INDUSTRIAL Other Function Telecom Interface ICs 2,400+

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Carrier Type-3	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Carrier Type-2	Carrier Type-1	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
78P2342-IGT/A07R/F	Analog Devices		INDUSTRIAL	GULL WING	100	QFP	SQUARE	PLASTIC/EPOXY	YES				187 mA	3.3 V	3.3	FLATPACK	QFP100,.63SQ,20	Other Telecom ICs	T-3(DS3)	.5 mm	85 Cel	-40 Cel		QUAD		S-PQFP-G100			STS-1/OC-1	E-3		Not Qualified
MAX3799ETJ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BIPOLAR			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N32		.8 mm			5 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	5 mm
SC1905A-00A00E	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS			1.85 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				.5 mm	105 Cel	-40 Cel		QUAD		S-XQCC-N64		.9 mm			9 mm				NOT SPECIFIED	NOT SPECIFIED	9 mm
78P2343-IEL/A07R/F	Analog Devices		INDUSTRIAL	GULL WING	100	QFP	SQUARE	PLASTIC/EPOXY	YES				355 mA	3.3 V	3.3	FLATPACK	QFP100,.63SQ,20	Other Telecom ICs	T-3(DS3)	.5 mm	85 Cel	-40 Cel		QUAD		S-PQFP-G100			STS-1/OC-1	E-3		Not Qualified
MAX3946ETG+	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BIPOLAR			3.3 V		CHIP CARRIER				.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N24	1	.8 mm			4 mm	Not Qualified		e3	30	260	4 mm
MAX3964AETP+	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1			.045 mA	3.3 V	3.3/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.16SQ,20	ATM/SONET/SDH ICs		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N20	1	.8 mm			4 mm	Not Qualified		e3	30	260	4 mm
AD974BN	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	BICMOS			5 V		IN-LINE				2.54 mm	85 Cel	-40 Cel	TIN LEAD	DUAL		R-PDIP-T28		5.33 mm			7.62 mm	Not Qualified		e0			36.687 mm
AD6624ABC	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			2.5 V	2.5,3.3	GRID ARRAY, LOW PROFILE	BGA196,14X14,40	Other Telecom ICs		1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM		S-PBGA-B196		1.5 mm			15 mm	Not Qualified		e0			15 mm
AD974ARS	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			5 V		SMALL OUTLINE, SHRINK PITCH				.65 mm	85 Cel	-40 Cel	Tin/Lead (Sn85Pb15)	DUAL		R-PDSO-G28	1	2 mm			5.3 mm	Not Qualified		e0	30	240	10.2 mm
AD974AR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			5 V		SMALL OUTLINE				1.27 mm	85 Cel	-40 Cel	TIN LEAD	DUAL		R-PDSO-G28	3	2.65 mm			7.5 mm	Not Qualified		e0		240	17.9 mm
LTC4400-2EMS8#TR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL		S-PDSO-G8	1	1.1 mm			3 mm	Not Qualified		e0			3 mm
AD9082BBPZ-4D2AC	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	324	FBGA	SQUARE	PLASTIC/EPOXY	YES	1				1 V		GRID ARRAY, FINE PITCH	BGA324,18X18,32			.8 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B324	3	1.72 mm			15 mm		IT CAN ALSO OPERATE WITH 1.8 AND 2 V		30	260	15 mm
HMC917LP3ETR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N16	1	1 mm			3 mm					260	3 mm
AD6122ACP	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS			3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs		.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD		S-PQCC-N32		1 mm			5 mm	Not Qualified		e0			5 mm
ADM1041ARQZ-REEL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			5 V		SMALL OUTLINE, SHRINK PITCH				.635 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL		R-PDSO-G24	1	1.7526 mm			3.9116 mm	Not Qualified		e3	30	260	8.6614 mm
AD6436	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	128	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		FLATPACK					85 Cel	-40 Cel		QUAD		R-PQFP-G128						Not Qualified
AD974BRS	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			5 V		SMALL OUTLINE, SHRINK PITCH				.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL		R-PDSO-G28	1	2 mm			5.3 mm	Not Qualified		e0		240	10.2 mm
HMC773LC3BTR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	12	HVQCCN	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	1						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				.5 mm	85 Cel	-40 Cel	GOLD OVER NICKEL	QUAD		S-CQCC-N12	3	.92 mm			3 mm	Not Qualified		e4		260	3 mm
ADF5904WCCPZ-RL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1		AEC-Q100		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				.5 mm	105 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N32	3	.8 mm			5 mm			e3	30	260	5 mm
ADL5350ACPZ-WP	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	RECTANGULAR	UNSPECIFIED	YES	1				3 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE				.5 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		R-XDSO-N8	1	1 mm			2 mm	Not Qualified		e3	30	260	3 mm
LTM9004IV-AA#PBF	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	204	LGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		GRID ARRAY				1.27 mm	85 Cel	-40 Cel	GOLD	BOTTOM		R-PBGA-N204		2.97 mm			15 mm	Not Qualified		e4			22 mm
