INDUSTRIAL Other Function Telecom Interface ICs 2,400+

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

ADM1041AARQZ

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

24

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

5 V

SMALL OUTLINE, SHRINK PITCH

.635 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G24

1

1.7526 mm

3.9116 mm

Not Qualified

e3

260

8.6614 mm

HMC736LP4TR

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

4.2 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-PQCC-N24

1 mm

4 mm

4 mm

AD6623AS

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

128

FQFP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

2.5 V

FLATPACK, FINE PITCH

.5 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

R-PQFP-G128

3

3.4 mm

14 mm

Not Qualified

e0

240

20 mm

FIDO2100PLQ128IR0

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

128

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

FLATPACK, LOW PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

QUAD

S-PQFP-G128

1.6 mm

14 mm

NOT SPECIFIED

NOT SPECIFIED

14 mm

ADP5585ACPZ-00-R7

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

UNSPECIFIED

YES

1

1.8 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N16

3

.8 mm

3 mm

e3

30

260

3 mm

AD6623ASZ

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

128

FQFP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

2.5 V

FLATPACK, FINE PITCH

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

R-PQFP-G128

3

3.4 mm

14 mm

Not Qualified

e3

260

20 mm

HMC496LP3

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-PQCC-N16

1

1 mm

3 mm

Not Qualified

e0

235

3 mm

AD974ANZ

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

THROUGH-HOLE

28

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

BICMOS

5 V

IN-LINE

2.54 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

R-PDIP-T28

5.33 mm

7.62 mm

Not Qualified

e3

36.687 mm

AD6121ACPRL

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

BICMOS

3 V

3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-XQCC-N32

1 mm

5 mm

Not Qualified

e0

5 mm

LTP5901IPC-IPMA#PBF

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

66

RECTANGULAR

UNSPECIFIED

YES

1

3.6 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

MATTE TIN

UNSPECIFIED

R-XXMA-N66

3.54 mm

24 mm

e3

42 mm

ADL5353ACPZ-WP

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

20

HVQCCN

SQUARE

UNSPECIFIED

YES

1

BICMOS

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.65 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N20

1

.9 mm

5 mm

Not Qualified

e3

5 mm

ADM1041ARQ-REEL

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

24

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

5 V

SMALL OUTLINE, SHRINK PITCH

.635 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

R-PDSO-G24

1

1.7526 mm

3.9116 mm

Not Qualified

e0

240

8.6614 mm

HMC736LP4

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

4.2 V

CHIP CARRIER

.5 mm

85 Cel

-40 Cel

Tin/Lead (Sn/Pb)

QUAD

S-PQCC-N24

1

1 mm

4 mm

Not Qualified

e0

4 mm

ADL5605ACPZ-R7

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

UNSPECIFIED

YES

1

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.65 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N16

3

1 mm

4 mm

Not Qualified

e3

30

260

4 mm

AD974BNZ

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

THROUGH-HOLE

28

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

BICMOS

5 V

IN-LINE

2.54 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

R-PDIP-T28

5.33 mm

7.62 mm

Not Qualified

e3

36.687 mm

ADM1041ARQZ

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

24

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

5 V

SMALL OUTLINE, SHRINK PITCH

.635 mm

85 Cel

-40 Cel

Matte Tin (Sn) - annealed

DUAL

R-PDSO-G24

1

1.7526 mm

3.9116 mm

Not Qualified

e3

30

260

8.6614 mm

ADF5904WCCPZ

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

AEC-Q100

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

105 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N32

3

.8 mm

5 mm

e3

30

260

5 mm

HMC738LP4

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

24

VQCCN

SQUARE

UNSPECIFIED

YES

1

5 V

CHIP CARRIER, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

Tin/Lead (Sn/Pb)

QUAD

S-XQCC-N24

1

1 mm

4 mm

Not Qualified

e0

4 mm

LTP5901IPC-IPRA1C1#PBF

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

66

XMA

RECTANGULAR

PLASTIC/EPOXY

YES

1

HYBRID

3.6 V

MICROELECTRONIC ASSEMBLY

MODULE66(UNSPEC)

1 mm

85 Cel

-40 Cel

QUAD

.25 Mbps

R-PXMA-N66

3.54 mm

24 mm

NOT SPECIFIED

NOT SPECIFIED

42 mm

HMC775LC5

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

HQCCN

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

1

5 V

CHIP CARRIER, HEAT SINK/SLUG

.5 mm

85 Cel

-40 Cel

GOLD OVER NICKEL

QUAD

S-CQCC-N32

3

1.12 mm

5 mm

Not Qualified

e4

260

5 mm

HMC700LP4E

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQCC-N24

1

1 mm

4 mm

Not Qualified

e3

260

4 mm

AD6439-2BS

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

128

FQFP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.3 V

FLATPACK, FINE PITCH

.5 mm

85 Cel

-40 Cel

QUAD

R-PQFP-G128

2.35 mm

14 mm

Not Qualified

20 mm

LTC4403-1EMS8#TR

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

1

3.6 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

S-PDSO-G8

1

1.1 mm

3 mm

Not Qualified

e0

3 mm

AD9957BSVZ-REEL13

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

48

HTFQFP

SQUARE

UNSPECIFIED

YES

1

1.8 V

1.8,3.3

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

TQFP100,.63SQ

Other Telecom ICs

.5 mm

105 Cel

-40 Cel

MATTE TIN

QUAD

S-XQFP-G48

3

1.2 mm

14 mm

Not Qualified

e3

260

14 mm

HMC736LP4ETR

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

4.2 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

Matte Tin (Sn) - annealed

QUAD

S-PQCC-N24

1

1 mm

4 mm

e3

30

260

4 mm

LT5557EUF#PBF

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.65 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQCC-N16

