INDUSTRIAL Other Function Telecom Interface ICs 2,400+

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Input Type	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
SL869GNS117T001	Telit Communications Plc	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	SON	RECTANGULAR	PLASTIC/EPOXY	YES	1					3.3 V		SMALL OUTLINE				85 Cel	-40 Cel		DUAL		R-PDSO-N24		2.4 mm	12.2 mm				NOT SPECIFIED	NOT SPECIFIED	16 mm
SN65LVPE501RGET	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	2	2	CMOS		.12 mA	3.3 V	3.3	CHIP CARRIER	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	5 Mbps	S-PQCC-N24	2	1 mm	4 mm	Not Qualified		e4	30	260	4 mm
SPBTLE-1S	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	23	QMA	RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY			1.27 mm	85 Cel	-40 Cel		QUAD		R-XQMA-N23		2.2 mm	11.5 mm				NOT SPECIFIED	NOT SPECIFIED	13.5 mm
SPBTLE-RF	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	11		RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY			1.27 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N11		2.2 mm	11.5 mm				NOT SPECIFIED	NOT SPECIFIED	13.5 mm
SX1279IMLTRT	Semtech	TELECOM CIRCUIT	INDUSTRIAL																				MATTE TIN				3					e3		260
T555711-TAS	Atmel	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				.00004 mA			SMALL OUTLINE	SOP8,.25	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	DUAL		R-PDSO-G8			3.8 mm	Not Qualified		e0			4.925 mm
TC35678FSG-002	Toshiba	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N40		.9 mm	5 mm				NOT SPECIFIED	NOT SPECIFIED	5 mm
TDA5235XUMA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	DUAL		R-PDSO-G28	3	1.2 mm	4.4 mm	Not Qualified		e4			9.7 mm
TFF11139HN/N1,118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N24	1	1 mm	4 mm					260	4 mm
TQP9221	Qorvo	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	14	LSON	SQUARE	PLASTIC/EPOXY	YES	1					4.5 V		SMALL OUTLINE, LOW PROFILE			1.06 mm	85 Cel	-40 Cel	Gold (Au) - with Nickel (Ni) barrier	DUAL		S-PDSO-N14	3	1.4 mm	7 mm			e4	NOT SPECIFIED	NOT SPECIFIED	7 mm
TSC2200IRHB	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					2.7 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N32	2	1 mm	5 mm	Not Qualified	SINGLE-ENDED	e4	30	260	5 mm
UBX-G6010-ST	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56	QCCN	SQUARE	UNSPECIFIED	YES	1			AEC-Q100; TS 16949		1.8 V		CHIP CARRIER				85 Cel	-40 Cel		QUAD		S-XQCC-N56
WFI32E01PC-I	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	54	QMA	RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY	MODULE,54LEAD,.7		1.27 mm	85 Cel	-40 Cel		QUAD		R-XQMA-N54		2.6 mm	20.5 mm						24.5 mm
WT32I-E-AI6-APTX	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	50		RECTANGULAR	UNSPECIFIED	YES	1							MICROELECTRONIC ASSEMBLY			1 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N50		2.55 mm	15.9 mm						23.9 mm
AD73360ARZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS			3 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G28	3	2.65 mm	7.5 mm	Not Qualified		e3	30	260	17.9 mm
ADA2200ARUZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	Matte Tin (Sn)	DUAL		R-PDSO-G16	1	1.2 mm	4.4 mm			e3	30	260	5 mm
ADA2200ARUZ-REEL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	Tin (Sn)	DUAL		R-PDSO-G16	1	1.2 mm	4.4 mm			e3	30	260	5 mm
ADF7023BCPZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3 V	2/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N32	3	.8 mm	5 mm	Not Qualified		e4	30	260	5 mm
ADN2892ACPZ-500RL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1				.054 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.12SQ,20	ATM/SONET/SDH ICs	.5 mm	95 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N16	3	.9 mm	3 mm	Not Qualified		e3	30	260	3 mm
ADRF6516ACPZ-R7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1		BICMOS			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N32	3	.8 mm	5 mm			e3		260	5 mm
ADRF6850BCPZ-R7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS		.44 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD		S-XQCC-N56	3	1 mm	8 mm	Not Qualified		e3	30	260	8 mm
ATBTLC1000-MR110CA	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	XMA	RECTANGULAR	UNSPECIFIED	YES	1					3.6 V		MICROELECTRONIC ASSEMBLY	MODULE,24LEAD(UNSPEC)		.9 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N24		2.165 mm	12.7 mm						20.157 mm
BGM111E256V2R	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	BUTT	31		RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY			1.2 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-B31		2.15 mm	12.9 mm						15 mm
BGM121N256V2R	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56		SQUARE	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED		S-XXMA-N56	3	1.4 mm	6.5 mm				40	260	6.5 mm
