Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Applications | Surface Mount | No. of Functions | Output Code | No. of Channels | Technology | Screening Level | Nominal Negative Supply Voltage | No. of Transceivers | Maximum Supply Current | Nominal Supply Voltage | Hybrid | Input Code | Power Supplies (V) | ISDN Access Rate | Package Style (Meter) | Package Equivalence Code | Sub-Category | Carrier Type-3 | Terminal Pitch | Maximum Operating Temperature | Resolution (um) | Battery Supply (V) | Minimum Output High Voltage | Maximum Output Low Voltage | Standard | Minimum Operating Temperature | Maximum Gain Tolerance | Terminal Finish | Maximum Output Voltage | Terminal Position | Data Rate | JESD-30 Code | Reference Point | Output (V) | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Linear Coding | Carrier Type-2 | Carrier Type-1 | Width | Qualification | Maximum Output Low Current | Companding Law | Input Type | Additional Features | Battery Feed | Maximum Analog Input | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Filter |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
48 |
VQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
2.2 V |
CHIP CARRIER, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
.5 Mbps |
S-PQCC-N48 |
3 |
1 mm |
7 mm |
Not Qualified |
e4 |
30 |
260 |
7 mm |
||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-XQCC-N32 |
3 |
1 mm |
5 mm |
e4 |
260 |
5 mm |
||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
105 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQCC-N32 |
1 |
.8 mm |
6 mm |
e3 |
30 |
260 |
6 mm |
||||||||||||||||||||||||||||||||||||||
|
U-blox Ag |
TELECOM CIRCUIT |
INDUSTRIAL |
BUTT |
1 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
UNSPECIFIED |
R-XXMA-B1 |
4 |
4.2 mm |
10 mm |
14 mm |
||||||||||||||||||||||||||||||||||||||||||||
|
Qorvo |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N32 |
1 mm |
5 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
5 mm |
|||||||||||||||||||||||||||||||||||||||
Qorvo |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N32 |
.95 mm |
5 mm |
5 mm |
|||||||||||||||||||||||||||||||||||||||||||
Silicon Labs |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
107 |
LGA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
1.85 V |
GRID ARRAY |
85 Cel |
-40 Cel |
BOTTOM |
R-XBGA-N107 |
||||||||||||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
TELECOM CIRCUIT |
INDUSTRIAL |
HVQCCN |
1 |
CMOS |
3.3 V |
.5 mm |
85 Cel |
-40 Cel |
.9 mm |
3 mm |
3 mm |
||||||||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.4 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
S-PDSO-N8 |
3 |
.6 mm |
2 mm |
e3 |
2 mm |
||||||||||||||||||||||||||||||||||||||||
|
Semtech |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
28 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.65 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N28 |
3 |
1 mm |
6 mm |
e3 |
260 |
6 mm |
|||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
8 |
VSON |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3 V |
SMALL OUTLINE, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-XDSO-N8 |
1 |
1 mm |
2 mm |
Not Qualified |
e3 |
30 |
260 |
3 mm |
|||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
.3774 mA |
3.3 V |
1.2,1.8/3.3,3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N24 |
3 |
1 mm |
4 mm |
Not Qualified |
e3 |
4 mm |
||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
40 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC40,.24SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
5 Mbps |
S-PQCC-N40 |
3 |
1 mm |
6 mm |
Not Qualified |
e4 |
NOT SPECIFIED |
260 |
6 mm |
|||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
40 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC40,.24SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
5 Mbps |
S-PQCC-N40 |
3 |
1 mm |
6 mm |
Not Qualified |
e4 |
NOT SPECIFIED |
260 |
6 mm |
|||||||||||||||||||||||||||||||||
|
Infineon Technologies |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
31 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
1.27 mm |
85 Cel |
