INDUSTRIAL Other Function Telecom Interface ICs 2,400+

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
HMC7891	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	UNSPECIFIED	4		RECTANGULAR	UNSPECIFIED	NO	1				8 V		FLANGE MOUNT				85 Cel	-40 Cel		UNSPECIFIED		R-XXFM-X4	1
AD6674BCPZ-1000	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1				1.25 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N64	3	.8 mm	9 mm		e3		260	9 mm
HMC920LP5E	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	1				15 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-CQCC-N32	1	1 mm	5 mm	Not Qualified	e3	30	260	5 mm
ADM1041AARQZ-REEL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			5 V		SMALL OUTLINE, SHRINK PITCH			.635 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G24	1	1.7526 mm	3.9116 mm	Not Qualified	e3		260	8.6614 mm
HMC920LP5ETR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	1				15 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-CQCC-N32	1	1 mm	5 mm		e3	30	260	5 mm
LTC4402-1EMS8#PBF	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	Matte Tin (Sn)	DUAL		S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified	e3	30	260	3 mm
HMC739LP4TR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N24		1 mm	4 mm					4 mm
AD7013ARS-REEL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			5 V	5	SMALL OUTLINE, SHRINK PITCH	SOP28,.3	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL		R-PDSO-G28		2 mm	5.3 mm	Not Qualified	e0			10.2 mm
ADP5585ACBZ-04-R7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	16	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.65 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B16	1	.545 mm	1.59 mm		e1			1.59 mm
ADL5506WACBZ-R7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS	AEC-Q100		3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA6,2X3,16		.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		R-PBGA-B6	1	.56 mm	.79 mm		e1	30	260	1.19 mm
FIDO5210BBCZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,12X12,32		.8 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B144		1.24 mm	10 mm			NOT SPECIFIED	NOT SPECIFIED	10 mm
HMC736LP4E	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				4.2 V		CHIP CARRIER			.5 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD		S-PQCC-N24	1	1 mm	4 mm	Not Qualified	e3	30	260	4 mm
AD6674BCPZRL7-500	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1				1.25 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N64	3	.8 mm	9 mm		e3		260	9 mm
LTC4400-1ES6	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	6	VSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.6 V		SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH			.95 mm	85 Cel	-40 Cel	TIN LEAD	DUAL		R-PDSO-G6	1	1 mm	1.6 mm	Not Qualified	e0			2.9 mm
AD6623ABC	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			2.5 V		GRID ARRAY, LOW PROFILE			1 mm	85 Cel	-40 Cel	TIN LEAD SILVER	BOTTOM		S-PBGA-B196	3	1.5 mm	15 mm	Not Qualified	e0		240	15 mm
LTP5901IPC-WHMAXXX#PBF	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	66	DIE	RECTANGULAR	UNSPECIFIED	YES					3.6 V		UNCASED CHIP	DIE OR CHIP			85 Cel	-40 Cel		UPPER	.25 Mbps	R-XUUC-N66		5.5 mm	24 mm			NOT SPECIFIED	NOT SPECIFIED	42 mm
HMC739LP4	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD		S-PQCC-N24	1	1 mm	4 mm	Not Qualified	e0	20	235	4 mm
LTP5901IPC-IPRB1C1#PBF	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	66	XMA	RECTANGULAR	PLASTIC/EPOXY	YES	1	HYBRID			3.6 V		MICROELECTRONIC ASSEMBLY	MODULE66(UNSPEC)		1 mm	85 Cel	-40 Cel		QUAD	.25 Mbps	R-PXMA-N66		3.54 mm	24 mm			NOT SPECIFIED	NOT SPECIFIED	42 mm
ADL5335ACPZN	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N16	3	.8 mm	4 mm		e4	30	260	4 mm
ADL5391ACPZ-WP	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BIPOLAR			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N16	3	.9 mm	3 mm	Not Qualified	e3	30	260	3 mm
ADP5585ACBZ-02-R7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	16	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B16	1	.545 mm	1.59 mm		e1			1.59 mm
LTC4402-2EMS#TR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	85 Cel	-40 Cel	TIN LEAD	DUAL		S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified	e0			3 mm
ADP5589ACBZ-00-R7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	25	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B25	1	.56 mm	1.99 mm		e1	30	260	1.99 mm
ADF9010BCPZ-RL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS		.41 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N48	3	1 mm	7 mm	Not Qualified	e3		260	7 mm
HMC-C200-8100	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	UNSPECIFIED		XMA	SQUARE		NO	1				6.5 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel				S-XXMA-X		26.67 mm	38.1 mm					38.1 mm
