INDUSTRIAL Other Function Telecom Interface ICs 2,400+

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Carrier Type-1	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
BGM121A256V2	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56		SQUARE	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED		S-XXMA-N56		1.4 mm		6.5 mm						6.5 mm
TDA5150	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3 V	2/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		DUAL		S-PDSO-G10	1	1.05 mm		3 mm	Not Qualified				260	3 mm
SA616DK/01,112	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G20	1	1.5 mm		4.4 mm	Not Qualified		e4		260	6.5 mm
AD8015AR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			26 mA	5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel	TIN LEAD	DUAL		R-PDSO-G8	1	1.75 mm		3.9 mm	Not Qualified		e0		240	4.9 mm
AT86RF215-ZU	Microchip Technology	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V		CHIP CARRIER, VERY THIN PROFILE	LCC48,.28SQ,20		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQCC-N48		.9 mm		7 mm			e3			7 mm
AT86RF215M-ZU	Microchip Technology	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V		CHIP CARRIER, VERY THIN PROFILE	LCC48,.28SQ,20		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQCC-N48		.9 mm		7 mm			e3			7 mm
MLX90109EDC-AAA-000-RE	Melexis N V	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G8	1	1.72 mm		3.9 mm			e3		260	4.9 mm
UBX-M8030-KT	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	QCCN	SQUARE	UNSPECIFIED	YES	1		AEC-Q100		3 V		CHIP CARRIER				85 Cel	-40 Cel		QUAD		S-XQCC-N40	1
AD608ARZ-RL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G16	1	1.75 mm		3.9 mm	Not Qualified		e3	30	260	9.9 mm
DS2409P+	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	C BEND	6	SOC	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-C6	1	1.5 mm		3.81 mm	Not Qualified		e3	30	260	3.937 mm
DS2409P	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	C BEND	6	SOC	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel	TIN LEAD	DUAL		R-PDSO-C6	1	1.5 mm		3.76 mm	Not Qualified		e0			3.94 mm
HMC244AG16	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	LQFP	SQUARE	PLASTIC/EPOXY	YES	1				3 V		FLATPACK, LOW PROFILE			.76 mm	85 Cel	-40 Cel	GOLD OVER NICKEL	QUAD		S-PQFP-G16	1	1.65 mm		5.84 mm			e4	30	250	5.84 mm
RFFC2071ATR13	Qorvo	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS			3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N32		.95 mm		5 mm						5 mm
SA636DK/01	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	SSOP20,.25		.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G20	1	1.5 mm		4.4 mm	Not Qualified		e4	30	260	6.5 mm
SJA1105EL	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	BALL	159	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100		1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B159	3	1.5 mm		12 mm			e1	30	260	12 mm
TDA5211XUMA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	105 Cel	-40 Cel	TIN	DUAL		R-PDSO-G28	3	1.2 mm		4.4 mm	Not Qualified		e3			9.7 mm
BGT24MR2E6327XUMA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel	TIN	QUAD		R-PQCC-N32	3	.9 mm		4.5 mm			e3			5.5 mm
BT8510EPJC	Conexant Systems		INDUSTRIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY	YES		CMOS		.1 mA	5 V	5	CHIP CARRIER	LDCC68,1.0SQ	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)	QUAD		S-PQCC-J68			CEPT PCM-30/E-1		Not Qualified		e0
CY7B923-JXIT	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		.095 mA	5 V	5	CHIP CARRIER	LDCC28,.5SQ	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	400 Mbps	S-PQCC-J28	3	4.572 mm		11.5316 mm	Not Qualified		e3	20	260	11.5316 mm
HMC980LP4ETR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				12 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQCC-N24	1	1 mm		4 mm			e3	30	260	4 mm
WT32I-E-AI6	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	50		RECTANGULAR	UNSPECIFIED	YES	1						MICROELECTRONIC ASSEMBLY			1 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N50		2.55 mm		15.9 mm						23.9 mm
ATPL250A-AKU-R	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP80,.55SQ,20		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQFP-G80		1.6 mm		12 mm			e3			12 mm
BGM15LA12E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BUTT	12	BCC	RECTANGULAR	UNSPECIFIED	YES	1				2.8 V		CHIP CARRIER			.4 mm	85 Cel	-40 Cel	GOLD NICKEL	BOTTOM		R-XBCC-B12	1	.65 mm		1.1 mm			e4			1.9 mm
ISP1507-AX-ST	Insight Sip	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	62	XMA	SQUARE	UNSPECIFIED	YES	1				3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED	2 Mbps	R-XXMA-N62	3			8 mm				30	260	8 mm
