OTHER Other Function Telecom Interface ICs 989

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Nominal Negative Supply Voltage	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
LTC1757A-1EMS8#PBF	Analog Devices	TELECOM CIRCUIT	OTHER	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-30 Cel	Matte Tin (Sn)	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified	e3	30	260	3 mm
ADCA3990AMLZ	Analog Devices	TELECOM CIRCUIT	OTHER	THROUGH-HOLE	9		RECTANGULAR	UNSPECIFIED	NO	1						FLANGE MOUNT				100 Cel	-30 Cel		SINGLE	R-XSFM-T9						NOT SPECIFIED	NOT SPECIFIED
AD6402ARS	Analog Devices	TELECOM CIRCUIT	OTHER	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR				2.85,3.1/4.5	SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	Other Telecom ICs	.65 mm	85 Cel	-25 Cel	TIN LEAD	DUAL	R-PDSO-G28		1.73 mm	5.3 mm	Not Qualified	e0			10.21 mm
LTC1757A-2EMS#TRPBF	Analog Devices	TELECOM CIRCUIT	OTHER	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	85 Cel	-30 Cel	MATTE TIN	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified	e3	30	260	3 mm
HMC710LC5	Analog Devices	TELECOM CIRCUIT	OTHER	NO LEAD	32	HQCCN	SQUARE	UNSPECIFIED	YES	1				5 V		CHIP CARRIER, HEAT SINK/SLUG			.5 mm	85 Cel	-55 Cel	GOLD OVER NICKEL	QUAD	S-XQCC-N32		1.12 mm	5 mm	Not Qualified	e4			5 mm
AD630ACHIPS	Analog Devices		OTHER								BIPOLAR	-15 V	.005 mA	15 V	+-15		DIE OR CHIP	Other Telecom ICs		85 Cel	-25 Cel							Not Qualified
MAX3983UGK+D	Analog Devices	TELECOM CIRCUIT	OTHER	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BIPOLAR		.58 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.4SQ,20	Other Telecom ICs	.5 mm	85 Cel	0 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N68	3	.9 mm	10 mm	Not Qualified	e3	30	260	10 mm
MAX3983UGK	Analog Devices	TELECOM CIRCUIT	OTHER	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BIPOLAR		.58 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.4SQ,20	Other Telecom ICs	.5 mm	85 Cel	0 Cel	TIN LEAD	QUAD	S-XQCC-N68		.9 mm	10 mm	Not Qualified	e0			10 mm
MAX3983UGK+	Analog Devices	TELECOM CIRCUIT	OTHER	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BIPOLAR		.58 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.4SQ,20	Other Telecom ICs	.5 mm	85 Cel	0 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N68	3	.9 mm	10 mm	Not Qualified	e3	30	260	10 mm
MAX3276UGE	Analog Devices	TELECOM CIRCUIT	OTHER	NO LEAD	16	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR		.099 mA	3.3 V	3.3	CHIP CARRIER, VERY THIN PROFILE	LCC16,.16SQ,25	ATM/SONET/SDH ICs	.65 mm	85 Cel	0 Cel	TIN LEAD	QUAD	S-PQCC-N16		1 mm	4 mm	Not Qualified	e0			4 mm
MAX3983UGK+TD	Analog Devices	TELECOM CIRCUIT	OTHER	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BIPOLAR		.58 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.4SQ,20	Other Telecom ICs	.5 mm	85 Cel	0 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N68	3	.9 mm	10 mm	Not Qualified	e3	30	260	10 mm
MAX3983UGK-T	Analog Devices	TELECOM CIRCUIT	OTHER	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BIPOLAR			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	0 Cel	TIN LEAD	QUAD	S-XQCC-N68		.9 mm	10 mm	Not Qualified	e0			10 mm
V62/12649-01XE	Analog Devices		OTHER	NO LEAD	24	QCCN	SQUARE	PLASTIC/EPOXY	YES		BIPOLAR			5 V	5	CHIP CARRIER	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	105 Cel	-55 Cel		QUAD	S-PQCC-N24
ADSP-21BT101JST	Analog Devices	TELECOM CIRCUIT	OTHER	GULL WING	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	0 Cel	TIN LEAD	QUAD	R-PQFP-G128		1.6 mm	14 mm	Not Qualified	e0			20 mm
