OTHER Other Function Telecom Interface ICs 989

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
MC100SX1230FN	Onsemi	TELECOM CIRCUIT	OTHER	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR			5 V	-4.2/-5.46	CHIP CARRIER	LDCC28,.5SQ	Network Interfaces	1.27 mm	85 Cel	0 Cel	TIN LEAD	QUAD		S-PQCC-J28		4.57 mm	11.505 mm	Not Qualified		e0		235	11.505 mm
RF37S114HTFJB	Texas Instruments	TELECOM CIRCUIT	OTHER	UNSPECIFIED			SQUARE	UNSPECIFIED	YES	1						MICROELECTRONIC ASSEMBLY				70 Cel	-25 Cel		UNSPECIFIED		S-XXMA-X	1	.76 mm	4 mm		SEATED HT-CALCULATED			260	4 mm
SN761633RTAR	Texas Instruments	TELECOM CIRCUIT	OTHER	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-20 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N40	2	.8 mm	6 mm	Not Qualified		e4	30	260	6 mm
BGS15GA14E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	BUTT	14		SQUARE	UNSPECIFIED	YES	1				3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-30 Cel	GOLD NICKEL	QUAD		S-XQMA-B14	1	.65 mm	2 mm			e4			2 mm
CYW43438KUBGT	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	63	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	70 Cel	-30 Cel		BOTTOM		R-PBGA-B63	1	.55 mm	2.87 mm						4.87 mm
PN5120A0HN1/C1	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V	1.8/3.3,2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-30 Cel	TIN/NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N32		1 mm	5 mm	Not Qualified		e3/e4			5 mm
BGA751N7E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	6	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR			2.8 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel	TIN	DUAL		R-PDSO-N6	1	.4 mm	1.3 mm			e3			2 mm
CLRC63201T/0FE	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	32	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE			1.27 mm	85 Cel	-25 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G32	1	2.65 mm	7.5 mm	Not Qualified		e4	30	250	20.5 mm
CYW43364KUBGT	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	74	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	70 Cel	-30 Cel	TIN SILVER COPPER	BOTTOM		R-PBGA-B74	1	.55 mm	2.87 mm			e1			4.87 mm
IPJ-P6005-X2BT	Impinj	TELECOM CIRCUIT	OTHER	NO LEAD	8	VQCCN	SQUARE	UNSPECIFIED	YES	1				1.6 V		CHIP CARRIER, VERY THIN PROFILE	LCC8,0.079,25		.9 mm	95 Cel	-25 Cel		QUAD	.4 Mbps	S-XQCC-N8	1	.35 mm	2 mm				30	260	2 mm
LA72912V-MPB-H	Onsemi		OTHER	GULL WING	24	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES		BIPOLAR		.032 mA	5 V	5	SMALL OUTLINE, SHRINK PITCH	SSOP24,.3	Other Telecom ICs	.635 mm	70 Cel	-30 Cel	TIN BISMUTH	DUAL		R-PDSO-G24	3			Not Qualified		e6	30	260
MFRC53101T/0FE	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	32	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE			1.27 mm	85 Cel	-25 Cel		DUAL		R-PDSO-G32		2.65 mm	7.5 mm	Not Qualified					20.5 mm
SI4735-B20-GMR	Silicon Labs	TELECOM CIRCUIT	OTHER	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-20 Cel		QUAD		S-XQCC-N20		.6 mm	3 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	3 mm
XWL1831MODGAMOCR	Texas Instruments	TELECOM CIRCUIT	OTHER	BALL	130	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.7 V		GRID ARRAY				70 Cel	-20 Cel		BOTTOM		R-PBGA-B130		2 mm	13.3 mm						13.4 mm
BGS110MN20E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	BUTT	20	BCC	SQUARE	UNSPECIFIED	YES	1				3.5 V		CHIP CARRIER			.4 mm	85 Cel	-30 Cel		BOTTOM		S-XBCC-B20	1	.77 mm	2.3 mm						2.3 mm
