INDUSTRIAL Other Function Telecom Interface ICs 2,400+

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

SPWF04SA

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

30

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

1.524 mm

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N30

2.3 mm

15.24 mm

NOT SPECIFIED

NOT SPECIFIED

26.924 mm

XB24CZ7PIS-004

Digi International

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N

NOT SPECIFIED

NOT SPECIFIED

BGM111E256V2

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

BUTT

31

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

1.2 mm

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-B31

2.15 mm

12.9 mm

15 mm

BLE121LR-A-M256K

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

36

RECTANGULAR

UNSPECIFIED

YES

1

3 V

MICROELECTRONIC ASSEMBLY

.9 mm

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N36

1.8 mm

13 mm

14.7 mm

BT900-SA-03

Laird Technologies

TELECOM CIRCUIT

INDUSTRIAL

UNSPECIFIED

47

RECTANGULAR

UNSPECIFIED

NO

1

3.3 V

MICROELECTRONIC ASSEMBLY

.8 mm

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-X47

2.4 mm

12.5 mm

NOT SPECIFIED

NOT SPECIFIED

19 mm

EMMY-W161-00B

U-blox Ag

TELECOM CIRCUIT

INDUSTRIAL

BUTT

46

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

QUAD

R-XQMA-B46

13.8 mm

40

245

19.8 mm

ESP32-WROVER-B(M213DH6464PH3Q0)

Espressif Systems (Shanghai)

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

39

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

1.27 mm

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N39

3.4 mm

18 mm

NOT SPECIFIED

NOT SPECIFIED

31.4 mm

IDT82V3010PVG8

Renesas Electronics

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

56

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.3 V

SMALL OUTLINE, SHRINK PITCH

.635 mm

85 Cel

-40 Cel

Matte Tin (Sn) - annealed

DUAL

R-PDSO-G56

1

2.794 mm

7.493 mm

Not Qualified

e3

30

260

18.415 mm

NRF24LE1-F16Q48-R7

Nordic Semiconductor Asa

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC48,.28SQ,20

.5 mm

85 Cel

-40 Cel

QUAD

2 Mbps

S-XQCC-N48

.9 mm

7 mm

7 mm

RFFC2071TR7

Qorvo

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N32

1 mm

5 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

5 mm

SI32391-B-GM

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N48

.9 mm

7 mm

NOT SPECIFIED

NOT SPECIFIED

7 mm

SI4010-C2-GS

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

SMALL OUTLINE

1.27 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G14

3

2 mm

3.9 mm

Not Qualified

e3

40

260

8.65 mm

STA8090GATR

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

56

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

1.2 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N56

3

.9 mm

8 mm

e3

250

8 mm

80HCPS1432CHMGI

Renesas Electronics

TELECOM CIRCUIT

INDUSTRIAL

BALL

576

BGA

SQUARE

PLASTIC/EPOXY

YES

1

1 V

GRID ARRAY

1 mm

85 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

S-PBGA-B576

4

2.83 mm

25 mm

e1

NOT SPECIFIED

245

25 mm

AD73311AR-REEL

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

20

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

3 V

3/5

SMALL OUTLINE

SOP20,.4

Codecs

1.27 mm

85 Cel

-40 Cel

1 dB

Tin/Lead (Sn85Pb15)

DUAL

R-PDSO-G20

1

2.65 mm

16-BIT

7.5 mm

Not Qualified

e0

30

240

12.8 mm

YES

AD9864BCPZRL

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC48,.27SQ,20

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

.02 Mbps

S-XQCC-N48

3

1 mm

7 mm

e3

30

260

7 mm

BGM121A256V1

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

56

SQUARE

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

S-XXMA-N56

1.4 mm

6.5 mm

6.5 mm

BGM121A256V1R

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

56

SQUARE

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

S-XXMA-N56

1.4 mm

6.5 mm

6.5 mm

BQ500212ARGZR

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

110 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N48

3

1 mm

7 mm

e4

30

260

7 mm

ESP32-WROVER-IE(4MB)

Espressif Systems (Shanghai)

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

38

DMA

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

1.27 mm

85 Cel

-40 Cel

DUAL

150 Mbps

R-XDMA-N38

3

3.45 mm

18 mm

250

31.4 mm

GS2984-INE3

Semtech

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

UNSPECIFIED

YES

1

BICMOS

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.65 mm

85 Cel

-40 Cel

Matte Tin (Sn)

QUAD

S-XQCC-N16

1

.9 mm

4 mm

e3

40

260

4 mm

RS9113-N00-D1W-X78

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

79

XMA

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

54 Mbps

R-XXMA-N79

3.3 mm

16 mm

ALSO HAS BLUETOOTH DATA RATE= 1,2,3 Mbps and ZIGBEE DATA RATE= 250 kbps; ESD for WURX pin=1C

