OTHER Other Function Telecom Interface ICs 989

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

BGS18GA14E6327XTSA1

Infineon Technologies

TELECOM CIRCUIT

OTHER

BUTT

14

SQUARE

UNSPECIFIED

YES

1

3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-30 Cel

QUAD

S-XQMA-B14

1

.65 mm

2 mm

2 mm

PN5120A0HN/C2,551

NXP Semiconductors

OTHER

NO LEAD

40

QCCN

SQUARE

PLASTIC/EPOXY

YES

1.8/3.3,2.5/3.3

CHIP CARRIER

LCC40,.24SQ,20

Other Telecom ICs

.5 mm

85 Cel

-30 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N40

3

Not Qualified

e4

30

260

RI-TRP-DR2B-40

Texas Instruments

TELECOM CIRCUIT

OTHER

UNSPECIFIED

UNSPECIFIED

UNSPECIFIED

1

85 Cel

-25 Cel

LNBH26LPQR

STMicroelectronics

TELECOM CIRCUIT

OTHER

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

1

12 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

0 Cel

QUAD

S-XQCC-N24

1 mm

4 mm

NOT SPECIFIED

NOT SPECIFIED

4 mm

SARA-G450-00C-00

U-blox Ag

TELECOM CIRCUIT

OTHER

NO LEAD

96

RECTANGULAR

UNSPECIFIED

YES

1

3.8 V

MICROELECTRONIC ASSEMBLY

70 Cel

-20 Cel

UNSPECIFIED

R-XXMA-N96

2.65 mm

16 mm

26 mm

SST12LF02-QXCE

Microchip Technology

TELECOM CIRCUIT

OTHER

NO LEAD

16

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-20 Cel

MATTE TIN

QUAD

S-XQCC-N16

.5 mm

3 mm

e3

3 mm

WYSBHVGXG

Taiyo Yuden

TELECOM CIRCUIT

OTHER

NO LEAD

70

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-30 Cel

UNSPECIFIED

R-XXMA-N70

1.9 mm

8.9 mm

NOT SPECIFIED

NOT SPECIFIED

12.6 mm

ADV7533BCBZ-RL

Analog Devices

TELECOM CIRCUIT

OTHER

BALL

49

VFBGA

SQUARE

UNSPECIFIED

YES

1

CMOS

1.8 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-10 Cel

TIN SILVER COPPER

BOTTOM

S-XBGA-B49

1

.66 mm

3.46 mm

Not Qualified

e1

30

260

3.46 mm

ATA8403C-6AQY66

Microchip Technology

TELECOM CIRCUIT

OTHER

GULL WING

8

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

11 mA

3 V

3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP8,.19

Other Telecom ICs

.635 mm

85 Cel

-55 Cel

MATTE TIN

DUAL

R-PDSO-G8

Not Qualified

e3

ATA8403C-6AQY-66

Microchip Technology

TELECOM CIRCUIT

OTHER

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP8,.19

.65 mm

85 Cel

-55 Cel

Matte Tin (Sn)

