INDUSTRIAL Other Function Telecom Interface ICs 2,400+

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Battery Supply (V)	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
ATA8402C-6AQY66	Atmel	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				11.6 mA	3 V	3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19	Other Telecom ICs	.65 mm	85 Cel		-40 Cel		DUAL		S-PDSO-G8		1.05 mm	3 mm	Not Qualified					3 mm
BQ51003YFPT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	28	VFBGA	RECTANGULAR	UNSPECIFIED	YES	1							GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	5	-40 Cel	TIN SILVER COPPER	BOTTOM		R-XBGA-B28	1	.5 mm	1.88 mm			e1	30	260	3 mm
DNT24C	Murata Manufacturing	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	30		RECTANGULAR	UNSPECIFIED	NO	1							MICROELECTRONIC ASSEMBLY			1.27 mm	85 Cel		-40 Cel		DUAL		R-XDMA-N30			24.9 mm				NOT SPECIFIED	NOT SPECIFIED	38.1 mm
EC21EUGA-512-SGNS	Quectel Wireless Solutions	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	144	XMA	RECTANGULAR	UNSPECIFIED	YES	1					3.8 V		MICROELECTRONIC ASSEMBLY				85 Cel		-40 Cel		UNSPECIFIED	10 Mbps	R-XXMA-N144		2.4 mm	29 mm		SEATED HEIGHT NOM				32 mm
HMC566LP4E	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	MATTE TIN	QUAD		S-PQCC-N24	3	1 mm	4 mm	Not Qualified		e3	30	260	4 mm
SN65DSI85ZQER	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	64	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1 Mbps	S-PBGA-B64	3	1 mm	5 mm			e1	30	260	5 mm
XB3-24Z8PS-J	Digi International	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	37		RECTANGULAR	UNSPECIFIED	YES	1							MICROELECTRONIC ASSEMBLY				85 Cel		-40 Cel		UNSPECIFIED		R-XXMA-N37							NOT SPECIFIED	NOT SPECIFIED
AD9172BBPZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	144	FBGA	SQUARE	PLASTIC/EPOXY	YES	1					1 V		GRID ARRAY, FINE PITCH			.8 mm	85 Cel		-40 Cel		BOTTOM		S-PBGA-B144		1.71 mm	10 mm				NOT SPECIFIED	NOT SPECIFIED	10 mm
ATWILC1000-MR110PB	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28	XMA	RECTANGULAR	UNSPECIFIED	YES	1			TS 16949		3.3 V		MICROELECTRONIC ASSEMBLY			1.016 mm	85 Cel		-40 Cel		UNSPECIFIED	72.2 Mbps	R-XXMA-N28		2.113 mm	14.73 mm		Data rate max for 802.11b is 11Mbps and for 802.11g is 54Mbps		NOT SPECIFIED	NOT SPECIFIED	21.72 mm
HMC1094LP3ETR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	MATTE TIN	QUAD		S-PQCC-N16	1	1 mm	3 mm			e3	30	260	3 mm
MAX7033EUI	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS		.00688 mA	3.3 V	3.3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25	Other Telecom ICs	.65 mm	105 Cel		-40 Cel	TIN LEAD	DUAL		R-PDSO-G28	1	1.1 mm	4.4 mm	Not Qualified		e0			9.7 mm
MAX7033EUI+	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS		.00688 mA	3.3 V	3.3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25	Other Telecom ICs	.65 mm	105 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL		R-PDSO-G28	1	1.1 mm	4.4 mm	Not Qualified		e3	30	260	9.7 mm
PE4312MLBA-Z	Psemi	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N20	1	.9 mm	4 mm			e4	30	260	4 mm
SKY66110-11	Skyworks Solutions	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	RECTANGULAR	UNSPECIFIED	YES	1					3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.25 mm	85 Cel		-40 Cel		QUAD		R-XQCC-N20	3	.9 mm	3 mm					260	3.3 mm
TRF37B32IRTVR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	2				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	QUAD		S-PQCC-N32	2	.8 mm	5 mm		RF frequency(Min)(MHz) is 700; RF frequency(Max)(MHz) is 2700	e4	30	260	5 mm
AD6676BCBZRL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	80	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					1.1 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM		R-PBGA-B80	1	.66 mm	5.04 mm			e1	30	260	4.29 mm
L70B-M39	Quectel Wireless Solutions	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	18	DMA	RECTANGULAR	UNSPECIFIED	YES	1							MICROELECTRONIC ASSEMBLY				85 Cel		-40 Cel		DUAL		R-XDMA-N18		2.5 mm	9.7 mm		SEATED HGT-NOM; OPERATED WITH 2.8V TO 4.3V				10.1 mm
ML7037-003TBZ03A	Lapis Semiconductor	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	TFQFP	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		FLATPACK, THIN PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel		QUAD		S-PQFP-G64		1.2 mm	10 mm						10 mm
SI4010-C2-GSR	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS			3.3 V		SMALL OUTLINE			1.27 mm	85 Cel		-40 Cel		DUAL		R-PDSO-G14		2 mm	3.9 mm	Not Qualified			40	260	8.65 mm
ZOE-M8B-0	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	BUTT	51	TFLGA	SQUARE	UNSPECIFIED	YES	1					1.8 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel		BOTTOM		S-XBGA-B51	3	1.165 mm	4.5 mm						4.5 mm
AD9864BCPZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20		.5 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	.02 Mbps	S-XQCC-N48	3	1 mm	7 mm			e3	30	260	7 mm
AT86RF231-ZUR	Microchip Technology		INDUSTRIAL	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES			CMOS				1.8,3	CHIP CARRIER	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN	QUAD		S-PQCC-N32				Not Qualified		e3
