INDUSTRIAL Other Function Telecom Interface ICs 2,400+

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Carrier Type-3	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Carrier Type-2	Carrier Type-1	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
ADP5585ACPZ-01-R7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1				1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N16	3	.8 mm			3 mm		e3	30	260	3 mm
ADP5589ACBZ-02-R7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	25	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH				.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B25	1	.56 mm			1.99 mm		e1	30	260	1.99 mm
AD8285WBCPZ-RL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	72	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS	AEC-Q100		1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				.5 mm	105 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N72	3	.9 mm			10 mm		e3	30	260	10 mm
HMC705LP4ETR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQCC-N24	1	1 mm			4 mm		e3	30	260	4 mm
AD6458ARSRL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		.022 mA	3.3 V	3/3.3	SMALL OUTLINE	SSOP20,.3	Other Telecom ICs		.635 mm	85 Cel	-40 Cel	TIN LEAD	DUAL		R-PDSO-G20						Not Qualified	e0
ADF5902WCCPZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1		AEC-Q100		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				.5 mm	105 Cel	-40 Cel		QUAD		S-XQCC-N32	3	.8 mm			5 mm				260	5 mm
LTC4403-2EMS#TRPBF	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				.5 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-G10	1	1.1 mm			3 mm	Not Qualified	e3	30	260	3 mm
LTC4402-1EMS8	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL		S-PDSO-G8	1	1.1 mm			3 mm	Not Qualified	e0			3 mm
ADM1041ARQZ-REEL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			5 V		SMALL OUTLINE, SHRINK PITCH				.635 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G24	1	1.7526 mm			3.9116 mm	Not Qualified	e3		260	8.6614 mm
HMC305BLP4E	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N24		1 mm			4 mm					4 mm
LT5500EGN	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, SHRINK PITCH				.635 mm	85 Cel	-40 Cel	TIN LEAD	DUAL		R-PDSO-G24	1	1.727 mm			3.899 mm	Not Qualified	e0			8.649 mm
LT5504EMS8#PBF	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				.65 mm	85 Cel	-40 Cel	Matte Tin (Sn)	DUAL		S-PDSO-G8	1	1.1 mm			3 mm	Not Qualified	e3	30	260	3 mm
LTP5900IPC-WHMA#PBF	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	22		RECTANGULAR	UNSPECIFIED	NO	1				3.6 V		MICROELECTRONIC ASSEMBLY					85 Cel	-40 Cel		DUAL		R-XDMA-T22								NOT SPECIFIED	NOT SPECIFIED
AD6122ARS	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			3 V	3	SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	Other Telecom ICs		.65 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G28		1.98 mm			5.3 mm	Not Qualified				10.21 mm
LTC4402-2EMS#TRPBF	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				.5 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-G10	1	1.1 mm			3 mm	Not Qualified	e3	30	260	3 mm
LT5554IUH#TRPBF	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQCC-N32	1	.8 mm			5 mm	Not Qualified	e3	30	260	5 mm
LTP5902IPC-IPRAXXX#PBF	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	66	XMA	RECTANGULAR	UNSPECIFIED	NO	1				3.6 V		MICROELECTRONIC ASSEMBLY					85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N66					24 mm			NOT SPECIFIED	NOT SPECIFIED	37.465 mm
LT5557EUF#TRPBF	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				.65 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQCC-N16	1	.8 mm			4 mm	Not Qualified	e3	30	260	4 mm
AD6435	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	128	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V	3.3	FLATPACK	QFP128,.63X.87,20	Other Telecom ICs		.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	12.288 Mbps	R-PQFP-G128						Not Qualified	e0
FIDO5100CBCZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,12X12,32			.8 mm	105 Cel	-40 Cel		BOTTOM		S-PBGA-B144		1.24 mm			10 mm			NOT SPECIFIED	NOT SPECIFIED	10 mm
ADL5353XCPZ-R71	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS			5 V		CHIP CARRIER				.65 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N20		.9 mm			5 mm	Not Qualified				5 mm
LT5504EMS8#TR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL		S-PDSO-G8	1	1.1 mm			3 mm	Not Qualified	e0			3 mm
AD9993BBCPZRL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V		GRID ARRAY, LOW PROFILE, FINE PITCH				.8 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B196		1.4 mm			12 mm					12 mm
HMC310MS8GE	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	HTSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH				.65 mm	85 Cel	-40 Cel	Matte Tin (Sn)	DUAL		S-PDSO-G8	1	1.1 mm			3 mm	Not Qualified	e3	40	260	3 mm
LT5500EGN#PBF	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, SHRINK PITCH				.635 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G24	1	1.727 mm			3.899 mm	Not Qualified	e3	30	260	8.649 mm
