INDUSTRIAL Other Function Telecom Interface ICs 2,400+

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

BGM113A256V1

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

36

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

.8 mm

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N36

2.09 mm

9.15 mm

15.73 mm

BGS13PN10E6327XTSA1

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

BUTT

10

BCC

RECTANGULAR

UNSPECIFIED

YES

1

CMOS

2.85 V

CHIP CARRIER

.4 mm

85 Cel

-40 Cel

TIN

BOTTOM

R-XBCC-B10

1

.4 mm

1.1 mm

e3

1.5 mm

BGS13S2N9E6327XTSA1

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

BALL

9

VFBGA

SQUARE

UNSPECIFIED

YES

1

MOS

3 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

TIN

BOTTOM

S-XBGA-B9

1

.4 mm

1.1 mm

e3

1.1 mm

BTM431

Laird Technologies

TELECOM CIRCUIT

INDUSTRIAL

UNSPECIFIED

RECTANGULAR

UNSPECIFIED

NO

1

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-X

NOT SPECIFIED

NOT SPECIFIED

DS2409P+T&R

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

C BEND

6

SOC

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE

1.27 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-C6

1

1.5 mm

3.76 mm

Not Qualified

e3

30

260

3.94 mm

DS2409P/T&R

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

C BEND

6

SOC

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE

1.27 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

R-PDSO-C6

1

1.5 mm

3.76 mm

Not Qualified

e0

3.94 mm

FIDO2100BGA128IR0

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

BALL

128

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY, LOW PROFILE, FINE PITCH

.8 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B128

1.3 mm

10 mm

NOT SPECIFIED

NOT SPECIFIED

10 mm

HMC1023LP5E

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQCC-N32

1

1 mm

5 mm

e3

30

260

5 mm

MAX-8Q

U-blox Ag

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

18

SON

RECTANGULAR

PLASTIC/EPOXY

YES

1

AEC-Q100; TS 16949

3 V

SMALL OUTLINE

85 Cel

-40 Cel

DUAL

R-PDSO-N18

NOT SPECIFIED

NOT SPECIFIED

MAX9152ESE

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

.07 mA

3.3 V

3.3

SMALL OUTLINE

SOP16,.25

Other Telecom ICs

1.27 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

R-PDSO-G16

1

1.75 mm

3.9 mm

Not Qualified

e0

9.9 mm

MAX9152ESE+

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

SMALL OUTLINE

1.27 mm

85 Cel

-40 Cel

Matte Tin (Sn) - annealed

DUAL

R-PDSO-G16

1

1.75 mm

3.9 mm

Not Qualified

e3

30

260

9.9 mm

MLX90109EDC-AAA-000-TU

Melexis N V

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE

1.27 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G8

1

1.72 mm

3.9 mm

e3

260

4.9 mm

RN41N-I/RM477

Microchip Technology

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

35

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

MATTE TIN

QUAD

R-XQMA-N35

2.2 mm

13.2 mm

e3

20.1 mm

RN42N-I/RM477

Microchip Technology

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

RECTANGULAR

UNSPECIFIED

YES

1

TS 16949

3.3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

GOLD OVER NICKEL

UNSPECIFIED

R-XXMA-N32

2.4 mm

13.4 mm

e4

20.5 mm

SA5224D

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

.035 mA

5 V

5

SMALL OUTLINE

SOP16,.25

ATM/SONET/SDH ICs

1.27 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G16

1.75 mm

3.9 mm

Not Qualified

9.9 mm

TMS3705BDRG4

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

.02 mA

5 V

5

SMALL OUTLINE

SOP16,.25

Other Telecom ICs

1.27 mm

105 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G16

3

1.75 mm

3.91 mm

Not Qualified

e4

30

260

9.9 mm

VSC8491YJU-17

Microchip Technology

TELECOM CIRCUIT

INDUSTRIAL

BALL

196

LBGA

SQUARE

PLASTIC/EPOXY

YES

1

1 V

GRID ARRAY, LOW PROFILE

BGA196,14X14,40

1 mm

110 Cel

-40 Cel

BOTTOM

10000 Mbps

S-PBGA-B196

1.4 mm

15 mm

15 mm

W2SG0084I-B-T

Wi2wi

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

24

QMA

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

1.5 mm

85 Cel

-40 Cel

QUAD

R-XQMA-N24

1

2.3 mm

11.2 mm

245

12 mm

AD73311ARS

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

20

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

3 V

3/5

SMALL OUTLINE, SHRINK PITCH

SSOP20,.3

Codecs

.65 mm

85 Cel

-40 Cel

1 dB

Tin/Lead (Sn85Pb15)

