INDUSTRIAL Other Function Telecom Interface ICs 2,400+

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Maximum Gain Tolerance	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Linear Coding	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Filter
LEA-6H-0	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED	NO	1		AEC-Q100		3 V		MICROELECTRONIC ASSEMBLY			1.1 mm	85 Cel	-40 Cel			DUAL		R-XDMA-N28		2.7 mm		17 mm				NOT SPECIFIED	NOT SPECIFIED	22.4 mm
LEA-6S-0	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28	SON	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100; TS 16949		3 V		SMALL OUTLINE				85 Cel	-40 Cel			DUAL		R-PDSO-N28
LEA-6T-0	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28	SON	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100; TS 16949		3 V		SMALL OUTLINE				85 Cel	-40 Cel			DUAL		R-PDSO-N28
LPR2400	Rf Monolithics	TELECOM CIRCUIT	INDUSTRIAL	UNSPECIFIED	36		RECTANGULAR	UNSPECIFIED	NO	1						MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel			DUAL		R-XDMA-X36					Not Qualified			NOT SPECIFIED	NOT SPECIFIED
LPR2400ERA	Rf Monolithics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36		RECTANGULAR	UNSPECIFIED	YES	1						MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel			QUAD		R-XQMA-N36					Not Qualified			NOT SPECIFIED	NOT SPECIFIED
LTC5589IUF#PBF	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20		.5 mm	105 Cel	-40 Cel		MATTE TIN	QUAD		R-PQCC-N24		.8 mm		6 mm			e3			6 mm
MAX2510EEI	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		25 mA	3 V	3/5	SMALL OUTLINE, SHRINK PITCH	SSOP28,.25	Other Telecom ICs	.635 mm	85 Cel	-40 Cel		TIN LEAD	DUAL		R-PDSO-G28	1	1.75 mm		3.9 mm	Not Qualified		e0			9.89 mm
MAX2510EEI+	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			25 mA	3 V		SMALL OUTLINE, SHRINK PITCH			.635 mm	85 Cel	-40 Cel		Matte Tin (Sn) - annealed	DUAL		R-PDSO-G28	1	1.75 mm		3.9 mm	Not Qualified		e3	30	260	9.89 mm
MRF24J40-I/MLVAO	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100		3.3 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel			QUAD		S-PQCC-N40		1 mm		6 mm						6 mm
MRF24WG0MART-I/RM	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36		RECTANGULAR	UNSPECIFIED	NO	1		TS 16949		3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel			DUAL		R-XDMA-N36		2.7 mm		21 mm						31 mm
MRF24WG0MAT-I/RM	Microchip Technology		INDUSTRIAL		36			PLASTIC/EPOXY						3.3 V	3.3	MICROELECTRONIC ASSEMBLY	MODULE,36LEAD,.8	Other Telecom ICs		85 Cel	-40 Cel										Not Qualified
NJG1157PCD-TE1	New Japan Radio	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	10	DMA	SQUARE	UNSPECIFIED	YES	1				1.8 V		MICROELECTRONIC ASSEMBLY			.5 mm	105 Cel	-40 Cel			DUAL		S-XDMA-N10		.63 mm		2.5 mm		HEAT SINK AVAILABLE				2.5 mm
ONET8501VRGPT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			90 mA	3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	11300 Mbps	S-PQCC-N20	3	1 mm		4 mm	Not Qualified		e4	NOT SPECIFIED	260	4 mm
P9038-RNDGI	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel		MATTE TIN	QUAD		S-XQCC-N56	3	1 mm		7 mm			e3		260	7 mm
P9038-RNDGI8	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel		MATTE TIN	QUAD		S-XQCC-N56	3	1 mm		7 mm			e3		260	7 mm
RF6545	Qorvo	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V	3.3	CHIP CARRIER	LCC20,.14SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel			QUAD		S-XQCC-N20		.5 mm		3.5 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	3.5 mm