HMC-C200-8300	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	UNSPECIFIED		XMA	SQUARE		NO	1				6.5 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel				S-XXMA-X		26.67 mm	38.1 mm					38.1 mm
HMC-C200-8050	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	UNSPECIFIED		XMA	SQUARE		NO	1				6.5 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel				S-XXMA-X		26.67 mm	38.1 mm					38.1 mm
HMC-C200-8250	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	UNSPECIFIED		XMA	SQUARE		NO	1				6.5 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel				S-XXMA-X		26.67 mm	38.1 mm					38.1 mm
HMC-C200-8025	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	UNSPECIFIED		XMA	SQUARE		NO	1				6.5 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel				S-XXMA-X		26.67 mm	38.1 mm					38.1 mm
HMC981LP3E	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				8 V		CHIP CARRIER			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQCC-N16	1	1 mm	3 mm	Not Qualified	e3	30	260	3 mm
HMC263LP4ETR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQCC-N24	3	1 mm	4 mm		e3	30	260	4 mm
HMC-C200-8075	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	UNSPECIFIED		XMA	SQUARE		NO	1				6.5 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel				S-XXMA-X		26.67 mm	38.1 mm					38.1 mm
HMC-C200-8275	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	UNSPECIFIED		XMA	SQUARE		NO	1				6.5 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel				S-XXMA-X		26.67 mm	38.1 mm					38.1 mm
HMC-C200-8175	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	UNSPECIFIED		XMA	SQUARE		NO	1				6.5 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel				S-XXMA-X		26.67 mm	38.1 mm					38.1 mm
HMC-C200-8200	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	UNSPECIFIED		XMA	SQUARE		NO	1				6.5 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel				S-XXMA-X		26.67 mm	38.1 mm					38.1 mm
HMC-C200-8225	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	UNSPECIFIED		XMA	SQUARE		NO	1				6.5 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel				S-XXMA-X		26.67 mm	38.1 mm					38.1 mm
HMC917LP3E	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQCC-N16	1	1 mm	3 mm	Not Qualified	e3		260	3 mm
HMC-C200-8125	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	UNSPECIFIED		XMA	SQUARE		NO	1				6.5 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel				S-XXMA-X		26.67 mm	38.1 mm					38.1 mm
HMC-C200-8150	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	UNSPECIFIED		XMA	SQUARE		NO	1				6.5 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel				S-XXMA-X		26.67 mm	38.1 mm					38.1 mm
HMC-C200-8000	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	UNSPECIFIED		XMA	SQUARE		NO	1				6.5 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel				S-XXMA-X		26.67 mm	38.1 mm					38.1 mm
AD9865BCPZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS			3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N64	3	1 mm	9 mm	Not Qualified	e3	30	260	9 mm
AD73311LARZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		.0125 mA	3 V	3	SMALL OUTLINE	SOP20,.4	Modems	1.27 mm	105 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G20	1	2.65 mm	7.5 mm	Not Qualified	e3		260	12.8 mm
ADF7023BCPZ-RL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS			3 V	2/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N32		1 mm	5 mm	Not Qualified				5 mm
AD8311ACBZ-P7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	UNSPECIFIED	YES	1			.0129 mA	3 V	3/5	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA6,2X3,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		R-XBGA-B6	1	.675 mm	.95 mm	Not Qualified	e1	30	260	1.45 mm
AD9857AST	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	80	LQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.3 V	3.3	FLATPACK, LOW PROFILE	QFP80,.64SQ	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	Tin/Lead (Sn85Pb15)	QUAD		S-PQFP-G80	3	1.6 mm	14 mm	Not Qualified	e0	30	240	14 mm
AD8320ARPZ-REEL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		105 mA	12 V		SMALL OUTLINE				85 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G20	5			Not Qualified	e3		260
ADF7242BCPZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1					1.8/3.6	CHIP CARRIER	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N32	3	.8 mm	5 mm	Not Qualified	e3			5 mm
AD73360ASUZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	44	TQFP	SQUARE	PLASTIC/EPOXY	YES	1				3 V		FLATPACK, THIN PROFILE			.8 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQFP-G44	3	1.2 mm	10 mm	Not Qualified	e3	30	260	10 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.