Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Applications | Surface Mount | No. of Functions | Output Code | No. of Channels | Technology | Screening Level | Nominal Negative Supply Voltage | No. of Transceivers | Maximum Supply Current | Nominal Supply Voltage | Hybrid | Input Code | Power Supplies (V) | ISDN Access Rate | Package Style (Meter) | Package Equivalence Code | Sub-Category | Carrier Type-3 | Terminal Pitch | Maximum Operating Temperature | Resolution (um) | Battery Supply (V) | Minimum Output High Voltage | Maximum Output Low Voltage | Standard | Minimum Operating Temperature | Maximum Gain Tolerance | Terminal Finish | Maximum Output Voltage | Terminal Position | Data Rate | JESD-30 Code | Reference Point | Output (V) | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Linear Coding | Carrier Type-2 | Carrier Type-1 | Width | Qualification | Maximum Output Low Current | Companding Law | Input Type | Additional Features | Battery Feed | Maximum Analog Input | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Filter |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Infineon Technologies |
TELECOM CIRCUIT |
OTHER |
BUTT |
14 |
SQUARE |
UNSPECIFIED |
YES |
1 |
3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-30 Cel |
QUAD |
S-XQMA-B14 |
1 |
.65 mm |
2 mm |
2 mm |
||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
OTHER |
NO LEAD |
40 |
QCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1.8/3.3,2.5/3.3 |
CHIP CARRIER |
LCC40,.24SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-30 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N40 |
3 |
Not Qualified |
e4 |
30 |
260 |
||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
OTHER |
UNSPECIFIED |
UNSPECIFIED |
UNSPECIFIED |
1 |
85 Cel |
-25 Cel |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
TELECOM CIRCUIT |
OTHER |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
12 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
0 Cel |
QUAD |
S-XQCC-N24 |
1 mm |
4 mm |
NOT SPECIFIED |
NOT SPECIFIED |
4 mm |
|||||||||||||||||||||||||||||||||||||||||
U-blox Ag |
TELECOM CIRCUIT |
OTHER |
NO LEAD |
96 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.8 V |
MICROELECTRONIC ASSEMBLY |
70 Cel |
-20 Cel |
UNSPECIFIED |
R-XXMA-N96 |
2.65 mm |
16 mm |
26 mm |
||||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
TELECOM CIRCUIT |
OTHER |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-20 Cel |
MATTE TIN |
QUAD |
S-XQCC-N16 |
.5 mm |
3 mm |
e3 |
3 mm |
|||||||||||||||||||||||||||||||||||||||||
|
Taiyo Yuden |
TELECOM CIRCUIT |
OTHER |
NO LEAD |
70 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-30 Cel |
UNSPECIFIED |
R-XXMA-N70 |
1.9 mm |
8.9 mm |
NOT SPECIFIED |
NOT SPECIFIED |
12.6 mm |
|||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
OTHER |
BALL |
49 |
VFBGA |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
1.8 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-10 Cel |
TIN SILVER COPPER |
BOTTOM |
S-XBGA-B49 |
1 |
.66 mm |
3.46 mm |
Not Qualified |
e1 |
30 |
260 |
3.46 mm |
||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
TELECOM CIRCUIT |
OTHER |
GULL WING |
8 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
11 mA |
3 V |
3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Other Telecom ICs |
.635 mm |
85 Cel |
-55 Cel |
MATTE TIN |
DUAL |
R-PDSO-G8 |
Not Qualified |
e3 |
||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
TELECOM CIRCUIT |
OTHER |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
.65 mm |
85 Cel |
-55 Cel |
Matte Tin (Sn) |
DUAL |
S-PDSO-G8 |
1.05 mm |
3 mm |
e3 |
NOT SPECIFIED |
NOT SPECIFIED |
3 mm |
||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
OTHER |
NO LEAD |
40 |
QCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1.8/3.3,2.5/3.3 |
CHIP CARRIER |
LCC40,.24SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-30 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N40 |
3 |
Not Qualified |
e4 |
30 |
260 |
||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
TELECOM CIRCUIT |
OTHER |
GULL WING |
10 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.5 mm |
70 Cel |
-20 Cel |
MATTE TIN |
DUAL |
S-PDSO-G10 |
1 |
1.1 mm |
3 mm |
Not Qualified |
