INDUSTRIAL Other Function Telecom Interface ICs 2,400+

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Maximum Gain Tolerance	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Linear Coding	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Filter
LMX2571NJKT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		MATTE TIN	QUAD		S-XQCC-N36	3	.8 mm		6 mm			e3	30	260	6 mm
MAX3120EUA	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		TIN LEAD	DUAL		S-PDSO-G8	1	1.1 mm		3 mm	Not Qualified		e0			3 mm
MAX3120EUA+	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		Matte Tin (Sn) - annealed	DUAL		S-PDSO-G8	1	1.1 mm		3 mm	Not Qualified		e3	30	260	3 mm
RFFC5072TR7	Qorvo	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS			3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel			QUAD		S-XQCC-N32		.95 mm		5 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	5 mm
RM024-S10-C-30	Laird Technologies	TELECOM CIRCUIT	INDUSTRIAL	UNSPECIFIED		XMA	RECTANGULAR	UNSPECIFIED	NO	1							MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel			UNSPECIFIED	.5 Mbps	R-XXMA-X						ALSO AVAILABLE WITH 280kbps data rate		NOT SPECIFIED	NOT SPECIFIED
SA612AD,602	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					6 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel			DUAL		R-PDSO-G8		1.75 mm		3.9 mm	Not Qualified					4.9 mm
SA639DH/01,112	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G24	1	1.1 mm		4.4 mm	Not Qualified		e4		260	7.8 mm
SKY66112-11	Skyworks Solutions	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	22	HQCCN	RECTANGULAR	UNSPECIFIED	YES	1					3 V		CHIP CARRIER, HEAT SINK/SLUG			.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD		R-XQCC-N22	3	1.1 mm		3 mm			e4		260	3.5 mm
TUSB211QRWBRQ1	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	12	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1	1		AEC-Q100	.02 mA	3.3 V		CHIP CARRIER, VERY THIN PROFILE			.4 mm	105 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD	480 Mbps	S-PQCC-N12	2	.4 mm		1.6 mm			e4	30	260	1.6 mm
UBX-M8030-CT	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	BALL	47	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100		3 V		GRID ARRAY				85 Cel	-40 Cel			BOTTOM		R-PBGA-B47	1
450-0152C	Laird Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	47		RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel			UNSPECIFIED		R-XXMA-N47	4	2.14 mm		15.5 mm					245	21 mm
ADN2830ACP32	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1					5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		TIN LEAD	QUAD		S-XQCC-N32	3	1 mm		5 mm	Not Qualified		e0		240	5 mm
ADV7480WBBCZ-RL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	100	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1		CMOS	AEC-Q100		1.8 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel		TIN SILVER COPPER	BOTTOM		S-PBGA-B100	3	1.4 mm		9 mm			e1			9 mm
BGM121N256V2	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56		SQUARE	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel			UNSPECIFIED		S-XXMA-N56	3	1.4 mm		6.5 mm				40	260	6.5 mm
CC1125RHMT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N32	3	.9 mm		5 mm	Not Qualified		e4	30	260	5 mm
CC2430ZF128RTCRG3	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS			3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N48	3	.9 mm		7 mm	Not Qualified		e4	30	260	7 mm
ENW89823A3KF	Panasonic	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	XMA	RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel			UNSPECIFIED	2.178 Mbps	R-XXMA-N24		2 mm		9 mm				40	250	9.5 mm
KSZ8695PI	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	BALL	289	BGA	SQUARE	PLASTIC/EPOXY	YES	1					1.8 V		GRID ARRAY	BGA289,17X17,40		1 mm	85 Cel	-40 Cel			BOTTOM	100 Mbps	S-PBGA-B289		2.36 mm		19 mm						19 mm
LTC5800IWR-IPRA#PBF	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	72	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		CMOS			3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		SILVER	QUAD		S-PQCC-N72		1 mm		10 mm			e4			10 mm
MGM111A256V2R	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	31	XMA	RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY			1.2 mm	85 Cel	-40 Cel			UNSPECIFIED	.25 Mbps	R-XXMA-N31		2.1 mm		12.9 mm						15 mm
MRF24J40-I/ML	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		MATTE TIN	QUAD		S-PQCC-N40	1	1 mm		6 mm	Not Qualified		e3		260	6 mm
MRF24J40MB-I/RM	Microchip Technology		INDUSTRIAL		12			PLASTIC/EPOXY								2.5/3.3		MODULE,12LEAD,.9	Other Telecom ICs		85 Cel	-40 Cel										Not Qualified
MRF24WG0MA-I/RM110	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36		RECTANGULAR	UNSPECIFIED	NO	1			TS 16949		3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel			DUAL		R-XDMA-N36		2.7 mm		21 mm						31 mm
RN42SM-I/RM	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32		RECTANGULAR	UNSPECIFIED	YES	1			TS 16949		3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		GOLD OVER NICKEL	UNSPECIFIED		R-XXMA-N32		2.4 mm		13.4 mm			e4			25.8 mm
