OTHER Other Function Telecom Interface ICs 989

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Nominal Negative Supply Voltage	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
SRT512-A4T/XXX	STMicroelectronics	TELECOM CIRCUIT	OTHER								CMOS		.25 mA	3 V	3		DIE OR CHIP	Other Telecom ICs		85 Cel	-20 Cel							Not Qualified
PBL3726/9	STMicroelectronics		OTHER	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		BIPOLAR		100 mA		3.9/13	IN-LINE	DIP18,.3	Other Telecom ICs	2.54 mm	70 Cel	-40 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T18				Not Qualified	e0
SRIX4K-A5S/XXX	STMicroelectronics	TELECOM CIRCUIT	OTHER								CMOS		.25 mA	3 V	3		DIE OR CHIP	Other Telecom ICs		85 Cel	-20 Cel							Not Qualified
STC104	STMicroelectronics		OTHER	GULL WING	208	QFP	SQUARE	CERAMIC	YES		CMOS			5 V	5	FLATPACK	QFP208,1.2SQ,20	Other Telecom ICs	.5 mm	100 Cel	0 Cel	Tin/Lead (Sn/Pb)	QUAD	S-XQFP-G208				Not Qualified	e0
SRIX512-A4S/XXX	STMicroelectronics	TELECOM CIRCUIT	OTHER								CMOS		.25 mA	3 V	3		DIE OR CHIP	Other Telecom ICs		85 Cel	-20 Cel							Not Qualified
LRIS2K-MBTG/2	STMicroelectronics	TELECOM CIRCUIT	OTHER	NO LEAD	8	SON	RECTANGULAR	PLASTIC/EPOXY	YES				.15 mA		1.5/3	SMALL OUTLINE	SOLCC8,.11,20	Other Telecom ICs	.5 mm	85 Cel	-20 Cel		DUAL	R-PDSO-N8				Not Qualified
SPBT2932DM	STMicroelectronics	TELECOM CIRCUIT	OTHER	NO LEAD	18		RECTANGULAR	UNSPECIFIED	YES	1				2.5 V		MICROELECTRONIC ASSEMBLY				60 Cel	-20 Cel		UNSPECIFIED	R-XXMA-N18		2.9 mm	11.6 mm			NOT SPECIFIED	NOT SPECIFIED	13.5 mm
LS025M	STMicroelectronics		OTHER	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES		BIPOLAR		2.5 mA		-12/-30	SMALL OUTLINE	SOP14,.25	Other Telecom ICs	1.27 mm	85 Cel	-25 Cel		DUAL	R-PDSO-G14				Not Qualified
SRIX512-A4T/XXX	STMicroelectronics	TELECOM CIRCUIT	OTHER								CMOS		.25 mA	3 V	3		DIE OR CHIP	Other Telecom ICs		85 Cel	-20 Cel							Not Qualified
STPAC01F2	STMicroelectronics	TELECOM CIRCUIT	OTHER	BALL	8	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1				2.7 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-30 Cel		BOTTOM	S-PBGA-B8		.715 mm	1.57 mm	Not Qualified				1.57 mm
GS-BT2416C1	STMicroelectronics	TELECOM CIRCUIT	OTHER	UNSPECIFIED	51		RECTANGULAR	UNSPECIFIED	NO	1				3.3 V		MICROELECTRONIC ASSEMBLY				70 Cel	-20 Cel		UNSPECIFIED	R-XXMA-X51				Not Qualified
SRI512-A5S/XXX	STMicroelectronics	TELECOM CIRCUIT	OTHER								CMOS		.25 mA	3 V	3		DIE OR CHIP	Other Telecom ICs		85 Cel	-20 Cel							Not Qualified
STS39230	STMicroelectronics	TELECOM CIRCUIT	OTHER	BALL	20		RECTANGULAR	PLASTIC/EPOXY	YES	1							BGA20(UNSPEC)			85 Cel	-25 Cel		BOTTOM	R-PBGA-B20
TDA7212	STMicroelectronics	TELECOM CIRCUIT	OTHER	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1				3 V		IN-LINE			2.54 mm	85 Cel	-20 Cel	TIN LEAD	DUAL	R-PDIP-T8		5.08 mm	7.62 mm	Not Qualified	e0
MFRX85201HD/RRFFO	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	48	QCCN	SQUARE	PLASTIC/EPOXY	YES	1						CHIP CARRIER				85 Cel	-25 Cel		QUAD	S-PQCC-N48				Not Qualified
HTRM800/AED	NXP Semiconductors	TELECOM CIRCUIT	OTHER					PLASTIC/EPOXY				-15 V	.55 mA	15 V	+-15	MICROELECTRONIC ASSEMBLY	MODULE(UNSPEC)	Other Telecom ICs		70 Cel	-25 Cel							Not Qualified