-40 Cel |
UNSPECIFIED |
R-XXMA-N31 |
3 |
2 mm |
14.52 mm |
19.2 mm |
|||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
2 |
2.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
10300 Mbps |
S-XQCC-N24 |
3 |
.8 mm |
4 mm |
e3 |
30 |
260 |
4 mm |
||||||||||||||||||||||||||||||||||||
|
Panasonic |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
UNSPECIFIED |
R-XXMA-N |
2 mm |
8.7 mm |
50 |
250 |
15.6 mm |
||||||||||||||||||||||||||||||||||||||||||||
|
U-blox Ag |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
28 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
AEC-Q100 |
3 V |
MICROELECTRONIC ASSEMBLY |
1.1 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDMA-N28 |
4 |
2.7 mm |
17 mm |
22.4 mm |
||||||||||||||||||||||||||||||||||||||||||
|
U-blox Ag |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
AEC-Q100 |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
DUAL |
R-XDMA-N24 |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
100 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
11300 Mbps |
S-PQCC-N16 |
2 |
1 mm |
3 mm |
Not Qualified |
e4 |
NOT SPECIFIED |
260 |
3 mm |
||||||||||||||||||||||||||||||||||||
|
Psemi |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
10 |
VQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
2.6 V |
CHIP CARRIER, VERY THIN PROFILE |
LCC10,.08SQ,20 |
.5 mm |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
S-XQCC-N10 |
1 |
.5 mm |
2 mm |
e4 |
30 |
260 |
2 mm |
||||||||||||||||||||||||||||||||||||
|
Qorvo |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N32 |
.95 mm |
5 mm |
NOT SPECIFIED |
NOT SPECIFIED |
5 mm |
||||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N20 |
.9 mm |
4 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
4 mm |
||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
20 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
.0125 mA |
3 V |
3 |
SMALL OUTLINE, SHRINK PITCH |
SSOP20,.3 |
Modems |
.65 mm |
105 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G20 |
1 |
2 mm |
5.3 mm |
Not Qualified |
e3 |
260 |
7.2 mm |
|||||||||||||||||||||||||||||||||
|
Atmel |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
.0086 mA |
5 V |
5 |
SMALL OUTLINE |
SOP20,.4 |
Other Telecom ICs |
1.27 mm |
105 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G20 |
1 |
7.4 mm |
Not Qualified |
e3 |
260 |
12.825 mm |
|||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
6 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
2.7 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.54 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-N6 |
.77 mm |
1.7 mm |
NOT SPECIFIED |
NOT SPECIFIED |
2.3 mm |
|||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
110 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N48 |
3 |
1 mm |
7 mm |
e4 |
30 |
260 |
7 mm |
||||||||||||||||||||||||||||||||||||||
Murata Manufacturing |
TELECOM CIRCUIT |
INDUSTRIAL |
THROUGH-HOLE |
30 |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
MICROELECTRONIC ASSEMBLY |
1.27 mm |
85 Cel |
-40 Cel |
DUAL |
R-XDMA-T30 |
24.9 mm |
38.1 mm |
|||||||||||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
TELECOM CIRCUIT |
INDUSTRIAL |
BALL |
43 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
85 Cel |
-40 Cel |
BOTTOM |
R-PBGA-B43 |
.54 mm |
3.143 mm |
3.295 mm |
|||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N24 |
3 |
.95 mm |
4 mm |
4 mm |
||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQCC-N32 |
3 |
1 mm |
5 mm |
e3 |
30 |
260 |
5 mm |
||||||||||||||||||||||||||||||||||||||
Microchip Technology |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
36 |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
TS 16949 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
1.27 mm |
85 Cel |
-40 Cel |
DUAL |
R-XDMA-N36 |
2.7 mm |
21 mm |
31 mm |
||||||||||||||||||||||||||||||||||||||||||||
|
U-blox Ag |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
AEC-Q100 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
DUAL |
R-XDMA-N24 |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
40 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