GS2971-IBE3	Semtech	TELECOM CIRCUIT	OTHER	BALL	100	LBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, LOW PROFILE			1 mm	85 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B100	1	1.7 mm	11 mm			e1		260	11 mm
HMC560LM3	Analog Devices	TELECOM CIRCUIT	OTHER	NO LEAD	6	HQCCN	SQUARE	PLASTIC/EPOXY	YES	1						CHIP CARRIER, HEAT SINK/SLUG			1 mm	85 Cel	-55 Cel	GOLD OVER NICKEL	QUAD		S-PQCC-N6	1	1.14 mm	5.08 mm	Not Qualified		e4		250	5.08 mm
HMC572LC5TR	Analog Devices	TELECOM CIRCUIT	OTHER	NO LEAD	32	HQCCN	SQUARE	UNSPECIFIED	YES	1				3.5 V		CHIP CARRIER, HEAT SINK/SLUG			.5 mm	85 Cel	-55 Cel		QUAD		S-XQCC-N32		1.12 mm	5 mm				NOT SPECIFIED	NOT SPECIFIED	5 mm
HTSH4801ETK,118	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	2	SON	RECTANGULAR	PLASTIC/EPOXY	YES	1						SMALL OUTLINE	LCC2(UNSPEC)	Other Telecom ICs		85 Cel	-25 Cel		DUAL		R-PDSO-N2	1			Not Qualified			30	260
PN5120A0ET/C2J	NXP Semiconductors		OTHER	BALL	64	FBGA	SQUARE	PLASTIC/EPOXY	YES				100 mA		3/3.3	GRID ARRAY, FINE PITCH	BGA64,8X8,25	Other Telecom ICs	.635 mm	85 Cel	-30 Cel		BOTTOM		S-PBGA-B64	1			Not Qualified				260
RI-I11-112A-03	Texas Instruments	TELECOM CIRCUIT	OTHER							1										70 Cel	-25 Cel								Not Qualified			NOT SPECIFIED	NOT SPECIFIED
RN4020BCN-V/RM120	Microchip Technology	TELECOM CIRCUIT	OTHER	NO LEAD	24	XMA	RECTANGULAR	UNSPECIFIED	YES	1		TS 16949		3.3 V		MICROELECTRONIC ASSEMBLY	MODULE,24LEAD(UNSPEC)		1.2 mm	85 Cel	-30 Cel	GOLD OVER NICKEL	UNSPECIFIED	1 Mbps	R-XXMA-N24		2.38 mm	11.5 mm			e4			19.5 mm
WL1801MODGBMOC	Texas Instruments	TELECOM CIRCUIT	OTHER	BALL	130	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.7 V		GRID ARRAY				70 Cel	-20 Cel		BOTTOM		R-PBGA-B130		2 mm	13.3 mm						13.4 mm
CYW20736A1KML2G	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS			1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	85 Cel	-30 Cel	PURE TIN	QUAD		S-XQCC-N32	3	1 mm	5 mm						5 mm
WIT2410M4G	Murata Manufacturing	TELECOM CIRCUIT	OTHER	UNSPECIFIED	16		RECTANGULAR	UNSPECIFIED	NO	1				5 V		MICROELECTRONIC ASSEMBLY				70 Cel	-40 Cel		UNSPECIFIED		R-XXMA-X16				Not Qualified			NOT SPECIFIED	NOT SPECIFIED
SKY16406-381LF	Skyworks Solutions	TELECOM CIRCUIT	OTHER	NO LEAD	6	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1						SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-55 Cel		DUAL		R-PDSO-N6		.8 mm	1.5 mm				NOT SPECIFIED	NOT SPECIFIED	2 mm
BA4116FV-E2	ROHM	TELECOM CIRCUIT	OTHER	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-30 Cel	TIN/TIN COPPER	DUAL		R-PDSO-G16		1.2 mm	4.4 mm	Not Qualified		e3/e2	10	260	5 mm
CYW20706UA1KFFB1G	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	49	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3.3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-30 Cel		BOTTOM		R-PBGA-B49		1 mm	4 mm						4.5 mm
CYW4343WKUBGT	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	74	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	70 Cel	-30 Cel		BOTTOM		R-PBGA-B74	1	.55 mm	2.87 mm						4.87 mm
IA3222B-F-FTR	Silicon Labs	TELECOM CIRCUIT	OTHER	GULL WING	10	VSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH			.508 mm	85 Cel	-25 Cel		DUAL		S-PDSO-G10		.9652 mm	3.048 mm				NOT SPECIFIED	NOT SPECIFIED	3.048 mm