BGS13GA14E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BUTT	14	BCC	SQUARE	UNSPECIFIED	YES	1		CMOS			3 V		CHIP CARRIER			.4 mm	85 Cel	-40 Cel	GOLD NICKEL	BOTTOM		S-XBCC-B14	1	.65 mm	2 mm			e4			2 mm
BH1417FV-E2	ROHM		INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES					28 mA	5 V	5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.3	Other Telecom ICs	.635 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G24				Not Qualified
BM71BLE01FC2-0B02AA	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	17	QMA	RECTANGULAR	UNSPECIFIED	YES	1					3 V		MICROELECTRONIC ASSEMBLY	MODULE,17LEAD(UNSPEC)		1.2 mm	85 Cel	-40 Cel		QUAD	.0086 Mbps	R-XQMA-N17		1.66 mm	6 mm				30	260	8 mm
BMD-301-A-R-00	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	47	XMA	RECTANGULAR	UNSPECIFIED	YES	1					3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED	2 Mbps	R-XXMA-N47		1.9 mm	9.8 mm						14 mm
BMD-301-A-R-10	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	47	XMA	RECTANGULAR	UNSPECIFIED	YES	1					3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED	2 Mbps	R-XXMA-N47		1.9 mm	9.8 mm						14 mm
BQ500211ARGZR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	110 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N48	3	1 mm	7 mm			e4	30	260	7 mm
BQ500211ARGZT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	110 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N48	3	1 mm	7 mm			e4	30	260	7 mm
CC1110F32RSPG3	Texas Instruments		INDUSTRIAL	NO LEAD	36	QCCN	SQUARE	PLASTIC/EPOXY	YES			CMOS			3 V	3	CHIP CARRIER	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N36	3			Not Qualified		e4	30	260
CC430F5133IRGZT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1					2.2 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	.5 Mbps	S-PQCC-N48	3	1 mm	7 mm	Not Qualified		e4	30	260	7 mm
CC430F6127IRGCR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	64	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1					2.2 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	QUAD	.25 Mbps	S-PQCC-N64	3	1 mm	9 mm	Not Qualified		e4	30	260	9 mm
CC430F6135IRGCR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	64	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1					2.2 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	QUAD	.25 Mbps	S-PQCC-N64	3	1 mm	9 mm	Not Qualified		e4	30	260	9 mm
CMX972Q5	Cml Microcircuits		INDUSTRIAL	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES					20 mA	3.3 V	3.3	CHIP CARRIER	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N32				Not Qualified
CMX994Q4	Cml Microcircuits	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1				.08 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N40		1 mm	6 mm	Not Qualified					6 mm
CYBLE-212019-00	Cypress Semiconductor	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	31		RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY			1.27 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N31		2 mm	14.52 mm				NOT SPECIFIED	NOT SPECIFIED	19.2 mm
CYBLE-212023-10	Cypress Semiconductor	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	31		RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY			1.27 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N31		2 mm	14.52 mm				NOT SPECIFIED	NOT SPECIFIED	19.2 mm
EMMY-W163-00B	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	BUTT	46		RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		QUAD		R-XQMA-B46			13.8 mm				40	245	19.8 mm
ENW89823A2KF	Panasonic	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	XMA	RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED	2.178 Mbps	R-XXMA-N24		2 mm	9 mm				50	250	9.5 mm
ENW89835A3KF	Panasonic	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD			RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N		2 mm	8.7 mm				10	250	15.6 mm
EQCO31R20.3	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1					1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N16	1	.9 mm	4 mm			e4	30	260	4 mm
ESP8285N08	Espressif Systems (Shanghai)	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	85 Cel	-40 Cel	TIN	QUAD	72.2 Mbps	S-XQCC-N32	3	.9 mm	5 mm			e3	30	250	5 mm
HMC625BLP5ETR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQCC-N32	3	1 mm	5 mm			e3	30	260	5 mm
IC1003	Rf Monolithics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	TFQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1							FLATPACK, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		QUAD		R-PQFP-G64	1	1.2 mm	10 mm	Not Qualified				260	10 mm
ISL32273EIVZ-T	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BICMOS			3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G16	2	1.2 mm	4.4 mm			e3	30	260	5 mm
LE866-SV1	Telit Communications Plc	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD		LGA	RECTANGULAR	UNSPECIFIED	YES	1					3.8 V		GRID ARRAY				85 Cel	-40 Cel		BOTTOM		R-XBGA-N		2.2 mm	15 mm						25 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.