified		e4	30	260	9 mm
CC2541SRHAT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N40	3	1 mm	6 mm			e4	30	260	6 mm
SN65DSI96ZQER	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	64	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1						1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B64		1 mm	5 mm						5 mm
SN65LVCP40RGZTG4	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					.254 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	4000 Mbps	S-PQCC-N48	3	1 mm	7 mm	Not Qualified		e4	NOT SPECIFIED	260	7 mm
TUSB214QRWBTQ1	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	12	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1	1		AEC-Q100		.03 mA	3.3 V		CHIP CARRIER, VERY THIN PROFILE			.4 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	480.24 Mbps	S-PQCC-N12	2	.4 mm	1.6 mm			e4	30	260	1.6 mm
PGA5807RGCT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N64	3	1 mm	9 mm			e4	30	260	9 mm
TSC2005IYZLT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	28	VFBGA	RECTANGULAR	UNSPECIFIED	YES	1								GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		R-XBGA-B28	1	.625 mm	2.75 mm	Not Qualified		e1	30	260	3.25 mm
CC110LRTK	Texas Instruments		INDUSTRIAL	NO LEAD	20	QCCN	SQUARE	PLASTIC/EPOXY	YES								1.8/3.6	CHIP CARRIER	LCC20,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N20				Not Qualified
CC2564RVMR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	76	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1						3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.6 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		R-PQCC-N76	3	.9 mm	7.73 mm			e3	30	260	8 mm
CC430F6126IRGC	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	64	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1						2.2 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N64		1 mm	9 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	9 mm
TLK2541PFPG4	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	80	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1						2.5 V	2.5	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP80,.55SQ	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQFP-G80	3	1.2 mm	12 mm	Not Qualified		e4	30	260	12 mm
BQ51010BYFPT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	28	VFBGA	RECTANGULAR	UNSPECIFIED	YES	1								GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		R-XBGA-B28	1	.5 mm	1.88 mm			e1	30	260	3 mm
SN65LVPE502BRGER	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	2				.12 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD		S-PQCC-N24	2	1 mm	4 mm	Not Qualified		e4	NOT SPECIFIED	260	4 mm
SN65DSI84ZQET	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	64	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1						1.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B64		1 mm	5 mm						5 mm
TMS3705CDRQ1	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100			5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G16	3	1.75 mm	3.9 mm			e4	30	260	9.9 mm
CC2564NSYFVT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	54	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1						3.6 V		GRID ARRAY				85 Cel	-40 Cel		BOTTOM		R-PBGA-B54	1						30	260
SN65LVCP40RGZ	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					.254 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	4000 Mbps	S-PQCC-N48	3	1 mm	7 mm	Not Qualified		e4	NOT SPECIFIED	260	7 mm
CC2550RTKR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1						3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.16SQ,25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N16		.95 mm	4 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	4 mm
CC2560BRVMT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	76	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.6 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQCC-N76	3	.9 mm	8 mm			e3	30	260	8 mm
SN65DSI96ZQET	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	64	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1						1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B64		1 mm	5 mm						5 mm
SN761631PAP	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1						5 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		QUAD		S-PQFP-G64		1.2 mm	10 mm	Not Qualified					10 mm
TLK2541PFPRG4	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	80	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1						2.5 V	2.5	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP80,.55SQ	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQFP-G80	3	1.2 mm	12 mm	Not Qualified		e4	30	260	12 mm
LMX9820ASM	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	116	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS				3.3 V		GRID ARRAY			1 mm	85 Cel	-40 Cel		BOTTOM		R-PBGA-B116		2 mm	9.95 mm						14 mm
TUSB212IRWBT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	12	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1	1				.03 mA	3.3 V		CHIP CARRIER, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	480.24 Mbps	S-PQCC-N12	2	.4 mm	1.6 mm			e4	30	260	1.6 mm
SN65LVPE502ARLLR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	2				.12 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.12SQ,20/16	Other Telecom ICs	.4 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD		S-PQCC-N24	2	1 mm	3 mm	Not Qualified		e4	NOT SPECIFIED	260	3 mm
CC2560BYFVR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	54	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1						3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		R-PBGA-B54	1	.575 mm	2.925 mm			e1	30	260	3.265 mm
BQ500210RGZR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						3.3 V		CHIP CARRIER			.5 mm	110 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD		S-PQCC-N48	3	1 mm	8 mm	Not Qualified		e4	NOT SPECIFIED	260	8 mm
TLK2701IRCP	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	HVFQFP	SQUARE	PLASTIC/EPOXY	YES	1						2.5 V	2.5	FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH	TQFP64,.47SQ	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQFP-G64	3	1 mm	10 mm	Not Qualified		e4	30	260	10 mm
TLK2711AIRCPRG4	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	HVFQFP	SQUARE	PLASTIC/EPOXY	YES	1						2.5 V	2.5	FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH	TQFP64,.47SQ	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQFP-G64	3	1 mm	10 mm	Not Qualified		e4	30	260	10 mm
CC2564BYFVT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	54	VFBGA	RECTANGULAR	UNSPECIFIED	YES	1								GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	4 Mbps	R-XBGA-B54	1					e1	30	260
CC1110-RTY1	Texas Instruments		INDUSTRIAL	NO LEAD	36	QCCN	SQUARE	PLASTIC/EPOXY	YES			CMOS				3 V	3	CHIP CARRIER	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N36				Not Qualified
TSC2200IPWRG4	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						2.7 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL		R-PDSO-G28	1	1.2 mm	4.4 mm	Not Qualified	SINGLE-ENDED	e4	NOT SPECIFIED	260	9.7 mm
CC2564NSYFVR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	54	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1						3.6 V		GRID ARRAY				85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		R-PBGA-B54	1					e1	30	260

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.