LTC1757-1EMS8	Analog Devices	TELECOM CIRCUIT	OTHER	GULL WING	8	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS				3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19	Other Telecom ICs	.635 mm	85 Cel	-30 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G8				Not Qualified	e0
AD6624AS	Analog Devices	TELECOM CIRCUIT	OTHER	GULL WING	128	FQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			2.5 V	2.5,3.3	FLATPACK, FINE PITCH	QFP128,.67X.93,20	Other Telecom ICs	.5 mm	70 Cel	-40 Cel		QUAD	R-PQFP-G128		3.4 mm	14 mm	Not Qualified				20 mm
HMC980	Analog Devices	TELECOM CIRCUIT	OTHER	NO LEAD	38	DIE	RECTANGULAR	UNSPECIFIED	YES	1				12 V		UNCASED CHIP				85 Cel	-55 Cel		UPPER	R-XUUC-N38			1.4 mm			NOT SPECIFIED	NOT SPECIFIED	2.26 mm
AD6426XST	Analog Devices		OTHER	GULL WING	144	QFP	SQUARE	PLASTIC/EPOXY	YES		BIPOLAR				2.4/3.3	FLATPACK	QFP144,.87SQ,20	Other Telecom ICs	.5 mm	85 Cel	-25 Cel	Tin/Lead (Sn/Pb)	QUAD	S-PQFP-G144				Not Qualified	e0
HMC712	Analog Devices	TELECOM CIRCUIT	OTHER	NO LEAD		DIE	RECTANGULAR	UNSPECIFIED	YES	1						UNCASED CHIP				85 Cel	-55 Cel	GOLD	UPPER	R-XUUC-N			1.204 mm		e4			1.414 mm
AD6652BBC	Analog Devices	TELECOM CIRCUIT	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			2.5 V		GRID ARRAY			1 mm	70 Cel	-40 Cel	TIN LEAD SILVER	BOTTOM	S-PBGA-B256	3		17 mm	Not Qualified	e0		240	17 mm
HMC773	Analog Devices	TELECOM CIRCUIT	OTHER	NO LEAD	3	DIE	RECTANGULAR	UNSPECIFIED	YES	1						UNCASED CHIP				85 Cel	-55 Cel		UPPER	R-XUUC-N3				Not Qualified		NOT SPECIFIED	NOT SPECIFIED
AD6426XB	Analog Devices		OTHER	BALL	144	BGA	SQUARE	PLASTIC/EPOXY	YES		BIPOLAR				2.4/3.3	GRID ARRAY	BGA144,12X12,40	Other Telecom ICs	1 mm	85 Cel	-25 Cel	Tin/Lead (Sn/Pb)	BOTTOM	S-PBGA-B144				Not Qualified	e0
AD8151	Analog Devices		OTHER	GULL WING	184	QFP	SQUARE	PLASTIC/EPOXY	YES						+-3.3/+-5	FLATPACK	QFP184,.87SQ,16	Other Telecom ICs	.4 mm	85 Cel	0 Cel	Tin/Lead (Sn/Pb)	QUAD	S-PQFP-G184				Not Qualified	e0
AD6402ARS-REEL	Analog Devices	TELECOM CIRCUIT	OTHER	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						SMALL OUTLINE, SHRINK PITCH			.65 mm	85 Cel	-25 Cel		DUAL	R-PDSO-G28		1.73 mm	5.3 mm	Not Qualified				10.21 mm
AD61009ARSRL	Analog Devices	TELECOM CIRCUIT	OTHER	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, SHRINK PITCH			.65 mm	85 Cel	-25 Cel	TIN LEAD	DUAL	R-PDSO-G20	1	2 mm	5.3 mm	Not Qualified	e0		240	7.2 mm
HMC7447	Analog Devices	TELECOM CIRCUIT	OTHER	NO LEAD	4	DIE	RECTANGULAR	UNSPECIFIED	YES	1						UNCASED CHIP				85 Cel	-55 Cel		UPPER	R-XUUC-N4			.871 mm			NOT APPLICABLE	NOT APPLICABLE	1.221 mm
LTC1757A-1EMS8#TRPBF	Analog Devices	TELECOM CIRCUIT	OTHER	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-30 Cel	MATTE TIN	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified	e3			3 mm
AD6652XBC	Analog Devices	TELECOM CIRCUIT	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			2.5 V		GRID ARRAY			1 mm	70 Cel	-40 Cel	TIN LEAD SILVER	BOTTOM	S-PBGA-B256	3		17 mm	Not Qualified	e0			17 mm
LTC1757-2EMS	Analog Devices	TELECOM CIRCUIT	OTHER	GULL WING	10	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS				3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20	Other Telecom ICs	.5 mm	85 Cel	-30 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G10				Not Qualified	e0
ADL5375-05SCPZEPWP	Analog Devices		OTHER	NO LEAD	24	QCCN	SQUARE	PLASTIC/EPOXY	YES		BIPOLAR			5 V	5	CHIP CARRIER	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	105 Cel	-55 Cel		QUAD	S-PQCC-N24
HMC981	Analog Devices	TELECOM CIRCUIT	OTHER	NO LEAD	30	QCCN	SQUARE	UNSPECIFIED	YES	1				8 V		CHIP CARRIER				85 Cel	-55 Cel		UPPER	S-XUCC-N30						NOT SPECIFIED	NOT SPECIFIED
LTC1757A-2EMS#TR	Analog Devices	TELECOM CIRCUIT	OTHER	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	85 Cel	-30 Cel	TIN LEAD	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified	e0			3 mm