LTC4402-1EMS8#TRPBF	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				.65 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-G8	1	1.1 mm			3 mm	Not Qualified		e3		260	3 mm
ADP5589ACPZ-02-R7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1				1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N24	3	.8 mm			3.5 mm			e3	30	260	3.5 mm
HMC748LC3C	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HQCCN	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG				.5 mm	85 Cel	-40 Cel	GOLD OVER NICKEL	QUAD		S-CQCC-N16	3	1.31 mm			3 mm	Not Qualified		e4	30	260	3 mm
LTM9004IV-AC#PBF	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	204	LGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		GRID ARRAY				1.27 mm	85 Cel	-40 Cel	GOLD	BOTTOM		R-PBGA-N204		2.97 mm			15 mm	Not Qualified		e4			22 mm
AD6679BBPZRL7-500	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	196	HBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.25 V		GRID ARRAY, HEAT SINK/SLUG				.8 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B196	3	1.49 mm			12 mm				30	260	12 mm
AD974AN	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	BICMOS			5 V		IN-LINE				2.54 mm	85 Cel	-40 Cel	TIN LEAD	DUAL		R-PDIP-T28		5.33 mm			7.62 mm	Not Qualified		e0			36.687 mm
AD6140ARS	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.7 V		SMALL OUTLINE, SHRINK PITCH				.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL		R-PDSO-G20		1.98 mm			5.29 mm	Not Qualified		e0			7.2 mm
AD6624XS	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	128	FQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			2.5 V		FLATPACK, FINE PITCH				.5 mm	85 Cel	-40 Cel		QUAD		R-PQFP-G128		3.4 mm			14 mm	Not Qualified					20 mm
HMC738LP4ETR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQCC-N24	1	1 mm			4 mm			e3	30	260	4 mm
HMC310MS8GTR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				.65 mm	85 Cel	-40 Cel		DUAL		S-PDSO-G8		1.1 mm			3 mm						3 mm
AD6623ABCZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			2.5 V		GRID ARRAY, LOW PROFILE				1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B196	3	1.5 mm			15 mm	Not Qualified		e1		260	15 mm
ADA4961ACPZ-R7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N24		.8 mm			4 mm						4 mm
LTC4403-2EMS#TR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				.5 mm	85 Cel	-40 Cel	TIN LEAD	DUAL		S-PDSO-G10	1	1.1 mm			3 mm	Not Qualified		e0			3 mm
ADL5246ACPZN-R7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				.5 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N32	3	.8 mm			5 mm			e4	30	260	5 mm
AD7011ARS	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			5 V	5	SMALL OUTLINE, SHRINK PITCH	SSOP24,.3	Other Telecom ICs		.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL		R-PDSO-G24		2 mm			5.3 mm	Not Qualified		e0			8.2 mm
LTP5903IPC-WHRBXXX#PBF	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD		DIE	RECTANGULAR	UNSPECIFIED	YES					5 V		UNCASED CHIP	DIE OR CHIP				85 Cel	-40 Cel		UPPER	.25 Mbps	R-XUUC-N		19.685 mm			102.87 mm				NOT SPECIFIED	NOT SPECIFIED	55.626 mm
AD6122ACPRL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS			3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs		.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD		S-PQCC-N32		1 mm			5 mm	Not Qualified		e0			5 mm
ADL5354ACPZ-R2	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N36	1	1 mm			6 mm	Not Qualified		e3			6 mm
ADP5585ACPZ-03-R7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1				1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N16	3	.8 mm			3 mm			e3	30	260	3 mm
ADL5335ACPZN-R7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N16	3	.8 mm			4 mm			e4	30	260	4 mm
ADRF6820ACPZ-R7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N40		.8 mm			6 mm				NOT SPECIFIED	NOT SPECIFIED	6 mm
AD6674BCPZRL7-750	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1				1.25 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N64	3	.8 mm			9 mm			e3		260	9 mm
LT5500EGN#TR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, SHRINK PITCH				.635 mm	85 Cel	-40 Cel	TIN LEAD	DUAL		R-PDSO-G24	1	1.727 mm			3.899 mm	Not Qualified		e0			8.649 mm
HMC737LP4	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				4.2 V		CHIP CARRIER				.5 mm	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)	QUAD		S-PQCC-N24	1	1 mm			4 mm	Not Qualified		e0			4 mm
AD6121ARS	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	UNSPECIFIED	YES	1	BICMOS			3 V	3	SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	Other Telecom ICs		.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL		R-XDSO-G28		1.98 mm			5.3 mm	Not Qualified		e0			10.2 mm
AD6459ARS	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE					85 Cel	-40 Cel	TIN LEAD	DUAL		R-PDSO-G20						Not Qualified		e0
AD9993BBCZRL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V		GRID ARRAY, LOW PROFILE, FINE PITCH				.8 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B196	3	1.4 mm			12 mm				30	260	12 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.