AD974BRS-RL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			5 V		SMALL OUTLINE, SHRINK PITCH				.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL		R-PDSO-G28	1	2 mm			5.3 mm	Not Qualified	e0		240	10.2 mm
AD6439BS	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	128	FQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		FLATPACK, FINE PITCH				.5 mm	85 Cel	-40 Cel		QUAD		R-PQFP-G128		2.35 mm			14 mm	Not Qualified				20 mm
ADF9010BCPZ-RL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS		.41 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N48	3	1 mm			7 mm	Not Qualified	e3		260	7 mm
LT5504EMS8	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL		S-PDSO-G8	1	1.1 mm			3 mm	Not Qualified	e0			3 mm
AD974ARSZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			5 V		SMALL OUTLINE, SHRINK PITCH				.65 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G28	3	2 mm			5.3 mm	Not Qualified	e3	30	260	10.2 mm
AD6122ARSRL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			3 V	3	SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	Other Telecom ICs		.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL		R-PDSO-G28		1.98 mm			5.3 mm	Not Qualified	e0			10.21 mm
ADP5586ACBZ-03-R7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	16	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH				.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B16	1	.545 mm			1.59 mm		e1			1.59 mm
AD6121ACP	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS			3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs		.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD		S-XQCC-N32		1 mm			5 mm	Not Qualified	e0			5 mm
LTC4400-2EMS8	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL		S-PDSO-G8	1	1.1 mm			3 mm	Not Qualified	e0			3 mm
LTC4400-1ES6#PBF	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	6	VSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.6 V		SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH				.95 mm	85 Cel	-40 Cel	Matte Tin (Sn)	DUAL		R-PDSO-G6	1	1 mm			1.6 mm	Not Qualified	e3	30	260	2.9 mm
LTC4403-2EMS#PBF	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				.5 mm	85 Cel	-40 Cel	Matte Tin (Sn)	DUAL		S-PDSO-G10	1	1.1 mm			3 mm	Not Qualified	e3	30	260	3 mm
ADP5585ACBZ-01-R7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	16	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH				.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B16	1	.545 mm			1.59 mm		e1	30	260	1.59 mm
ADL5353ACPZ-R7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				.65 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N20	1	.9 mm			5 mm	Not Qualified	e3			5 mm
AD8283WBCPZ-RL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	72	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS	AEC-Q100	.19 mA	1.8 V	1.8/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC72,.39SQ,20	ATM/SONET/SDH ICs		.5 mm	105 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N72	3	.9 mm			10 mm	Not Qualified	e3	30	260	10 mm
ADP5589ACPZ-01-R7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1				1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N24	3	.8 mm			3.5 mm		e3	30	260	3.5 mm
ADL5350ACPZ-R2	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	RECTANGULAR	UNSPECIFIED	YES	1				3 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE				.5 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		R-XDSO-N8	1	1 mm			2 mm	Not Qualified	e3	30	260	3 mm
78P2344-IEL/A07	Analog Devices		INDUSTRIAL	GULL WING	100	QFP	SQUARE	PLASTIC/EPOXY	YES				355 mA	3.3 V	3.3	FLATPACK	QFP100,.63SQ,20	Other Telecom ICs	T-3(DS3)	.5 mm	85 Cel	-40 Cel		QUAD		S-PQFP-G100			STS-1/OC-1	E-3		Not Qualified
78P2342JAT-IGT/A07	Analog Devices		INDUSTRIAL	GULL WING	100	QFP	SQUARE	PLASTIC/EPOXY	YES				196 mA	3.3 V	3.3	FLATPACK	QFP100,.63SQ,20	Other Telecom ICs	T-3(DS3)	.5 mm	85 Cel	-40 Cel		QUAD		S-PQFP-G100			STS-1/OC-1	E-3		Not Qualified
PHY1070-01QD-RR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				.5 mm	85 Cel	-40 Cel	NICKEL GOLD PALLADIUM	QUAD		S-XQCC-N36	1	.95 mm			6 mm			30	260	6 mm
SC1905A-00A00	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS			1.85 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				.5 mm	105 Cel	-40 Cel		QUAD		S-XQCC-N64		.9 mm			9 mm			NOT SPECIFIED	NOT SPECIFIED	9 mm
78P2344JAT-IEL/A07R	Analog Devices		INDUSTRIAL	GULL WING	100	QFP	SQUARE	PLASTIC/EPOXY	YES				380 mA	3.3 V	3.3	FLATPACK	QFP100,.63SQ,20	Other Telecom ICs	T-3(DS3)	.5 mm	85 Cel	-40 Cel		QUAD		S-PQFP-G100			STS-1/OC-1	E-3		Not Qualified
78P2342-IGT/A07R	Analog Devices		INDUSTRIAL	GULL WING	100	QFP	SQUARE	PLASTIC/EPOXY	YES				187 mA	3.3 V	3.3	FLATPACK	QFP100,.63SQ,20	Other Telecom ICs	T-3(DS3)	.5 mm	85 Cel	-40 Cel		QUAD		S-PQFP-G100			STS-1/OC-1	E-3		Not Qualified
78P2343JAT-IEL/A07	Analog Devices		INDUSTRIAL	GULL WING	100	QFP	SQUARE	PLASTIC/EPOXY	YES				380 mA	3.3 V	3.3	FLATPACK	QFP100,.63SQ,20	Other Telecom ICs	T-3(DS3)	.5 mm	85 Cel	-40 Cel		QUAD		S-PQFP-G100			STS-1/OC-1	E-3		Not Qualified

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.