DUAL

R-PDSO-G20

1

2 mm

16-BIT

5.3 mm

Not Qualified

e0

30

240

7.2 mm

YES

AD8312ACBZ-P2

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

BALL

6

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B6

1

.675 mm

.95 mm

Not Qualified

e1

40

260

1.45 mm

ADF7012BRUZ

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

24

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

3 V

2.5/3.3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP24,.25

Other Telecom ICs

.65 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G24

1

1.2 mm

4.4 mm

Not Qualified

e3

260

7.8 mm

ADRF6821ACPZ

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

56

HVQCCN

SQUARE

UNSPECIFIED

YES

1

BICMOS

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

105 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-XQCC-N56

3

.8 mm

8 mm

e4

30

260

8 mm

ADRV9008BBCZ-2REEL

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

BALL

196

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

1.3 V

GRID ARRAY, LOW PROFILE, FINE PITCH

.8 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B196

3

1.27 mm

12 mm

260

12 mm

ATA5744N-TKQY

Atmel

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

20

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

.0087 mA

5 V

5

SMALL OUTLINE, SHRINK PITCH

SSOP20,.25

Other Telecom ICs

.65 mm

105 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G20

1

4.4 mm

Not Qualified

e3

260

6.625 mm

ATA5746-PXPW

Atmel

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

1

.01 mA

3 V

3,5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC24,.2SQ,25

Other Telecom ICs

.65 mm

105 Cel

-40 Cel

QUAD

S-XQCC-N24

1 mm

5 mm

Not Qualified

5 mm

ATSAMW25H18-MR210PB1952

Microchip Technology

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

51

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

1.2 mm

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N51

2.138 mm

14.908 mm

33.864 mm

CC1121RHBR

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3 V

3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD SILVER

QUAD

.2 Mbps

S-PQCC-N32

3

1 mm

5 mm

Not Qualified

e4

30

260

5 mm

CC2564BRVMR

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

76

HVQCCN

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.6 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.6 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

R-PQCC-N76

3

.9 mm

7.73 mm

e3

30

260

8 mm

CC430F6137IRGC

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

64

VQCCN

SQUARE

PLASTIC/EPOXY

YES

1

2.2 V

CHIP CARRIER, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N64

3

1 mm

9 mm

Not Qualified

e4

30

260

9 mm

ENW89837A3KF

Panasonic

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

58

RECTANGULAR

UNSPECIFIED

YES

1

1.8 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N58

2 mm

8.7 mm

10

250

15.6 mm

ETRX2-PA

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

38

RECTANGULAR

UNSPECIFIED

YES

1

3 V

MICROELECTRONIC ASSEMBLY

2.54 mm

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N38

20.5 mm

37.5 mm

HT2DC20S20/F/RSP

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

RECTANGULAR

PLASTIC/EPOXY

YES

1

HYBRID

SPECIAL SHAPE

MODULE(UNSPEC)

Other Telecom ICs

85 Cel

-40 Cel

SILVER

UNSPECIFIED

R-PXSS-N

Not Qualified

e4

MAX3658AETA-T

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

8

HVSON

SQUARE

UNSPECIFIED

YES

1

.026 mA

3.3 V

3.3

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.12,25

Other Telecom ICs

.65 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

S-XDSO-N8

1

.8 mm

3 mm

Not Qualified

e0

3 mm

MAX3658AETA+T

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

8

HVSON

SQUARE

UNSPECIFIED

YES

1

.026 mA

3.3 V

3.3

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.12,25

Other Telecom ICs

.65 mm

85 Cel

-40 Cel

Matte Tin (Sn) - annealed

DUAL

S-XDSO-N8

1

.8 mm

3 mm

Not Qualified

e3

30

260

3 mm

MC12311CHN

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

60

LGA

SQUARE

PLASTIC/EPOXY

YES

2/3.3

GRID ARRAY

LGA60,16X16,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

NICKEL GOLD

BOTTOM

S-PBGA-N60

3

Not Qualified

e4

40

260

PE42426A-Z

Psemi

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

12

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

105 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-XQCC-N12

1

.8 mm

3 mm

e4

30

260

3 mm

RFFC5072SR

Qorvo

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N32

.95 mm

5 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

5 mm

RN42U-I/RM

Microchip Technology

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

RECTANGULAR

UNSPECIFIED

YES

1

TS 16949

3.3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N32

2.4 mm

13.4 mm

NOT SPECIFIED

NOT SPECIFIED

25.8 mm

SL2S2102FTB,115

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

3

VSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

SMALL OUTLINE, VERY THIN PROFILE

.55 mm

85 Cel

-40 Cel

TIN

DUAL

R-PDSO-N3

1

.5 mm

1 mm

e3

30

260

1.45 mm

SX1509QBIULTRT

Semtech

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

28

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.4 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N28

.6 mm

4 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

4 mm

AD9832BRUZ-REEL

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

16

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

5 mA

3.3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G16

1

1.1 mm

4.4 mm

Not Qualified

e3

30

260

5 mm

ADL5240ACPZ-R7

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N32

3

1 mm

5 mm

Not Qualified

e3

40

260

5 mm

ADRF6821ACPZ-RL7

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

56

HVQCCN

SQUARE

UNSPECIFIED

YES

1

BICMOS

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

105 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-XQCC-N56

3

.8 mm

8 mm

e4

30

260

8 mm

ADV7480WBBCZ

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

BALL

100

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

1.8 V

GRID ARRAY, LOW PROFILE, FINE PITCH

.8 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B100

3

1.4 mm

9 mm

e1

9 mm

ATA5743P3-TKQY

Microchip Technology

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

20

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

.0091 mA

5 V

5

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

SSOP20,.25

Other Telecom ICs

.65 mm

105 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G20

1

1.35 mm

4.4 mm

Not Qualified

e3

6.75 mm

ATA5743P6-TGQY

Atmel

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

20

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

.0091 mA

5 V

5

SMALL OUTLINE

SOP20,.4

Other Telecom ICs

1.27 mm

105 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G20

1

7.4 mm

Not Qualified

e3

260

12.825 mm

CYBLE-012011-00

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

31

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

1.27 mm

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N31

3

2 mm

14.52 mm

19.2 mm

HMC862ALP3ETR

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

UNSPECIFIED

YES

1

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N16

3

.9 mm

3 mm

e3

30

260

3 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.