27 mm

ST7570

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

48

HVFQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

.03 mA

13 V

13

FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH

LCC48,.27SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

Matte Tin (Sn) - annealed

QUAD

S-PQFP-G48

3

1 mm

7 mm

Not Qualified

e3

40

260

7 mm

ST7570TR

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

48

HVFQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

.03 mA

13 V

13

FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH

LCC48,.27SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G48

3

1 mm

7 mm

Not Qualified

e3

40

260

7 mm

SY88403BLEY

Microchip Technology

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

10

HTSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.3 V

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

.5 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G10

1.1 mm

3 mm

Not Qualified

e3

3 mm

SY88403BLMG-TR

Microchip Technology

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC16,.12SQ,20

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

4250 Mbps

S-XQCC-N16

2

1 mm

3 mm

Not Qualified

e4

40

260

3 mm

AD73322AR

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

28

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

3 V

3/5

SMALL OUTLINE

SOP28,.4

Codecs

1.27 mm

85 Cel

-40 Cel

1.2 dB

TIN LEAD

DUAL

R-PDSO-G28

3

2.65 mm

16-BIT

7.5 mm

Not Qualified

e0

240

17.9 mm

YES

AD73322AST

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

44

LQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3 V

3/5

FLATPACK, LOW PROFILE

QFP44,.63SQ,40

Codecs

1 mm

85 Cel

-40 Cel

1.2 dB

TIN LEAD

QUAD

S-PQFP-G44

3

1.6 mm

16-BIT

14 mm

Not Qualified

e0

240

14 mm

YES

AD73322AST-REEL

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

44

LQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3 V

3/5

FLATPACK, LOW PROFILE

QFP44,.63SQ,40

Codecs

1 mm

85 Cel

-40 Cel

1.2 dB

TIN LEAD

QUAD

S-PQFP-G44

3

1.6 mm

16-BIT

14 mm

Not Qualified

e0

240

14 mm

YES

AD8314ACP-REEL7

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

8

VSON

RECTANGULAR

UNSPECIFIED

YES

1

3 V

SMALL OUTLINE, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

R-XDSO-N8

1

1 mm

2 mm

Not Qualified

e0

240

3 mm

AD8314ACP-WP

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

8

VSON

RECTANGULAR

UNSPECIFIED

YES

1

3 V

SMALL OUTLINE, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

R-XDSO-N8

1

1 mm

2 mm

Not Qualified

e0

240

3 mm

AD8314ARM

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

S-PDSO-G8

1

1.1 mm

3 mm

Not Qualified

e0

240

3 mm

AD8314ARM-REEL7

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

S-PDSO-G8

1

1.1 mm

3 mm

Not Qualified

e0

240

3 mm

AD8314ARMZ-REEL

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

S-PDSO-G8

1

1.1 mm

3 mm

Not Qualified

e3

260

3 mm

ADN2830ACP32-REEL

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-XQCC-N32

3

1 mm

5 mm

Not Qualified

e0

240

5 mm

ADN2830ACP32-REEL7

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-XQCC-N32

3

1 mm

5 mm

Not Qualified

e0

240

5 mm

BQ500211RGZT

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

110 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

QUAD

S-PQCC-N48

3

1 mm

7 mm

e4

NOT SPECIFIED

260

7 mm

CMX992Q3

Cml Microcircuits

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N48

1 mm

7 mm

Not Qualified

7 mm

FC20N-Q73B

Quectel Wireless Solutions

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

52

XMA

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

433 Mbps

R-XXMA-N52

2.1 mm

13 mm

Seated Hgt-Nom

16.6 mm

LTC5100EUF#PBF

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.65 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQCC-N16

1

.8 mm

4 mm

Not Qualified

e3

30

260

4 mm

MICRF009YM

Microchip Technology

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE

SOP16,.25

1.27 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

.002 Mbps

R-PDSO-G16

1

1.895 mm

3.9 mm

Operates from 4.75V to 5.5V

e3

30

260

9.9 mm

MRF24J40MET-I/RM

Microchip Technology

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

12

RECTANGULAR

UNSPECIFIED

NO

1

TS 16949

3.3 V

MICROELECTRONIC ASSEMBLY

2.54 mm

85 Cel

-40 Cel

DUAL

R-XDMA-N12

3.48 mm

22.86 mm

33.02 mm

NEO-7N-0

U-blox Ag

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

24

RECTANGULAR

UNSPECIFIED

NO

1

AEC-Q100

3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

SILVER OVER NICKEL

DUAL

R-XDMA-N24

2.6 mm

12.2 mm

e4

16 mm

PGA5807ARGCR

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

64

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N64

3

1 mm

9 mm

e4

30

260

9 mm

RFPA5201ESR

Qorvo

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

14

HTSON

SQUARE

UNSPECIFIED

YES

1

5 V

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE

85 Cel

-40 Cel

DUAL

S-XDSO-N14

1.05 mm

7 mm

7 mm

RFPA5201ETR13

Qorvo

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

14

HTSON

SQUARE

UNSPECIFIED

YES

1

5 V

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE

85 Cel

-40 Cel

DUAL

S-XDSO-N14

1.05 mm

7 mm

7 mm

RS9113-N00-D1W-X68

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

79

XMA

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

54 Mbps

R-XXMA-N79

3.3 mm

16 mm

ALSO HAS BLUETOOTH DATA RATE= 1,2,3 Mbps and ZIGBEE DATA RATE= 250 kbps; ESD for WURX pin=1C

27 mm

RS9113-N00-D1W-X72

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

79

XMA

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

54 Mbps

R-XXMA-N79

3.3 mm

16 mm

ALSO HAS BLUETOOTH DATA RATE= 1,2,3 Mbps and ZIGBEE DATA RATE= 250 kbps; ESD for WURX pin=1C

27 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.