e3 |
3 mm |
|||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
OTHER |
GULL WING |
28 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
2 |
CMOS |
3.3 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
-25 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
R-PDSO-G28 |
2 |
1.2 mm |
4.4 mm |
Not Qualified |
e4 |
NOT SPECIFIED |
260 |
9.7 mm |
|||||||||||||||||||||||||||||||||||
|
Skyworks Solutions |
TELECOM CIRCUIT |
OTHER |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
0 Cel |
QUAD |
S-XQCC-N16 |
.9 mm |
3 mm |
NOT SPECIFIED |
NOT SPECIFIED |
3 mm |
|||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
OTHER |
BALL |
144 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1.4 V |
GRID ARRAY, LOW PROFILE, FINE PITCH |
.8 mm |
85 Cel |
0 Cel |
BOTTOM |
S-PBGA-B144 |
3 |
1.4 mm |
10 mm |
30 |
260 |
10 mm |
||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
TELECOM CIRCUIT |
OTHER |
BUTT |
10 |
BCC |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
2.85 V |
CHIP CARRIER |
.4 mm |
85 Cel |
-30 Cel |
BOTTOM |
R-XBCC-B10 |
1 |
.4 mm |
1.1 mm |
1.5 mm |
||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
TELECOM CIRCUIT |
OTHER |
BALL |
49 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1.2 V |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-30 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B49 |
3 |
1.05 mm |
4 mm |
e1 |
4.5 mm |
|||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
OTHER |
NO LEAD |
68 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
BICMOS |
2.85 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-25 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-XQCC-N68 |
3 |
.8 mm |
10 mm |
e3 |
30 |
260 |
10 mm |
|||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
OTHER |
BALL |
196 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
2.5 V |
2.5,3.3 |
GRID ARRAY, LOW PROFILE |
BGA196,14X14,40 |
Other Telecom ICs |
1 mm |
70 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B196 |
3 |
1.5 mm |
15 mm |
Not Qualified |
e1 |
260 |
15 mm |
||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
TELECOM CIRCUIT |
OTHER |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-25 Cel |
QUAD |
S-PQCC-N32 |
1 |
1 mm |
5 mm |
30 |
260 |
5 mm |
||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
OTHER |
NO LEAD |
68 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
2.85 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-25 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-PQCC-N68 |
3 |
.8 mm |
10 mm |
Not Qualified |
e3 |
30 |
260 |
10 mm |
||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
TELECOM CIRCUIT |
OTHER |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-25 Cel |
QUAD |
S-PQCC-N32 |
1 |
1 mm |
5 mm |
5 mm |
||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
TELECOM CIRCUIT |
OTHER |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-25 Cel |
QUAD |
S-PQCC-N32 |
1 |
1 mm |
5 mm |
30 |
260 |
5 mm |
||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
TELECOM CIRCUIT |
OTHER |
BUTT |
33 |
BCC |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.6 V |
CHIP CARRIER |
70 Cel |
-20 Cel |
BOTTOM |
S-XBCC-B33 |
1.4 mm |
7 mm |
7 mm |
|||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
OTHER |
NO LEAD |
40 |
QCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1.8/3.3,2.5/3.3 |
CHIP CARRIER |
LCC40,.24SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-30 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N40 |
3 |
Not Qualified |
e4 |
30 |
260 |
||||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
TELECOM CIRCUIT |
OTHER |
NO LEAD |
21 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
MICROELECTRONIC ASSEMBLY |
1.1 mm |
85 Cel |
-30 Cel |
UNSPECIFIED |
R-XXMA-N21 |
2.31 mm |
9.3 mm |
13.05 mm |
|||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
OTHER |
BALL |
64 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
100 mA |
3/3.3 |
GRID ARRAY, FINE PITCH |
BGA64,8X8,25 |
Other Telecom ICs |
.635 mm |
85 Cel |
-30 Cel |
BOTTOM |
S-PBGA-B64 |
1 |
Not Qualified |
260 |
||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
OTHER |
1 |
70 Cel |
-25 Cel |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