RN42HCI-I/RM	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	35	XMA	RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY	MODULE,35LEAD(UNSPEC)		1.2 mm	85 Cel	-40 Cel			UNSPECIFIED	3 Mbps	R-XXMA-N35		2.4 mm		13.4 mm				NOT SPECIFIED	NOT SPECIFIED	25.6 mm
RS9113-NB0-D1C-X75	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	79	XMA	RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel			UNSPECIFIED	54 Mbps	R-XXMA-N79		3.3 mm		16 mm		ALSO HAS BLUETOOTH DATA RATE= 1,2,3 Mbps and ZIGBEE DATA RATE= 250 kbps; ESD for WURX pin=1C				27 mm
RS9113-NB0-D1C-X78	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	79	XMA	RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel			UNSPECIFIED	54 Mbps	R-XXMA-N79		3.3 mm		16 mm		ALSO HAS BLUETOOTH DATA RATE= 1,2,3 Mbps and ZIGBEE DATA RATE= 250 kbps; ESD for WURX pin=1C				27 mm
SA606D/01,118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G20	1	1.5 mm		4.4 mm	Not Qualified		e4			6.5 mm
SARA-U260-00S	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	BUTT	96		RECTANGULAR	UNSPECIFIED	YES	1				3.8 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel			UNSPECIFIED		R-XXMA-B96	4	3 mm		16 mm						26 mm
SE2568U-R	Skyworks Solutions	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel			DUAL		S-PDSO-N8		.5 mm		2 mm				NOT SPECIFIED	NOT SPECIFIED	2 mm
SI4010-C2-GT	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.3 V		SMALL OUTLINE			.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	DUAL		S-PDSO-G10	2	1.1 mm		3 mm	Not Qualified		e4	40	260	3 mm
SKY13453-385LF	Skyworks Solutions	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	QCCN	SQUARE	UNSPECIFIED	YES	1				2.8 V		CHIP CARRIER				90 Cel	-40 Cel			QUAD		S-XQCC-N6	1	.5 mm		1 mm					260	1 mm
SL3S1003FTB0,115	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS					SMALL OUTLINE, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel			DUAL		R-PDSO-N6		.5 mm		1 mm						1.45 mm
SL3S4021FHKH	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	8	QCCN	SQUARE	PLASTIC/EPOXY	YES						1.8/3.6	CHIP CARRIER	LCC8,.06SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N8	1				Not Qualified		e4	30	260
STA8090FGB	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	99	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			1.2 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel			BOTTOM		R-PBGA-B99		1.2 mm		5 mm				NOT SPECIFIED	NOT SPECIFIED	6 mm
SX1508BIULTRT	Semtech	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel		MATTE TIN	QUAD		S-XQCC-N20	1	.6 mm		3 mm			e3		260	3 mm
SX1509IULTRT	Semtech	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel		MATTE TIN	QUAD		S-XQCC-N28		.6 mm		4 mm	Not Qualified		e3			4 mm
U2741B-NFBG3Y	Atmel	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			.0125 mA	3 V	2.2/5.5	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	SSOP16,.25	Other Telecom ICs	.635 mm	85 Cel	-40 Cel		MATTE TIN	DUAL		R-PDSO-G16	1	1.7 mm			Not Qualified		e3		260	4.9 mm
VSC8490YJU-17	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	1				1 V		GRID ARRAY, LOW PROFILE	BGA196,14X14,40		1 mm	110 Cel	-40 Cel			BOTTOM	10000 Mbps	S-PBGA-B196		1.4 mm		15 mm						15 mm
W2SG0084I-B-TR	Wi2wi	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	QMA	RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY			1.5 mm	85 Cel	-40 Cel			QUAD		R-XQMA-N24	1	2.3 mm		11.2 mm					260	12 mm