HMC757	Analog Devices	TELECOM CIRCUIT	OTHER	NO LEAD	4	DIE	RECTANGULAR	UNSPECIFIED	YES	1				7 V		UNCASED CHIP				85 Cel	-55 Cel		UPPER	R-XUUC-N4				Not Qualified
AD6624AABC	Analog Devices	TELECOM CIRCUIT	OTHER	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			2.5 V	2.5,3.3	GRID ARRAY, LOW PROFILE	BGA196,14X14,40	Other Telecom ICs	1 mm	70 Cel	-40 Cel	TIN LEAD SILVER	BOTTOM	S-PBGA-B196	3	1.5 mm	15 mm	Not Qualified	e0		240	15 mm
AD61009ARS	Analog Devices	TELECOM CIRCUIT	OTHER	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, SHRINK PITCH			.65 mm	85 Cel	-25 Cel	TIN LEAD	DUAL	R-PDSO-G20	1	2 mm	5.3 mm	Not Qualified	e0		240	7.2 mm
LTC1757A-1EMS8#TR	Analog Devices	TELECOM CIRCUIT	OTHER	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-30 Cel	TIN LEAD	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified	e0			3 mm
HMC-ABH264	Analog Devices	TELECOM CIRCUIT	OTHER	NO LEAD	6	DIE	RECTANGULAR	UNSPECIFIED	YES	1				5 V		UNCASED CHIP				85 Cel	-55 Cel		UPPER	R-XUUC-N6				Not Qualified		NOT APPLICABLE	NOT APPLICABLE
LTC1757A-2EMS#PBF	Analog Devices	TELECOM CIRCUIT	OTHER	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	85 Cel	-30 Cel	Matte Tin (Sn)	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified	e3	30	260	3 mm
HMC554	Analog Devices	TELECOM CIRCUIT	OTHER	NO LEAD	3	DIE	RECTANGULAR	UNSPECIFIED	YES	1						UNCASED CHIP				85 Cel	-55 Cel	GOLD	UPPER	R-XUUC-N3				Not Qualified	e4
HMC570	Analog Devices	TELECOM CIRCUIT	OTHER	NO LEAD	7	DIE	RECTANGULAR	UNSPECIFIED	YES	1				3.5 V		UNCASED CHIP				85 Cel	-55 Cel	GOLD	UPPER	R-XUUC-N7				Not Qualified	e4
AD8315ACPZ-REEL7	Analog Devices	TELECOM CIRCUIT	OTHER	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		.0129 mA	2.7 V	3/5	SMALL OUTLINE	SOLCC8,.08,20	Other Telecom ICs	.5 mm	85 Cel	-30 Cel	MATTE TIN	DUAL	R-XDSO-N8	1	1 mm	2 mm	Not Qualified	e3	30	260	3 mm
AD608AR	Analog Devices	TELECOM CIRCUIT	OTHER	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE			1.27 mm	85 Cel	-25 Cel	TIN LEAD	DUAL	R-PDSO-G16	1	1.75 mm	3.9 mm	Not Qualified	e0		240	9.9 mm
AD9860BST	Analog Devices	TELECOM CIRCUIT	OTHER	GULL WING	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP128,.63X.87,20	Other Telecom ICs	.5 mm	70 Cel	-40 Cel	TIN LEAD	QUAD	R-PQFP-G128	3	1.6 mm	14 mm	Not Qualified	e0		240	20 mm
AD9860BSTZRL	Analog Devices	TELECOM CIRCUIT	OTHER	GULL WING	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP128,.63X.87,20	Other Telecom ICs	.5 mm	70 Cel	-40 Cel	MATTE TIN	QUAD	R-PQFP-G128	3	1.6 mm	14 mm	Not Qualified	e3		260	20 mm
HMC570LC5TR	Analog Devices	TELECOM CIRCUIT	OTHER	NO LEAD	32	HQCCN	SQUARE	UNSPECIFIED	YES	1				3.5 V		CHIP CARRIER, HEAT SINK/SLUG			.5 mm	85 Cel	-55 Cel		QUAD	S-XQCC-N32		1.12 mm	5 mm			NOT SPECIFIED	NOT SPECIFIED	5 mm
LTC5800HWR-WHMA#PBF	Analog Devices	TELECOM CIRCUIT	OTHER	NO LEAD	72	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-55 Cel	SILVER	QUAD	S-PQCC-N72		1 mm	10 mm		e4			10 mm
AD8315ACP-REEL7	Analog Devices	TELECOM CIRCUIT	OTHER	NO LEAD	8	HVSON	RECTANGULAR	UNSPECIFIED	YES	1	BIPOLAR		.0129 mA	2.7 V	3/5	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.08,20	Other Telecom ICs	.5 mm	85 Cel	-30 Cel	TIN LEAD	DUAL	R-XDSO-N8	1	1 mm	2 mm	Not Qualified	e0		240	3 mm
AD8315ARMZ	Analog Devices	TELECOM CIRCUIT	OTHER	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR		.0129 mA	2.7 V	3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19	Other Telecom ICs	.65 mm	85 Cel	-30 Cel	MATTE TIN	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified	e3	30	260	3 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.