1.25 mm |
85 Cel |
-40 Cel |
UNSPECIFIED |
R-XXMA-N40 |
2.1 mm |
14.4 mm |
21 mm |
||||||||||||||||||||||||||||||||||||||||||||
|
Semtech |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
BICMOS |
.075 mA |
3.3 V |
2.5/3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.27SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) |
QUAD |
S-XQCC-N48 |
.9 mm |
8 mm |
Not Qualified |
e3 |
8 mm |
|||||||||||||||||||||||||||||||||||
|
Silicon Labs |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
64 |
QCCN |
SQUARE |
YES |
1.8 V |
CHIP CARRIER |
LCC64,.35SQ,20 |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQCC-N64 |
3 |
1.3 mm |
9 mm |
40 |
260 |
9 mm |
|||||||||||||||||||||||||||||||||||||||||
|
Ls Research |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
52 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.6 V |
MICROELECTRONIC ASSEMBLY |
1 mm |
85 Cel |
-40 Cel |
QUAD |
R-XQMA-N52 |
4 |
1.9 mm |
13 mm |
18 mm |
|||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3 V |
SMALL OUTLINE |
1.27 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G20 |
1 |
2.65 mm |
7.5 mm |
Not Qualified |
e3 |
30 |
260 |
12.8 mm |
||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3 V |
SMALL OUTLINE |
1.27 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G20 |
1 |
2.65 mm |
7.5 mm |
Not Qualified |
e3 |
30 |
260 |
12.8 mm |
||||||||||||||||||||||||||||||||||||
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
20 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
.0125 mA |
3 V |
3 |
SMALL OUTLINE, SHRINK PITCH |
SSOP20,.3 |
Modems |
.65 mm |
105 Cel |
-40 Cel |
Tin/Lead (Sn85Pb15) |
DUAL |
R-PDSO-G20 |
1 |
2 mm |
5.3 mm |
Not Qualified |
e0 |
30 |
240 |
7.2 mm |
|||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
20 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
.0125 mA |
3 V |
3 |
SMALL OUTLINE, SHRINK PITCH |
SSOP20,.3 |
Modems |
.65 mm |
105 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G20 |
1 |
2 mm |
5.3 mm |
Not Qualified |
e3 |
260 |
7.2 mm |
|||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
20 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
.0125 mA |
3 V |
3 |
SMALL OUTLINE, SHRINK PITCH |
SSOP20,.3 |
Modems |
.65 mm |
105 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G20 |
1 |
2 mm |
5.3 mm |
Not Qualified |
e3 |
40 |
260 |
7.2 mm |
||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
26 mA |
5 V |
SMALL OUTLINE |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G8 |
Not Qualified |
e3 |
|||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
56 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
.44 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC56,.31SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-XQCC-N56 |
3 |
1 mm |
8 mm |
Not Qualified |
e3 |
8 mm |
||||||||||||||||||||||||||||||||||
|
Atmel |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
.01 mA |
3 V |
3,5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.2SQ,25 |
Other Telecom ICs |
.65 mm |
105 Cel |
-40 Cel |
QUAD |
S-XQCC-N24 |
1 mm |
5 mm |
Not Qualified |
5 mm |
||||||||||||||||||||||||||||||||||||||
|
Atmel |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
11.6 mA |
3 V |
3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Other Telecom ICs |
.65 mm |
85 Cel |
-40 Cel |
DUAL |
S-PDSO-G8 |
1.05 mm |
3 mm |
Not Qualified |
3 mm |
||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
.0116 mA |
3 V |
3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Other Telecom ICs |
.65 mm |
85 Cel |
-55 Cel |
MATTE TIN |
DUAL |
S-PDSO-G8 |
1.05 mm |
3 mm |
Not Qualified |
e3 |
3 mm |
||||||||||||||||||||||||||||||||||||
|
Ii-vi |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N24 |
2 |
.6 mm |
4 mm |
Not Qualified |
4 mm |
Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.
Some common types of Other Function Telecom Interface ICs include:
1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.
2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.
3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.
4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.