INDUSTRIAL Other Function Telecom Interface ICs 2,400+

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Nominal Negative Supply Voltage	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
SI4355-B1A-FM	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	QCCN	SQUARE	UNSPECIFIED	YES	1					3.3 V		CHIP CARRIER				85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N20	2					e3	40	260
EFR32BG13P532F512GM32-D	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N32	3	.9 mm	5 mm				40	260	5 mm
ENW89852A1KF	Panasonic	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	XMA	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N24		2 mm	9 mm						9.5 mm
LXMS31ACNA-012	Murata Manufacturing	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	2	QCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1							CHIP CARRIER				85 Cel	-40 Cel		BOTTOM		R-PBCC-N2		.7 mm	1.6 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	3.2 mm
RS9113-NB0-S1C-X78	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	79	XMA	RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED	54 Mbps	R-XXMA-N79		3.3 mm	16 mm		ALSO HAS BLUETOOTH DATA RATE= 1,2,3 Mbps and ZIGBEE DATA RATE= 250 kbps; ESD for WURX pin=1C				27 mm
SKY85806-11	Skyworks Solutions	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28	HVQCCN	RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel		QUAD		R-XQCC-N28		.9 mm	3 mm				NOT SPECIFIED	NOT SPECIFIED	4 mm
T5761-TGS	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V	5	SMALL OUTLINE	SOP20,.4	Other Telecom ICs	1.27 mm	105 Cel	-40 Cel	TIN LEAD	DUAL		R-PDSO-G20		2.6 mm	7.4 mm	Not Qualified		e0			12.825 mm
ACPL-C799-000E	Broadcom	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE			1.27 mm	105 Cel	-40 Cel	TIN	DUAL		R-PDSO-G8	1	3.607 mm	5.85 mm			e3		260	6.807 mm
ACPL-C799-500E	Broadcom	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE			1.27 mm	105 Cel	-40 Cel	TIN	DUAL		R-PDSO-G8	1	3.607 mm	5.85 mm			e3		260	6.807 mm
EFR32BG1B132F256GM32-C0	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N32	2	.9 mm	5 mm			e3	40	260	5 mm
EFR32BG1V132F256GM32-C0	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N32	2	.9 mm	5 mm			e3	40	260	5 mm
MC13155DR2	Motorola	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		-5 V				SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G16		1.75 mm	3.9 mm	Not Qualified					9.9 mm
RS9113-N00-S0N-X00	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	101	XMA	RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED	54 Mbps	R-XXMA-N101		2.3 mm	14 mm		ALSO HAS BLUETOOTH DATA RATE= 1,2,3 Mbps and ZIGBEE DATA RATE= 250 kbps; ESD for WURX pin=1C				15 mm
SE2576L-R	Skyworks Solutions	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1					5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N16		.9 mm	3 mm				NOT SPECIFIED	NOT SPECIFIED	3 mm
SE5516A-R	Skyworks Solutions	TELECOM CIRCUIT	INDUSTRIAL	BUTT	24	HLGA	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		GRID ARRAY, HEAT SINK/SLUG			.5 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B24		1.15 mm	4 mm				NOT SPECIFIED	NOT SPECIFIED	4 mm
SI3462-E01-GMR	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	11	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N11		1 mm	3 mm						3 mm
SI4010-C2-ATR	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				3.3 V		SMALL OUTLINE			.5 mm	85 Cel	-40 Cel		DUAL		S-PDSO-G10		1.1 mm	3 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	3 mm
SI4012-C1001GTR	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			.0198 mA	3.3 V	2/3.3	SMALL OUTLINE	TSSOP10,.19,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		DUAL		S-PDSO-G10		1.1 mm	3 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	3 mm
SI4063-B1B-FMR	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N20		.9 mm	4 mm				NOT SPECIFIED	NOT SPECIFIED	4 mm
SI4063-C2A-GMR	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N20		.9 mm	4 mm						4 mm
SI4355-B1A-FMR	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	QCCN	SQUARE	UNSPECIFIED	YES	1					3.3 V		CHIP CARRIER				85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N20	2					e3	40	260
SI4455-B1A-FM	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N20	2	.9 mm	3 mm			e3	40	260	3 mm
SI4743-C10-GM	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N24	2	.9 mm	4 mm			e3	40	260	4 mm
SJA1105TEL	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	BALL	159	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100			1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B159	3	1.5 mm	12 mm			e1		260	12 mm
