INDUSTRIAL Other Function Telecom Interface ICs 2,400+

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Maximum Gain Tolerance	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Linear Coding	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Filter
RS9113-N00-D1W-X74	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	79	XMA	RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel			UNSPECIFIED	54 Mbps	R-XXMA-N79		3.3 mm		16 mm		ALSO HAS BLUETOOTH DATA RATE= 1,2,3 Mbps and ZIGBEE DATA RATE= 250 kbps; ESD for WURX pin=1C				27 mm
SARA-U270-03S	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	BUTT	96		RECTANGULAR	UNSPECIFIED	YES	1				3.8 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel			UNSPECIFIED		R-XXMA-B96	4	3.25 mm		16 mm						26 mm
SI4313-B1-FMR	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V		CHIP CARRIER			.5 mm	85 Cel	-40 Cel		MATTE TIN	QUAD		S-XQCC-N20	1	.9 mm		4 mm	Not Qualified		e3	40	260	4 mm
SIM7000E-N	Simcom Wireless Solutions	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	68	QMA	SQUARE	UNSPECIFIED	YES	1				3.8 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel			QUAD	.066 Mbps	S-XQMA-N68
SL2S2102FUD,003	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	4	DIE	UNSPECIFIED	UNSPECIFIED	YES	1	CMOS					UNCASED CHIP				85 Cel	-40 Cel			UPPER		X-XUUC-N4								NOT SPECIFIED	NOT SPECIFIED
XM1100_1103874	Sierra Wireless	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	QMA	RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY			1.2 mm	85 Cel	-40 Cel			QUAD		R-XQMA-N20		2.3 mm		9 mm						9.5 mm
AD8285WBCPZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	72	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS	AEC-Q100		1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel		MATTE TIN	QUAD		S-XQCC-N72	3	.9 mm		10 mm			e3	30	260	10 mm
AP22814ASN-7	Diodes Incorporated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	HVSON	SQUARE	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	DUAL		S-PDSO-N6		.63 mm		2 mm			e4	30	260	2 mm
ATSAMW25H18-MR210PB1954	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	51		RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY			1.2 mm	85 Cel	-40 Cel			UNSPECIFIED		R-XXMA-N51		2.138 mm		14.908 mm						33.864 mm
CC8520RHAR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	5 Mbps	S-PQCC-N40	3	1 mm		6 mm	Not Qualified		e4	NOT SPECIFIED	260	6 mm
CY7B933-JI	Cypress Semiconductor	TELECOM CIRCUIT	INDUSTRIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		160 mA	5 V	5	CHIP CARRIER	LDCC28,.5SQ	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel		TIN LEAD	QUAD		S-PQCC-J28	3	4.572 mm		11.5316 mm	Not Qualified		e0			11.5316 mm
CY7B933-JIT	Cypress Semiconductor	TELECOM CIRCUIT	INDUSTRIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		160 mA	5 V	5	CHIP CARRIER	LDCC28,.5SQ	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel		TIN LEAD	QUAD		S-PQCC-J28		4.572 mm		11.5316 mm	Not Qualified		e0			11.5316 mm
ENW89829A2KF	Panasonic	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	XMA	RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel			UNSPECIFIED	2.178 Mbps	R-XXMA-N24		2 mm		9 mm				50	250	9.5 mm
GS2988-INTE3	Semtech	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS			2.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel		MATTE TIN	QUAD		S-XQCC-N16	3	.9 mm		4 mm			e3		260	4 mm
GS2988-INTE3Z	Semtech	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS			2.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel		MATTE TIN	QUAD		S-XQCC-N16	3	.9 mm		4 mm			e3		260	4 mm
HMC-C200	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	UNSPECIFIED	5		RECTANGULAR	UNSPECIFIED	NO	1				6.5 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		GOLD OVER NICKEL	UNSPECIFIED		R-XXMA-X5					Not Qualified		e4
HMC1094LP3E	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		MATTE TIN	QUAD		S-PQCC-N16	1	1 mm		3 mm			e3	30	260	3 mm
HMC862ALP3E	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				5.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		MATTE TIN	QUAD		S-PQCC-N16	3	1 mm		3 mm			e3	30	260	3 mm
LMX8410RGZT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD SILVER	QUAD		S-PQCC-N48	3	1 mm		7 mm			e4	30	260	7 mm
LTC5586IUH#PBF	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel		MATTE TIN	QUAD		S-PQCC-N32		.8 mm		6 mm			e3			6 mm
LTC5587IDD#TRPBF	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	12	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.3 V		SMALL OUTLINE			.45 mm	85 Cel	-40 Cel		Matte Tin (Sn) - annealed	DUAL		S-PDSO-N12	1	.8 mm		3 mm	Not Qualified		e3	30	260	3 mm