PN7150B0HN/C11004Y	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				2.75 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20		.5 mm	85 Cel	-30 Cel		QUAD	S-PQCC-N40		1 mm	6 mm					6 mm
933897020112	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				4 V		SMALL OUTLINE			1.27 mm	70 Cel	-25 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G8		1.75 mm	3.9 mm	Not Qualified	e4			4.9 mm
PRH601HL/C1,557	NXP Semiconductors		OTHER	GULL WING	100	QFP	SQUARE	PLASTIC/EPOXY	YES						3.3,5	FLATPACK	QFP100,.63SQ,20	Other Telecom ICs	.5 mm	70 Cel	-25 Cel		QUAD	S-PQFP-G100	3			Not Qualified			260
UAA2077BM-T	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS		33.5 mA	4 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-30 Cel		DUAL	R-PDSO-G20		1.5 mm	4.4 mm	Not Qualified				6.5 mm
PN7150B0HN/C11003	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				2.75 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20		.5 mm	85 Cel	-30 Cel		QUAD	S-PQCC-N40		1 mm	6 mm					6 mm
SL3S1203AC0	NXP Semiconductors	TELECOM CIRCUIT	OTHER	UNSPECIFIED	2		UNSPECIFIED	PLASTIC/EPOXY	NO	1	CMOS			1.8 V		SPECIAL SHAPE				70 Cel	-40 Cel		UNSPECIFIED	X-PXSS-X2
PCA5075-T	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			5 V		SMALL OUTLINE				70 Cel	-40 Cel		DUAL	R-PDSO-G20				Not Qualified
PCD6001H	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	80	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.5 V	2.5,3	FLATPACK	QFP80,.7X.9,32	Other Telecom ICs	.8 mm	70 Cel	-25 Cel		QUAD	R-PQFP-G80				Not Qualified		40	245
HTRM800/AED,122	NXP Semiconductors	TELECOM CIRCUIT	OTHER					PLASTIC/EPOXY				-15 V	.55 mA	15 V	+-15	MICROELECTRONIC ASSEMBLY	MODULE(UNSPEC)	Other Telecom ICs		70 Cel	-25 Cel							Not Qualified
UAA2077BM	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS		33.5 mA	4 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-30 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G20		1.5 mm	4.4 mm	Not Qualified	e4			6.5 mm
PN7150B0UK/C11003	NXP Semiconductors	TELECOM CIRCUIT	OTHER	BALL	42	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.75 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA42,6X7,16		.4 mm	85 Cel	-30 Cel		BOTTOM	R-PBGA-B42		.58 mm	2.8 mm					2.88 mm
PCD6002H/F1	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	80	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		FLATPACK			.8 mm	70 Cel	-25 Cel		QUAD	R-PQFP-G80		3.2 mm	14 mm	Not Qualified				20 mm
PT5010A0HN/C1,151	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		QUAD	S-PQCC-N32		1 mm	5 mm					5 mm
PCD6003H	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	80	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1			.035 mA	2.5 V	2.5,3	FLATPACK	QFP80,.7X.9,32	Other Telecom ICs	.8 mm	70 Cel	-25 Cel	MATTE TIN	QUAD	R-PQFP-G80				Not Qualified	e3
OL2381AHN	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HQCCN	SQUARE	PLASTIC/EPOXY	YES	1				2.7 V		CHIP CARRIER, HEAT SINK/SLUG			.5 mm	85 Cel	-25 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N32	3		5 mm		e4			5 mm
PCD3316T/2	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3.3 V		SMALL OUTLINE			1.27 mm	70 Cel	-25 Cel	TIN LEAD	DUAL	R-PDSO-G16		2.65 mm	7.5 mm	Not Qualified	e0			10.3 mm