T5761-TGQ	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V	5	SMALL OUTLINE	SOP20,.4	Other Telecom ICs	1.27 mm	105 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G20	2	2.6 mm	7.4 mm	Not Qualified		e3			12.825 mm
T5761N-TGS	Atmel	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				.0099 mA	5 V	5	SMALL OUTLINE	SOP20,.4	Other Telecom ICs	1.27 mm	105 Cel	-40 Cel	TIN LEAD	DUAL		R-PDSO-G20	1		7.4 mm	Not Qualified		e0			12.825 mm
WT11I-A-AI4	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED	NO	1					3.3 V		MICROELECTRONIC ASSEMBLY			1.5 mm	85 Cel	-40 Cel		DUAL		R-XDMA-N28		2.86 mm	14.5 mm						35.75 mm
WT41-A-AI4	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	59		RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY			1.5 mm	85 Cel	-40 Cel		QUAD		R-XQMA-N59		5.65 mm	14.5 mm				NOT SPECIFIED	NOT SPECIFIED	35.55 mm
ABBTM-2.4GHZ-T2	Abracon	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	34		RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY			1.5 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N34	3	2.5 mm	13 mm						26.9 mm
ATA5428-PLQW	Atmel	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3 V	3/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N48		1 mm	7 mm	Not Qualified		e3			7 mm
BCM20736E	Cypress Semiconductor	TELECOM CIRCUIT	INDUSTRIAL	BUTT	48	TFLGA	SQUARE	UNSPECIFIED	YES	1							GRID ARRAY, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		BOTTOM		S-XBGA-B48		1.18 mm	6.5 mm						6.5 mm
BT121-A-V1	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	33		RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY			1 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N33		2.1 mm	11 mm						13.9 mm
CYBLE-214009-00	Cypress Semiconductor	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32		SQUARE	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY			.66 mm	85 Cel	-40 Cel		UNSPECIFIED		S-XXMA-N32		1.8 mm	11 mm				NOT SPECIFIED	NOT SPECIFIED	11 mm
CYBLE-222005-00	Cypress Semiconductor	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	22		SQUARE	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED		S-XXMA-N22		1.6 mm	10 mm						10 mm
EFR32BG13P532F512GM48-D	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N48	2	.9 mm	7 mm			e3	40	260	7 mm
EFR32BG13P632F512GM32-D	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N32	3	.9 mm	5 mm				40	260	5 mm
HSP50214BVIZ	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	120	QFP	SQUARE	PLASTIC/EPOXY	YES	1					5 V		FLATPACK			.8 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQFP-G120	3	4.07 mm	28 mm	Not Qualified		e3			28 mm
MGM111A256V1	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	31	XMA	RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY			1.2 mm	85 Cel	-40 Cel		UNSPECIFIED	.25 Mbps	R-XXMA-N31		2.1 mm	12.9 mm						15 mm
RS9113-N00-S1C-X68	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	79	XMA	RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED	54 Mbps	R-XXMA-N79		3.3 mm	16 mm		ALSO HAS BLUETOOTH DATA RATE= 1,2,3 Mbps and ZIGBEE DATA RATE= 250 kbps; ESD for WURX pin=1C				27 mm
SE4150L-R	Skyworks Solutions	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N24	1	1 mm	4 mm						4 mm
SE5003L1-R	Skyworks Solutions	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1					5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N20	3	.9 mm	4 mm					260	4 mm
SI32392-B-GM	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N48		.9 mm	7 mm				NOT SPECIFIED	NOT SPECIFIED	7 mm
SI4060-B1B-FM	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N20	1	.9 mm	4 mm			e3	40	260	4 mm
SI4063-C2A-GM	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.15SQ,20		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N20	1	.9 mm	4 mm			e3	40	260	4 mm
SI4355-C2A-GMR	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N20		.9 mm	3 mm				NOT SPECIFIED	NOT SPECIFIED	3 mm
SI4438-C2A-GM	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N20		.9 mm	4 mm						4 mm
SKY73087-11	Skyworks Solutions	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36	HQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS				5 V		CHIP CARRIER			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N36	3	1.15 mm	6 mm	Not Qualified					6 mm
WGM110A1MV2R	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40		RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY			1.25 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N40		2.1 mm	14.4 mm						21 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.