1

.8 mm

4 mm

Not Qualified

e3

30

260

4 mm

ADF5904ACPZ

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

105 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N32

3

.8 mm

5 mm

e3

30

260

5 mm

LTC4400-2EMS8#TRPBF

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

1

3.6 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

S-PDSO-G8

1

1.1 mm

3 mm

Not Qualified

e3

30

260

3 mm

AD9082BBPZRL-4D2AC

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

BALL

324

FBGA

SQUARE

PLASTIC/EPOXY

YES

1

1 V

GRID ARRAY, FINE PITCH

BGA324,18X18,32

.8 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B324

3

1.72 mm

15 mm

IT CAN ALSO OPERATE WITH 1.8 AND 2 V

30

260

15 mm

ADL5380ACPZ-R2

Analog Devices

INDUSTRIAL

NO LEAD

24

QCCN

SQUARE

PLASTIC/EPOXY

YES

BIPOLAR

5 V

5

CHIP CARRIER

LCC24,.16SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

Matte Tin (Sn)

QUAD

S-PQCC-N24

Not Qualified

e3

HMC738LP4TR

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-PQCC-N24

1 mm

4 mm

4 mm

ADRF6703ACPZ

Analog Devices

INDUSTRIAL

NO LEAD

40

QCCN

SQUARE

PLASTIC/EPOXY

YES

BICMOS

5 V

5

CHIP CARRIER

LCC40,.24SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

QUAD

S-PQCC-N40

Not Qualified

ADM1041ARQ

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

24

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

5 V

SMALL OUTLINE, SHRINK PITCH

.635 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

R-PDSO-G24

1

1.7526 mm

3.9116 mm

Not Qualified

e0

240

8.6614 mm

LTC4403-2EMS

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

10

TSSOP

SQUARE

PLASTIC/EPOXY

YES

1

3.6 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.5 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

S-PDSO-G10

1

1.1 mm

3 mm

Not Qualified

e0

3 mm

LTC4402-1EMS8#TR

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

1

3.6 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

S-PDSO-G8

1

1.1 mm

3 mm

Not Qualified

e0

3 mm

LTC4400-1ES6#TR

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

6

VSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.6 V

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

.95 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

R-PDSO-G6

1

1 mm

1.6 mm

Not Qualified

e0

2.9 mm

LTM9013IY-AA#PBF

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

BALL

196

LBGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY, LOW PROFILE

BGA196,14X14,40

1 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B196

3.02 mm

15 mm

3.3v and 5v power supply also require to operate the device

NOT SPECIFIED

NOT SPECIFIED

15 mm

FIDO5100BBCZ

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

BALL

144

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

1.2 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA144,12X12,32

.8 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B144

1.24 mm

10 mm

NOT SPECIFIED

NOT SPECIFIED

10 mm

LT5504EMS8#TRPBF

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

Matte Tin (Sn)

DUAL

S-PDSO-G8

1

1.1 mm

3 mm

Not Qualified

e3

30

260

3 mm

LTC4400-1ES6#TRPBF

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

6

VSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.6 V

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

.95 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G6

1

1 mm

1.6 mm

Not Qualified

e3

30

260

2.9 mm

HMC749LC3C

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

16

HQCCN

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG

.5 mm

85 Cel

-40 Cel

GOLD OVER NICKEL

QUAD

S-CQCC-N16

3

1.31 mm

3 mm

Not Qualified

e4

30

260

3 mm

HMC914LP4E

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC24,.16SQ,20

ATM/SONET/SDH ICs

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQCC-N24

1

1 mm

4 mm

Not Qualified

e3

30

260

4 mm

ADL5601ARKZ-R7

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

FLAT

3

LSOF

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE, LOW PROFILE

1.5 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-F3

1

1.6 mm

2.45 mm

Not Qualified

e3

260

4.5 mm

LTP5902IPC-IPRB1C1#PBF

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

66

XMA

RECTANGULAR

PLASTIC/EPOXY

YES

1

HYBRID

3.6 V

MICROELECTRONIC ASSEMBLY

MODULE66(UNSPEC)

1 mm

85 Cel

-40 Cel

QUAD

.25 Mbps

R-PXMA-N66

3.54 mm

24 mm

NOT SPECIFIED

NOT SPECIFIED

42 mm

HMC748LC3CTR

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

16

HQCCN

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG

.5 mm

85 Cel

-40 Cel

QUAD

S-CQCC-N16

3

1.31 mm

3 mm

30

260

3 mm

AD6677BCPZ

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

.163 mA

1.8 V

1.8

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N32

3

.8 mm

5 mm

Not Qualified

e3

30

260

5 mm

HMC700LP4

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-PQCC-N24

1

1 mm

4 mm

Not Qualified

e0

235

4 mm

AD6677BCPZRL7

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

.163 mA

1.8 V

1.8

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N32

3

.8 mm

5 mm

Not Qualified

e3

30

260

5 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.