DUAL

S-PDSO-G8

1.05 mm

3 mm

e3

NOT SPECIFIED

NOT SPECIFIED

3 mm

PN5120A0HN/C2,557

NXP Semiconductors

OTHER

NO LEAD

40

QCCN

SQUARE

PLASTIC/EPOXY

YES

1.8/3.3,2.5/3.3

CHIP CARRIER

LCC40,.24SQ,20

Other Telecom ICs

.5 mm

85 Cel

-30 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N40

3

Not Qualified

e4

30

260

TDA7100HTMA1

Infineon Technologies

TELECOM CIRCUIT

OTHER

GULL WING

10

TSSOP

SQUARE

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.5 mm

70 Cel

-20 Cel

MATTE TIN

DUAL

S-PDSO-G10

1

1.1 mm

3 mm

Not Qualified

e3

3 mm

PCM3060PWRG4

Texas Instruments

TELECOM CIRCUIT

OTHER

GULL WING

28

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

2

CMOS

3.3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

-25 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

DUAL

R-PDSO-G28

2

1.2 mm

4.4 mm

Not Qualified

e4

NOT SPECIFIED

260

9.7 mm

SE2604L-R

Skyworks Solutions

TELECOM CIRCUIT

OTHER

NO LEAD

16

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

0 Cel

QUAD

S-XQCC-N16

.9 mm

3 mm

NOT SPECIFIED

NOT SPECIFIED

3 mm

AD9670BBCZ

Analog Devices

TELECOM CIRCUIT

OTHER

BALL

144

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

1.4 V

GRID ARRAY, LOW PROFILE, FINE PITCH

.8 mm

85 Cel

0 Cel

BOTTOM

S-PBGA-B144

3

1.4 mm

10 mm

30

260

10 mm

BGSA12GN10E6327XTSA1

Infineon Technologies

TELECOM CIRCUIT

OTHER

BUTT

10

BCC

RECTANGULAR

UNSPECIFIED

YES

1

2.85 V

CHIP CARRIER

.4 mm

85 Cel

-30 Cel

BOTTOM

R-XBCC-B10

1

.4 mm

1.1 mm

1.5 mm

CYW20706UA2KFFB4G

Infineon Technologies

TELECOM CIRCUIT

OTHER

BALL

49

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

1.2 V

GRID ARRAY, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-30 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B49