SE2593A20-R	Skyworks Solutions	TELECOM CIRCUIT	OTHER	BUTT	30	TFLGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.625 mm	85 Cel	0 Cel		BOTTOM		R-PBGA-B30		1.1 mm	5 mm				NOT SPECIFIED	NOT SPECIFIED	6 mm
SI4737-C40-GM	Silicon Labs	TELECOM CIRCUIT	OTHER	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-20 Cel	MATTE TIN	QUAD		S-XQCC-N20	3	.6 mm	3 mm			e3	40	260	3 mm
SI4737-C40-GU	Silicon Labs	TELECOM CIRCUIT	OTHER	GULL WING	24	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3.3 V		SMALL OUTLINE, SHRINK PITCH			.635 mm	85 Cel	-20 Cel	MATTE TIN	DUAL		R-PDSO-G24	3	2 mm	3.9 mm			e3	40	260	8.65 mm
BCM20736A1KML2G	Cypress Semiconductor	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS			1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		QUAD		S-XQCC-N32		1 mm	5 mm						5 mm
BCM4330FKFFBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	144	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-30 Cel		BOTTOM		S-PBGA-B144		1 mm	6.5 mm						6.5 mm
BCM43438KUBGT	Cypress Semiconductor	TELECOM CIRCUIT	OTHER	BALL	63	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	70 Cel	-30 Cel		BOTTOM		R-PBGA-B63		.55 mm	2.87 mm						4.87 mm
BCM43455XKUBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	140	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM		R-PBGA-B140		.6 mm	4.47 mm						5.27 mm
SE2547A-R	Skyworks Solutions	TELECOM CIRCUIT	OTHER	BUTT	32	TFLGA	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	0 Cel		BOTTOM		S-PBGA-B32		1.1 mm	5 mm				NOT SPECIFIED	NOT SPECIFIED	5 mm
SI4737-C40-GMR	Silicon Labs	TELECOM CIRCUIT	OTHER	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-20 Cel	MATTE TIN	QUAD		S-XQCC-N20	3	.6 mm	3 mm			e3	40	260	3 mm
AD6652BBCZ	Analog Devices	TELECOM CIRCUIT	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			2.5 V		GRID ARRAY			1 mm	70 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B256	3		17 mm	Not Qualified		e1		260	17 mm
HMC572LC5	Analog Devices	TELECOM CIRCUIT	OTHER	NO LEAD	32	HQCCN	SQUARE	UNSPECIFIED	YES	1				3.5 V		CHIP CARRIER, HEAT SINK/SLUG			.5 mm	85 Cel	-55 Cel	GOLD OVER NICKEL	QUAD		S-XQCC-N32		1.12 mm	5 mm	Not Qualified		e4			5 mm
LXMSAPHA08-136	Murata Manufacturing	TELECOM CIRCUIT	OTHER	NO LEAD			SQUARE	UNSPECIFIED	YES	1						MICROELECTRONIC ASSEMBLY				70 Cel	-40 Cel		UNSPECIFIED		S-XXMA-N		.8 mm	8.3 mm				NOT SPECIFIED	NOT SPECIFIED	8.3 mm
XWL1835MODGAMOCT	Texas Instruments	TELECOM CIRCUIT	OTHER	NO LEAD	100	LGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.7 V		GRID ARRAY			.7 mm	70 Cel	-20 Cel		BOTTOM		R-PBGA-N100		2 mm	13.3 mm						13.4 mm
RI-STU-251B-01	Texas Instruments	TELECOM CIRCUIT	OTHER	UNSPECIFIED			RECTANGULAR	UNSPECIFIED	NO	1						SPECIAL SHAPE				70 Cel	-20 Cel		UNSPECIFIED		R-XXSS-X
RI-TRP-IR2B-30	Texas Instruments	TELECOM CIRCUIT	OTHER							1										85 Cel	-25 Cel								Not Qualified			NOT SPECIFIED	NOT SPECIFIED
LM3291TMX/NOPB	Texas Instruments	TELECOM CIRCUIT	OTHER	BALL	12	VFBGA	RECTANGULAR	UNSPECIFIED	YES	1						GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel	TIN SILVER COPPER	BOTTOM		R-XBGA-B12	1	.675 mm				e1	30	260
RF-HDT-DVBB-N2	Texas Instruments	TELECOM CIRCUIT	OTHER							1							DIE OR CHIP	Other Telecom ICs		90 Cel	-25 Cel								Not Qualified			NOT SPECIFIED	NOT SPECIFIED
RI-TRP-R9QL-30	Texas Instruments	TELECOM CIRCUIT	OTHER							1										85 Cel	-25 Cel								Not Qualified			NOT SPECIFIED	NOT SPECIFIED

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.