WL1801GYFVR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	130	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1						GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA130,11X12,16		.4 mm	105 Cel	-40 Cel		TIN SILVER COPPER	BOTTOM		R-PBGA-B130	1	.575 mm		4.64 mm			e1	30	260	4.93 mm
XE1203FI063TRLF	Semtech	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			.075 mA	3.3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		Matte Tin (Sn)	QUAD		S-PQCC-N48		.9 mm		7 mm	Not Qualified		e3			7 mm
ZOE-M8G-0-10	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	BUTT	51	XMA	SQUARE	UNSPECIFIED	YES	1		AEC-Q100		1.8 V		MICROELECTRONIC ASSEMBLY			.5 mm	85 Cel	-40 Cel			BOTTOM		S-XXMA-B51	3	1.165 mm		4.5 mm						4.5 mm
ABBTM-NVC-MDCS42A	Abracon	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32		RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY			1.2 mm	85 Cel	-40 Cel			UNSPECIFIED		R-XXMA-N32	3	2.2 mm		13.4 mm						25.8 mm
AD73322LARUZ-REEL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		.031 mA	3 V	3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25	Codecs	.65 mm	85 Cel	-40 Cel	.75 dB	Matte Tin (Sn) - annealed	DUAL		R-PDSO-G28	1	1.2 mm	16-BIT	4.4 mm	Not Qualified		e3	40	260	9.7 mm	YES
AD73360ARZ-REEL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		MATTE TIN	DUAL		R-PDSO-G28	3	2.65 mm		7.5 mm	Not Qualified		e3	30	260	17.9 mm
ADN2892ACPZ-RL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1			.054 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.12SQ,20	ATM/SONET/SDH ICs	.5 mm	95 Cel	-40 Cel		MATTE TIN	QUAD		S-XQCC-N16	3	.9 mm		3 mm	Not Qualified		e3		260	3 mm
ADN2892ACPZ-RL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1			.054 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.12SQ,20	ATM/SONET/SDH ICs	.5 mm	95 Cel	-40 Cel		MATTE TIN	QUAD		S-XQCC-N16	3	.9 mm		3 mm	Not Qualified		e3	30	260	3 mm
ATA5577M3330C-DDB	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	UNSPECIFIED	2	DIE	RECTANGULAR	UNSPECIFIED		1						UNCASED CHIP	DIE OR CHIP		.524 mm	85 Cel	-40 Cel			UPPER		R-XUUC-N2		.162 mm		1 mm						1.35 mm
BMD-341-A-R-00	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	68	XMA	RECTANGULAR	UNSPECIFIED	YES	1				3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel			UNSPECIFIED	2 Mbps	R-XXMA-N68	3	1.9 mm		10.2 mm					250	15 mm
CC1201RHBR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	QUAD	1.25 Mbps	S-PQCC-N32	3	1 mm		5 mm	Not Qualified		e4	NOT SPECIFIED	260	5 mm
CC2541F256TRHARQ1	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD	2 Mbps	S-PQCC-N40	3	1 mm		6 mm			e4	30	260	6 mm
D52MD2M8IA-TRAY	Garmin Canada	TELECOM CIRCUIT	INDUSTRIAL	BALL	35	XMA	RECTANGULAR	UNSPECIFIED	YES	1						MICROELECTRONIC ASSEMBLY			1.5 mm	85 Cel	-40 Cel			UNSPECIFIED	.06 Mbps	R-XXMA-B35		2.11 mm		9.8 mm						14 mm
DP1203C4333LF	Semtech	TELECOM CIRCUIT	INDUSTRIAL	UNSPECIFIED	21		RECTANGULAR	UNSPECIFIED	NO	1				3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		MATTE TIN	UNSPECIFIED		R-XXMA-X21					Not Qualified		e3
EFR32BG12P432F1024GM48-C	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20		.5 mm	85 Cel	-40 Cel			QUAD	2 Mbps	S-XQCC-N48		.9 mm		7 mm						7 mm
EFR32BG1B232F256GJ43-C0	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	BALL	43	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel			BOTTOM		R-PBGA-B43		.54 mm		3.143 mm						3.295 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.