3

1.05 mm

4 mm

e1

4.5 mm

MAX2851ITK+T

Analog Devices

TELECOM CIRCUIT

OTHER

NO LEAD

68

HVQCCN

SQUARE

UNSPECIFIED

YES

1

BICMOS

2.85 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-25 Cel

Matte Tin (Sn) - annealed

QUAD

S-XQCC-N68

3

.8 mm

10 mm

e3

30

260

10 mm

AD6624AABCZ

Analog Devices

TELECOM CIRCUIT

OTHER

BALL

196

LBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

2.5 V

2.5,3.3

GRID ARRAY, LOW PROFILE

BGA196,14X14,40

Other Telecom ICs

1 mm

70 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B196

3

1.5 mm

15 mm

Not Qualified

e1

260

15 mm

MFRC63002HN,118

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-25 Cel

QUAD

S-PQCC-N32

1

1 mm

5 mm

30

260

5 mm

MAX2851ITK+

Analog Devices

TELECOM CIRCUIT

OTHER

NO LEAD

68

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

2.85 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-25 Cel

Matte Tin (Sn) - annealed

QUAD

S-PQCC-N68

3

.8 mm

10 mm

Not Qualified

e3

30

260

10 mm

MFRC63002HN

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-25 Cel

QUAD

S-PQCC-N32

1

1 mm

5 mm

5 mm

MFRC63002HN,157

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-25 Cel

QUAD

S-PQCC-N32

1

1 mm

5 mm

30

260

5 mm

XCC2564MODNCMOET

Texas Instruments

TELECOM CIRCUIT

OTHER

BUTT

33

BCC

SQUARE

UNSPECIFIED

YES

1

3.6 V

CHIP CARRIER

70 Cel

-20 Cel

BOTTOM

S-XBCC-B33

1.4 mm

7 mm

7 mm

PN5120A0HN/C2,518

NXP Semiconductors

OTHER

NO LEAD

40

QCCN

SQUARE

PLASTIC/EPOXY

YES

1.8/3.3,2.5/3.3

CHIP CARRIER

LCC40,.24SQ,20

Other Telecom ICs

.5 mm

85 Cel

-30 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N40

3

Not Qualified

e4

30

260

BT111-A-HCI

Silicon Labs

TELECOM CIRCUIT

OTHER

NO LEAD

21

RECTANGULAR

UNSPECIFIED

YES

1

MICROELECTRONIC ASSEMBLY

1.1 mm

85 Cel

-30 Cel

UNSPECIFIED

R-XXMA-N21

2.31 mm

9.3 mm

13.05 mm

PN5120A0ET/C2QL

NXP Semiconductors

OTHER

BALL

64

FBGA

SQUARE

PLASTIC/EPOXY

YES

100 mA

3/3.3

GRID ARRAY, FINE PITCH

BGA64,8X8,25

Other Telecom ICs

.635 mm

85 Cel

-30 Cel

BOTTOM

S-PBGA-B64

1

Not Qualified

260

RI-I03-114A-S1

Texas Instruments

TELECOM CIRCUIT

OTHER

1

70 Cel

-25 Cel

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

RI-I11-114B-S1

Texas Instruments

TELECOM CIRCUIT

OTHER

1

70 Cel

-25 Cel

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

RI-I03-114A-01

Texas Instruments

TELECOM CIRCUIT

OTHER

1

70 Cel

-25 Cel

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

RI-TRP-DR2B

Texas Instruments

TELECOM CIRCUIT

OTHER

1

85 Cel

-25 Cel

1

Not Qualified

RI-TRP-R9UR

Texas Instruments

TELECOM CIRCUIT

OTHER

1

85 Cel

-25 Cel

XWL1831MODGAMOCT

Texas Instruments

TELECOM CIRCUIT

OTHER

NO LEAD

100

LGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

GRID ARRAY

.7 mm

70 Cel

-20 Cel

BOTTOM

R-PBGA-N100

2 mm

13.3 mm

13.4 mm

BGS16GA14E6327XTSA1

Infineon Technologies

TELECOM CIRCUIT

OTHER

NO LEAD

14

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.4 mm

85 Cel

-30 Cel

BOTTOM

S-PBCC-N14

1

.65 mm

2 mm

2 mm

BGSA11GN10E6327XTSA1

Infineon Technologies

TELECOM CIRCUIT

OTHER

BUTT

10

BCC

RECTANGULAR

UNSPECIFIED

YES

1

2.85 V

CHIP CARRIER

.4 mm

85 Cel

-30 Cel

BOTTOM

R-XBCC-B10

1

.4 mm

1.1 mm

1.5 mm

RI-I02-112A-03

Texas Instruments

TELECOM CIRCUIT

OTHER

UNSPECIFIED

UNSPECIFIED

1

70 Cel

-25 Cel

NOT SPECIFIED

NOT SPECIFIED

RI-I02-112B-03

Texas Instruments

TELECOM CIRCUIT

OTHER

UNSPECIFIED

UNSPECIFIED

1

70 Cel

-25 Cel

NOT SPECIFIED

NOT SPECIFIED

RI-I11-112B-03

Texas Instruments

TELECOM CIRCUIT

OTHER

1

70 Cel

-25 Cel

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

RI-I17-114A-01

Texas Instruments

TELECOM CIRCUIT

OTHER

1

70 Cel

-25 Cel

NOT SPECIFIED

NOT SPECIFIED

BGSA13GN10E6327XTSA1

Infineon Technologies

TELECOM CIRCUIT

OTHER

NO LEAD

10

VQCCN

RECTANGULAR

UNSPECIFIED

YES

1

2.85 V

CHIP CARRIER, VERY THIN PROFILE

.4 mm

85 Cel

-30 Cel

BOTTOM

R-XBCC-N10

1

.4 mm

1.1 mm

1.5 mm

OL2381AHN/C0B,515

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

.0012 mA

2.7 V

2.7

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

Other Telecom ICs

.5 mm

85 Cel

-25 Cel

QUAD

S-PQCC-N32

2A

.85 mm

5 mm

Not Qualified

260

5 mm

BGS14GA14E6327XTSA1

Infineon Technologies

TELECOM CIRCUIT

OTHER

BUTT

14

SQUARE

UNSPECIFIED

YES

1

3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-30 Cel

GOLD NICKEL

QUAD

S-XQMA-B14

1

.65 mm

2 mm

e4

2 mm

LA72910V-TLM-H

Onsemi

OTHER

GULL WING

16

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5 V

5

SMALL OUTLINE, SHRINK PITCH

SSOP16,.25

Other Telecom ICs

.635 mm

70 Cel

-30 Cel

TIN BISMUTH

DUAL

R-PDSO-G16

3

Not Qualified

e6

30

260

AD630BD/+

Analog Devices

OTHER

THROUGH-HOLE

20

DIP

RECTANGULAR

CERAMIC

NO

BIPOLAR

-15 V

5 mA

15 V

+-15

IN-LINE

DIP20,.3

Other Telecom ICs

2.54 mm

85 Cel

-25 Cel

Tin/Lead (Sn/Pb)

DUAL

R-XDIP-T20

e0

BGS15AN16E6327XTSA1

Infineon Technologies

TELECOM CIRCUIT

OTHER

NO LEAD

16

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3.5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-30 Cel

TIN

QUAD

S-PQCC-N16

1

.77 mm

2.3 mm

e3

2.3 mm

IA3223-C-FUR

Silicon Labs

TELECOM CIRCUIT

OTHER

GULL WING

16

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.3 V

SMALL OUTLINE, SHRINK PITCH

.635 mm

85 Cel

-25 Cel

DUAL

R-PDSO-G16

1.7272 mm

3.8989 mm

NOT SPECIFIED

NOT SPECIFIED

4.8895 mm

LM3290TME/NOPB

Texas Instruments

TELECOM CIRCUIT

OTHER

BALL

30

VFBGA

RECTANGULAR

UNSPECIFIED

YES

1

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-30 Cel

TIN SILVER COPPER

BOTTOM

R-XBGA-B30

1

.675 mm

e1

30

260

LNBH26SPQR

STMicroelectronics

TELECOM CIRCUIT

OTHER

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

1

12 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

0 Cel

QUAD

S-XQCC-N24

1

1 mm

4 mm

4 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.