MAX-8Q-0	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	18		RECTANGULAR	UNSPECIFIED	NO	1		AEC-Q100		3 V		MICROELECTRONIC ASSEMBLY			1.1 mm	85 Cel	-40 Cel		DUAL		R-XDMA-N18	4	2.7 mm		9.7 mm					245	10.1 mm
SA602AD	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				6 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G8		1.75 mm		3.9 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	4.9 mm
TDA7110FHTMA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-G10	1	1.1 mm		3 mm	Not Qualified		e3			3 mm
WLR089U0-I/RM	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	QMA	RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		QUAD	12 Mbps	R-XQMA-N40		2.8 mm		13.5 mm		HEAT SINK IS PRESENT				17 mm
WT32I-E-AI6IAP	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	50		RECTANGULAR	UNSPECIFIED	YES	1						MICROELECTRONIC ASSEMBLY			1 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N50		2.55 mm		15.9 mm						23.9 mm
CC2640R2FTWRGZRQ1	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100		3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel	MATTE TIN	QUAD	1 Mbps	S-PQCC-N48	3	1 mm		7 mm			e3	30	260	7 mm
450-0148C	Laird Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	47		RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N47	4	2.14 mm		15.5 mm					245	21 mm
ADRV9026BBCZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	4				1 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32		.8 mm	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B289	3	1.46 mm		14 mm		ALSO OPERATES IN 1.3V AND 1.8V NOMINAL VOLTAGE	e1	30	260	14 mm
SX8651IWLTRT	Semtech	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	12	HVSON	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.45 mm	85 Cel	-40 Cel	TIN	DUAL		S-PDSO-N12	2	.8 mm		3 mm			e3		260	3 mm
AD8015ARZ-REEL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			26 mA	5 V		SMALL OUTLINE				85 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G8	1				Not Qualified		e3	30	260
LEA-M8F-0-00	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED	NO	1		AEC-Q100		3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		DUAL		R-XDMA-N28	4	3.8 mm		17 mm						22.4 mm
RN41-I/RM477	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32		RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel	MATTE TIN	UNSPECIFIED		R-XXMA-N32		2.2 mm		13.2 mm			e3			25.8 mm
450-0148R	Laird Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	47		RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N47	4	2.14 mm		15.5 mm					245	21 mm
LMX9838SB/NOPB	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	70	LGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			.065 mA	3.3 V	3.3	GRID ARRAY	LGA70(UNSPEC)	Other Telecom ICs	1 mm	85 Cel	-40 Cel		BOTTOM		R-PBGA-N70	4	2.1 mm		10 mm	Not Qualified			30	250	17 mm
MRF24WG0MA-I/RM	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36		RECTANGULAR	UNSPECIFIED	NO	1				3.3 V	3.3	MICROELECTRONIC ASSEMBLY	MODULE,36LEAD,.8	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		R-XDMA-N36		2.7 mm		21 mm	Not Qualified		e3			31 mm
RFFC2071TR13	Qorvo	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS			3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N32		1 mm		5 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	5 mm
RN41-I/RM615	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32		RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel	MATTE TIN	UNSPECIFIED		R-XXMA-N32		2.2 mm		13.2 mm			e3			25.8 mm
ADRV9008BBCZ-1	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.3 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B196	3	1.27 mm		12 mm					260	12 mm
SA606DK/01	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL		R-PDSO-G20	1	1.5 mm		4.4 mm			e4	30	260	6.5 mm
SI4460-C2A-GM	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL
TLK2711IRCP	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	HVFQFP	SQUARE	PLASTIC/EPOXY	YES	1				2.5 V	2.5	FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH	TQFP64,.47SQ	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQFP-G64	3	1 mm		10 mm	Not Qualified		e4	30	260	10 mm
TLK2711IRCPG4	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	HVFQFP	SQUARE	PLASTIC/EPOXY	YES	1				2.5 V	2.5	FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH	TQFP64,.47SQ	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQFP-G64	3	1 mm		10 mm	Not Qualified		e4	30	260	10 mm
WFI32E01PE-I	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	54	QMA	RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY	MODULE,54LEAD,.7		1.27 mm	85 Cel	-40 Cel		QUAD		R-XQMA-N54		2.6 mm		20.5 mm						24.5 mm
CC2640F128RGZR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD		S-PQCC-N48	3	1 mm		7 mm			e4	NOT SPECIFIED	260	7 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.