ATWILC1000-MR110PB-T	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28	XMA	RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY			1.016 mm	85 Cel		-40 Cel		UNSPECIFIED	72.2 Mbps	R-XXMA-N28		2.113 mm	14.73 mm		Data rate max for 802.11b is 11Mbps and for 802.11g is 54Mbps		NOT SPECIFIED	NOT SPECIFIED	21.72 mm
BGM123A256V2	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56		SQUARE	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel		-40 Cel		UNSPECIFIED		S-XXMA-N56	3	1.4 mm	6.5 mm				40	260	6.5 mm
BMD-360-A-R-00	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	47	XMA	RECTANGULAR	UNSPECIFIED	YES	1					3 V		MICROELECTRONIC ASSEMBLY				85 Cel		-40 Cel		UNSPECIFIED	2 Mbps	R-XXMA-N47	3	1.9 mm	9.8 mm					250	14 mm
CC2430ZF128RTCR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS			3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD	.25 Mbps	S-XQCC-N48	3	.9 mm	7 mm	Not Qualified		e4	30	260	7 mm
HMC566LP4ETR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	MATTE TIN	QUAD		S-PQCC-N24	3	1 mm	4 mm			e3	30	260	4 mm
HMC773ALC3B	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	12	HVQCCN	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	1							CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	TUNGSTEN NICKEL GOLD	QUAD		S-CQCC-N12	3	.92 mm	3 mm					260	3 mm
LTC5800IWR-IPMA#PBF	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	72	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		CMOS			3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	SILVER	QUAD		S-PQCC-N72		1 mm	10 mm			e4			10 mm
PE42423MLBA-Z	Psemi	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N16	3	.8 mm	3 mm			e4			3 mm
ATSAMW25H18-MR510PB	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	51		RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY			1.2 mm	85 Cel		-40 Cel		UNSPECIFIED		R-XXMA-N51		2.138 mm	14.908 mm						33.864 mm
BGS13SN8E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BUTT	8	BCC	SQUARE	UNSPECIFIED	YES	1		MOS					CHIP CARRIER			.4 mm	85 Cel		-40 Cel	TIN	BOTTOM		S-XBCC-B8	1	.4 mm	1.1 mm			e3			1.1 mm
ESP8285H16	Espressif Systems (Shanghai)	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	105 Cel		-40 Cel	TIN	QUAD	72.2 Mbps	S-XQCC-N32	3	.9 mm	5 mm			e3	30	250	5 mm
NRF905	Nordic Semiconductor Asa	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel		QUAD		S-XQCC-N32		.9 mm	5 mm	Not Qualified			30	260	5 mm
SA602AD-T	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BIPOLAR			6 V		SMALL OUTLINE			1.27 mm	85 Cel		-40 Cel		DUAL		R-PDSO-G8		1.75 mm	3.9 mm						4.9 mm
XB3-24Z8RS-J	Digi International	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	37		RECTANGULAR	UNSPECIFIED	YES	1							MICROELECTRONIC ASSEMBLY				85 Cel		-40 Cel		UNSPECIFIED		R-XXMA-N37							NOT SPECIFIED	NOT SPECIFIED
BGA5H1BN6E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BUTT	6	BCC	RECTANGULAR	UNSPECIFIED	YES	1					1.8 V		CHIP CARRIER			.4 mm	85 Cel		-40 Cel		BOTTOM		R-XBCC-B6	1	.4 mm	.7 mm						1.1 mm
CC2430ZF128RTC	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS			3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD	.25 Mbps	S-XQCC-N48	3	.9 mm	7 mm	Not Qualified		e4	30	260	7 mm
EFR32BG1P332F256GJ43-C0	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	BALL	43	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					3.3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM		R-PBGA-B43	1	.54 mm	3.143 mm			e1	40	260	3.295 mm
ISL32277EIRZ-T	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVSON	SQUARE	PLASTIC/EPOXY	YES	1		BICMOS			3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	MATTE TIN	DUAL		S-PDSO-N24	3	1 mm	4 mm			e3	30	260	4 mm
LM15851NKE10	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	1					1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel		QUAD		S-XQCC-N68		1 mm	10 mm						10 mm
PLM15851NKE	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	1					1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel		QUAD		S-XQCC-N68		1 mm	10 mm						10 mm
RM024-P125-C-30	Laird Technologies	TELECOM CIRCUIT	INDUSTRIAL	UNSPECIFIED		XMA	RECTANGULAR	UNSPECIFIED	NO	1							MICROELECTRONIC ASSEMBLY				85 Cel		-40 Cel		UNSPECIFIED	.5 Mbps	R-XXMA-X					ALSO AVAILABLE WITH 280kbps data rate		NOT SPECIFIED	NOT SPECIFIED
SI32170-C-GM1	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	BUTT	42	HVBCC	RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel		BOTTOM		R-XBCC-B42		.9 mm	5 mm				NOT SPECIFIED	NOT SPECIFIED	7 mm
TPS80010ARSMR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD		R-PQCC-N32	2	1 mm	4 mm	Not Qualified		e4	NOT SPECIFIED	260	4 mm
AD8312ACBZ-P7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM		R-PBGA-B6	1	.675 mm	.95 mm	Not Qualified		e1	40	260	1.45 mm
BGA5M1BN6E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BUTT	6	BCC	RECTANGULAR	UNSPECIFIED	YES	1					1.8 V		CHIP CARRIER			.4 mm	85 Cel		-40 Cel		BOTTOM		R-XBCC-B6	1	.4 mm	.7 mm						1.1 mm
BMD-301-A-R	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD		XMA	RECTANGULAR	UNSPECIFIED	YES	1							MICROELECTRONIC ASSEMBLY				85 Cel		-40 Cel		UNSPECIFIED	2 Mbps	R-XXMA-N

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.