LXMS31ACNA-010	Murata Manufacturing	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	2	QCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1						CHIP CARRIER				85 Cel	-40 Cel			BOTTOM		R-PBCC-N2		.7 mm		1.6 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	3.2 mm
MAX3120ESA	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		TIN LEAD	DUAL		R-PDSO-G8	1	1.75 mm		3.9 mm	Not Qualified		e0			4.9 mm
MAX3120ESA+	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		Matte Tin (Sn) - annealed	DUAL		R-PDSO-G8	1	1.75 mm		3.9 mm	Not Qualified		e3	30	260	4.9 mm
MAX9152EUE	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		.07 mA	3.3 V	3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel		TIN LEAD	DUAL		R-PDSO-G16	1	1.1 mm		4.4 mm	Not Qualified		e0			5 mm
MAX9152EUE+	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		Matte Tin (Sn) - annealed	DUAL		R-PDSO-G16	1	1.1 mm		4.4 mm	Not Qualified		e3	30	260	5 mm
MDBT42Q-512K	Raytac	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	41		RECTANGULAR	UNSPECIFIED	YES	1				3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel			UNSPECIFIED		R-XXMA-N41		2.2 mm		10 mm						16 mm
MICRF230YQS	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE, SHRINK PITCH	SSOP16,.25		.635 mm	105 Cel	-40 Cel		MATTE TIN	DUAL	.02 Mbps	R-PDSO-G16		1.75 mm		3.91 mm			e3			4.9 mm
MRF24WG0MBT-I/RM	Microchip Technology		INDUSTRIAL		36			PLASTIC/EPOXY						3.3 V	3.3	MICROELECTRONIC ASSEMBLY	MODULE,36LEAD,.8	Other Telecom ICs		85 Cel	-40 Cel										Not Qualified
NRF24LE1-F16Q32-T	Nordic Semiconductor Asa	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	85 Cel	-40 Cel			QUAD	2 Mbps	S-XQCC-N32		.9 mm		5 mm						5 mm
RF430CL331HIRGTR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD	.848 Mbps	S-PQCC-N16	2	1 mm		3 mm			e4	30	260	3 mm
RS9113-N00-S0W-X78	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	101	XMA	RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel			UNSPECIFIED	54 Mbps	R-XXMA-N101		2.3 mm		14 mm		ALSO HAS BLUETOOTH DATA RATE= 1,2,3 Mbps and ZIGBEE DATA RATE= 250 kbps; ESD for WURX pin=1C				15 mm
SA616BS,115	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel			QUAD		S-PQCC-N20	1	1 mm		4 mm				30	260	4 mm
SI4438-B1C-FMR	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		MATTE TIN	QUAD		S-XQCC-N20	1	.9 mm		4 mm			e3	40	260	4 mm
SI4744-C10-GMR	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		MATTE TIN	QUAD		S-XQCC-N24	2	.9 mm		4 mm			e3	40	260	4 mm
SI4777-A20-GMR	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel			QUAD		S-XQCC-N40		.9 mm		6 mm				NOT SPECIFIED	NOT SPECIFIED	6 mm
SN65DSI85ZQE	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	64	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel			BOTTOM		S-PBGA-B64		1 mm		5 mm						5 mm
STS1TXQTR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel			QUAD		S-XQCC-N20		1 mm		4 mm				NOT SPECIFIED	NOT SPECIFIED	4 mm
TDA7116F	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR		.021 mA	3 V	2.1/4	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel			DUAL		S-PDSO-G10	1	1.1 mm		3 mm	Not Qualified				260	3 mm
TDA7116FXT	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	85 Cel	-40 Cel			DUAL		S-PDSO-G10		1.1 mm		3 mm				NOT SPECIFIED	NOT SPECIFIED	3 mm
TFF11145HN/N1,118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel			QUAD		S-PQCC-N24	1	1 mm		4 mm					260	4 mm
TRF3722IRGZT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N48	2	1 mm		7 mm			e4	30	260	7 mm
TRF7970ATB	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL							1				5 V						110 Cel	-40 Cel
VSC8491YJU-13	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	1				1 V		GRID ARRAY, LOW PROFILE			1 mm	110 Cel	-40 Cel			BOTTOM		S-PBGA-B196		1.4 mm		15 mm						15 mm
AD73311AR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3 V	3/5	SMALL OUTLINE	SOP20,.4	Codecs	1.27 mm	85 Cel	-40 Cel	1 dB	TIN LEAD	DUAL		R-PDSO-G20	1	2.65 mm	16-BIT	7.5 mm	Not Qualified		e0		240	12.8 mm	YES
AD73311LARS-REEL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		.0125 mA	3 V	3	SMALL OUTLINE, SHRINK PITCH	SSOP20,.3	Modems	.65 mm	105 Cel	-40 Cel		TIN LEAD	DUAL		R-PDSO-G20	1	2 mm		5.3 mm	Not Qualified		e0		240	7.2 mm
AD73311LARS-REEL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		.0125 mA	3 V	3	SMALL OUTLINE, SHRINK PITCH	SSOP20,.3	Modems	.65 mm	105 Cel	-40 Cel		TIN LEAD	DUAL		R-PDSO-G20	1	2 mm		5.3 mm	Not Qualified		e0		240	7.2 mm
AD73360ARZ-REEL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		MATTE TIN	DUAL		R-PDSO-G28	3	2.65 mm		7.5 mm	Not Qualified		e3	30	260	17.9 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.