RS9113-NB0-D1C	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	79	XMA	RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel			UNSPECIFIED	54 Mbps	R-XXMA-N79		3.3 mm		16 mm		ALSO HAS BLUETOOTH DATA RATE= 1,2,3 Mbps and ZIGBEE DATA RATE= 250 kbps				27 mm
SA606DK,118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel			DUAL		R-PDSO-G20		1.5 mm		4.4 mm	Not Qualified					6.5 mm
SA639DH/01	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G24	1	1.1 mm		4.4 mm			e4	30	260	7.8 mm
SI4455-C2A-GMR	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel			QUAD		S-XQCC-N20		.9 mm		3 mm						3 mm
ADMP510ACEZ-RL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BUTT	3	TLGA	RECTANGULAR	UNSPECIFIED	YES	1					1.8 V		GRID ARRAY, THIN PROFILE			1.22 mm	85 Cel	-40 Cel			BOTTOM		R-XBGA-B3		1.08 mm		2.5 mm				NOT SPECIFIED	NOT SPECIFIED	3.35 mm
BLE112-E-V1	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	31		RECTANGULAR	UNSPECIFIED	YES	1							MICROELECTRONIC ASSEMBLY			1.25 mm	85 Cel	-40 Cel			UNSPECIFIED		R-XXMA-N31		2.3 mm		12.05 mm						18.1 mm
CC2430ZF128RTCG3	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS			3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N48	3	.9 mm		7 mm	Not Qualified		e4	30	260	7 mm
HMC1023LP5ETR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	85 Cel	-40 Cel		MATTE TIN	QUAD		S-PQCC-N32	1	1 mm		5 mm			e3	30	260	5 mm
J-F2-B3E9-DY	Telit Communications Plc	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	QCCN	SQUARE	UNSPECIFIED	YES	1					1.8 V		CHIP CARRIER				85 Cel	-40 Cel			QUAD		S-XQCC-N32		2.6 mm		11 mm				NOT SPECIFIED	NOT SPECIFIED	11 mm
LTC5587IDD#PBF	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	12	HVSON	SQUARE	PLASTIC/EPOXY	YES	1		CMOS			3.3 V		SMALL OUTLINE			.45 mm	85 Cel	-40 Cel		Matte Tin (Sn) - annealed	DUAL		S-PDSO-N12	1	.8 mm		3 mm	Not Qualified		e3	30	260	3 mm
LTC5800IWR-WHMA#PBF	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	72	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		CMOS			3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel			QUAD		S-PQCC-N72	1	1 mm		10 mm				30	260	10 mm
SA639DH,512	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BIPOLAR		.01 mA	3 V	3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel			DUAL		R-PDSO-G24		1.1 mm		4.4 mm	Not Qualified			40	260	7.8 mm
SA639DH,518	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel			DUAL		R-PDSO-G24		1.1 mm		4.4 mm	Not Qualified					7.8 mm
SIM5300EA	Simcom Wireless Solutions	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	68	QMA	SQUARE	UNSPECIFIED	YES	1							MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel			QUAD	7.2 Mbps	S-XQMA-N68						Operates with 3.4V TO 4.4V supply
XB3-24Z8RS	Digi International	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	37		RECTANGULAR	UNSPECIFIED	YES	1							MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel			UNSPECIFIED		R-XXMA-N37
AD73322AR-REEL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS			3 V	3/5	SMALL OUTLINE	SOP28,.4	Codecs	1.27 mm	85 Cel	-40 Cel	1.2 dB	TIN LEAD	DUAL		R-PDSO-G28	3	2.65 mm	16-BIT	7.5 mm	Not Qualified		e0		240	17.9 mm	YES
AD8314ARMZ-REEL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		MATTE TIN	DUAL		S-PDSO-G8	1	1.1 mm		3 mm	Not Qualified		e3	30	260	3 mm
AD9866BCPZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS			3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	Modems	.5 mm	85 Cel	-40 Cel		MATTE TIN	QUAD		S-XQCC-N64	3	1 mm		9 mm	Not Qualified		e3		260	9 mm
ATA5746-PXQW	Atmel	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	105 Cel	-40 Cel			QUAD		S-XQCC-N24		1 mm		5 mm	Not Qualified					5 mm
BM70BLE01FC2-0B05BA	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	30	XMA	RECTANGULAR	UNSPECIFIED	YES	1			TS 16949		3 V		MICROELECTRONIC ASSEMBLY	MODULE,30LEAD(UNSPEC)		1.1 mm	85 Cel	-40 Cel		Nickel/Gold (Ni/Au)	UNSPECIFIED	.0086 Mbps	R-XXMA-N30		1.66 mm		12 mm			e4			15 mm
MLX90109EDC	Melexis N V		INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES					2 mA		3.3/5	SMALL OUTLINE	SOP8,.25	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel		Matte Tin (Sn)	DUAL		R-PDSO-G8					Not Qualified		e3
RC1180-MBUS3	Radiocrafts As	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	30		RECTANGULAR	UNSPECIFIED	YES	1					3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel			QUAD		R-XQMA-N30		3.3 mm		12.7 mm						25.4 mm
SA639DH	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BIPOLAR		.01 mA	3 V	3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel			DUAL		R-PDSO-G24		1.1 mm		4.4 mm	Not Qualified			40	260	7.8 mm
SKY13473-569LF	Skyworks Solutions	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1					2.85 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	90 Cel	-40 Cel			QUAD		S-XQCC-N20		.8 mm		2.4 mm				NOT SPECIFIED	NOT SPECIFIED	2.4 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.