OTHER |
1 |
70 Cel |
-25 Cel |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
OTHER |
1 |
70 Cel |
-25 Cel |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
TELECOM CIRCUIT |
OTHER |
1 |
85 Cel |
-25 Cel |
1 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
TELECOM CIRCUIT |
OTHER |
1 |
85 Cel |
-25 Cel |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
TELECOM CIRCUIT |
OTHER |
NO LEAD |
100 |
LGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
GRID ARRAY |
.7 mm |
70 Cel |
-20 Cel |
BOTTOM |
R-PBGA-N100 |
2 mm |
13.3 mm |
13.4 mm |
|||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
TELECOM CIRCUIT |
OTHER |
NO LEAD |
14 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.4 mm |
85 Cel |
-30 Cel |
BOTTOM |
S-PBCC-N14 |
1 |
.65 mm |
2 mm |
2 mm |
||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
TELECOM CIRCUIT |
OTHER |
BUTT |
10 |
BCC |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
2.85 V |
CHIP CARRIER |
.4 mm |
85 Cel |
-30 Cel |
BOTTOM |
R-XBCC-B10 |
1 |
.4 mm |
1.1 mm |
1.5 mm |
||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
OTHER |
UNSPECIFIED |
UNSPECIFIED |
1 |
70 Cel |
-25 Cel |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
OTHER |
UNSPECIFIED |
UNSPECIFIED |
1 |
70 Cel |
-25 Cel |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
OTHER |
1 |
70 Cel |
-25 Cel |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
OTHER |
1 |
70 Cel |
-25 Cel |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
TELECOM CIRCUIT |
OTHER |
NO LEAD |
10 |
VQCCN |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
2.85 V |
CHIP CARRIER, VERY THIN PROFILE |
.4 mm |
85 Cel |
-30 Cel |
BOTTOM |
R-XBCC-N10 |
1 |
.4 mm |
1.1 mm |
1.5 mm |
||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
TELECOM CIRCUIT |
OTHER |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
.0012 mA |
2.7 V |
2.7 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-25 Cel |
QUAD |
S-PQCC-N32 |
2A |
.85 mm |
5 mm |
Not Qualified |
260 |
5 mm |
||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
TELECOM CIRCUIT |
OTHER |
BUTT |
14 |
SQUARE |
UNSPECIFIED |
YES |
1 |
3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-30 Cel |
GOLD NICKEL |
QUAD |
S-XQMA-B14 |
1 |
.65 mm |
2 mm |
e4 |
2 mm |
||||||||||||||||||||||||||||||||||||||||||
|
Onsemi |
OTHER |
GULL WING |
16 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5 V |
5 |
SMALL OUTLINE, SHRINK PITCH |
SSOP16,.25 |
Other Telecom ICs |
.635 mm |
70 Cel |
-30 Cel |
TIN BISMUTH |
DUAL |
R-PDSO-G16 |
3 |
Not Qualified |
e6 |
30 |
260 |
|||||||||||||||||||||||||||||||||||||||
Analog Devices |
OTHER |
THROUGH-HOLE |
20 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
BIPOLAR |
-15 V |
5 mA |
15 V |
+-15 |
IN-LINE |
DIP20,.3 |
Other Telecom ICs |
2.54 mm |
85 Cel |
-25 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T20 |
e0 |
|||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
TELECOM CIRCUIT |
OTHER |
NO LEAD |
16 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-30 Cel |
TIN |
QUAD |
S-PQCC-N16 |
1 |
.77 mm |
2.3 mm |
e3 |
2.3 mm |
||||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
TELECOM CIRCUIT |
OTHER |
GULL WING |
16 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
SMALL OUTLINE, SHRINK PITCH |
.635 mm |
85 Cel |
-25 Cel |
DUAL |
R-PDSO-G16 |
1.7272 mm |
3.8989 mm |
NOT SPECIFIED |
NOT SPECIFIED |
4.8895 mm |
|||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
OTHER |
BALL |
30 |
VFBGA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
85 Cel |
-30 Cel |
TIN SILVER COPPER |
BOTTOM |
R-XBGA-B30 |
1 |
.675 mm |
e1 |
30 |
260 |
|||||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
TELECOM CIRCUIT |
OTHER |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
12 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
0 Cel |
QUAD |
S-XQCC-N24 |
1 |
1 mm |
4 mm |
4 mm |
Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.
Some common types of Other Function Telecom Interface ICs include:
1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.
2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.
3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.
4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.