935272969118	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD		DIE	UNSPECIFIED	UNSPECIFIED	YES	1						UNCASED CHIP				85 Cel	-25 Cel		UPPER	X-XUUC-N				Not Qualified		NOT SPECIFIED	NOT SPECIFIED
P5DF081HN/T1AD2060,151	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V		CHIP CARRIER				85 Cel	-25 Cel		QUAD	S-PQCC-N32
OL2311AHN	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				2.7 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-25 Cel		QUAD	S-PQCC-N32	3	.85 mm	5 mm					5 mm
HTRM310	NXP Semiconductors	TELECOM CIRCUIT	OTHER					PLASTIC/EPOXY						5 V	5	MICROELECTRONIC ASSEMBLY	MODULE(UNSPEC)	Other Telecom ICs		70 Cel	-25 Cel							Not Qualified
935263011112	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3.3 V		SMALL OUTLINE			1.27 mm	70 Cel	-25 Cel		DUAL	R-PDSO-G16		2.65 mm	7.5 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	10.3 mm
TDA8730	NXP Semiconductors	TELECOM CIRCUIT	OTHER	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1				9 V		IN-LINE				85 Cel	-25 Cel	TIN/NICKEL PALLADIUM GOLD	DUAL	R-PDIP-T16				Not Qualified	e3/e4
BGW200EG	NXP Semiconductors		OTHER	NO LEAD	68	QCCN	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS		.12 mA		1.8,2.8	CHIP CARRIER	LCC68,.4X.6,25	Other Telecom ICs	.635 mm	85 Cel	-30 Cel		QUAD	R-PQCC-N68				Not Qualified
PCD3316T-T	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		2.3 mA	3.3 V		SMALL OUTLINE			1.27 mm	70 Cel	-25 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G16		2.65 mm	7.5 mm	Not Qualified	e4			10.3 mm
PCD5071	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	44	QFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			5 V		FLATPACK				70 Cel	-25 Cel		QUAD	S-PQFP-G44				Not Qualified
933897020118	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				4 V		SMALL OUTLINE			1.27 mm	70 Cel	-25 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G8		1.75 mm	3.9 mm	Not Qualified	e4			4.9 mm
PN7150B0HN/C11005Y	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				2.75 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20		.5 mm	85 Cel	-30 Cel		QUAD	S-PQCC-N40		1 mm	6 mm					6 mm
PCD3316T/2,118	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3.3 V		SMALL OUTLINE			1.27 mm	70 Cel	-25 Cel	TIN LEAD	DUAL	R-PDSO-G16		2.65 mm	7.5 mm	Not Qualified	e0	NOT SPECIFIED	NOT SPECIFIED	10.3 mm
SLRC61002HN/TRAYB	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-25 Cel		QUAD	S-PQCC-N32		1 mm	5 mm					5 mm
SL3S1001FTT,118	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1						SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	80 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-G8	1	1.1 mm	3 mm		e4	30	260	3 mm
OL2311AHN/C0B,515	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			21.5 mA	2.7 V	2.7	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-25 Cel		QUAD	S-PQCC-N32	2A	.85 mm	5 mm	Not Qualified			260	5 mm
935272973005	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD		DIE	UNSPECIFIED	UNSPECIFIED	YES	1						UNCASED CHIP				85 Cel	-25 Cel		UPPER	X-XUUC-N				Not Qualified		NOT SPECIFIED	NOT SPECIFIED

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.