OTHER Other Function Telecom Interface ICs 989

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Nominal Negative Supply Voltage	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
PCD6003U	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD			UNSPECIFIED	UNSPECIFIED	YES	1				2.5 V		UNCASED CHIP				70 Cel	-25 Cel		UPPER	X-XUUC-N				Not Qualified
TEA1081/C2	NXP Semiconductors	TELECOM CIRCUIT	OTHER	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1				4 V		IN-LINE			2.54 mm	70 Cel	-25 Cel		DUAL	R-PDIP-T8		4.2 mm	7.62 mm	Not Qualified				9.5 mm
SLRC61002HN/TRAYBM	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-25 Cel		QUAD	S-PQCC-N32		1 mm	5 mm					5 mm
SL3S1203AC2	NXP Semiconductors	TELECOM CIRCUIT	OTHER	UNSPECIFIED	2		UNSPECIFIED	PLASTIC/EPOXY	NO	1	CMOS			1.8 V		SPECIAL SHAPE				70 Cel	-40 Cel		UNSPECIFIED	X-PXSS-X2
935272974118	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD		DIE	UNSPECIFIED	UNSPECIFIED	YES	1						UNCASED CHIP				85 Cel	-25 Cel		UPPER	X-XUUC-N				Not Qualified		NOT SPECIFIED	NOT SPECIFIED
TEA1081N	NXP Semiconductors	TELECOM CIRCUIT	OTHER	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1				4 V		IN-LINE			2.54 mm	70 Cel	-25 Cel		DUAL	R-PDIP-T8		4.2 mm	7.62 mm	Not Qualified				9.5 mm
935272976118	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD		DIE	UNSPECIFIED	UNSPECIFIED	YES	1						UNCASED CHIP				85 Cel	-25 Cel		UPPER	X-XUUC-N				Not Qualified		NOT SPECIFIED	NOT SPECIFIED
TEA1081TD-T	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				4 V		SMALL OUTLINE			1.27 mm	70 Cel	-25 Cel		DUAL	R-PDSO-G8		1.75 mm	3.9 mm	Not Qualified				4.9 mm
PR601HL/C1	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel	-25 Cel		QUAD	S-PQFP-G100		1.6 mm	14 mm					14 mm
OL2300NHN	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	16	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1				2.7 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-25 Cel		QUAD	S-PQCC-N16		1 mm	3 mm	Not Qualified				3 mm
PT5010A0HN/C1	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		QUAD	S-PQCC-N32		1 mm	5 mm					5 mm
PCD3316T/2,112	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3.3 V		SMALL OUTLINE			1.27 mm	70 Cel	-25 Cel	TIN LEAD	DUAL	R-PDSO-G16		2.65 mm	7.5 mm	Not Qualified	e0	NOT SPECIFIED	NOT SPECIFIED	10.3 mm
NT2H1311F0DTL,125	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	4	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	1						SMALL OUTLINE, VERY THIN PROFILE			.5 mm	70 Cel	-25 Cel		DUAL	R-PDSO-N4		.5 mm	1.5 mm					2 mm
935272972118	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD		DIE	UNSPECIFIED	UNSPECIFIED	YES	1						UNCASED CHIP				85 Cel	-25 Cel		UPPER	X-XUUC-N				Not Qualified		NOT SPECIFIED	NOT SPECIFIED
PCD3316T/2D-T	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3.3 V		SMALL OUTLINE			1.27 mm	70 Cel	-25 Cel	TIN LEAD	DUAL	R-PDSO-G16		2.65 mm	7.5 mm	Not Qualified	e0			10.3 mm
NT2H0301G0DUD,005	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD		DIE	UNSPECIFIED	UNSPECIFIED	YES	1						UNCASED CHIP				70 Cel	-25 Cel		UPPER	X-XUUC-N
PN7120A0EV/C1XXXX	NXP Semiconductors	TELECOM CIRCUIT	OTHER	BALL	49	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-30 Cel		BOTTOM	R-PBGA-B49		1 mm	4 mm					4.3 mm
PN5441A2ET/C20501	NXP Semiconductors	TELECOM CIRCUIT	OTHER	BALL	64	BGA	SQUARE	PLASTIC/EPOXY	YES	1						GRID ARRAY				85 Cel	-25 Cel		BOTTOM	S-PBGA-B64
OL2381AHN/C0CZ	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				2.7 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-25 Cel		QUAD	S-PQCC-N32		.85 mm	5 mm					5 mm
P5DF081HN/T1AD2060	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG				85 Cel	-25 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N32					e4
UAA2072M	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			4.8 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-30 Cel		DUAL	R-PDSO-G20		1.5 mm	4.4 mm	Not Qualified				6.5 mm
PN7150B0HN/C11005E	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				2.75 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20		.5 mm	85 Cel	-30 Cel		QUAD	S-PQCC-N40		1 mm	6 mm					6 mm
935272977118	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD		DIE	UNSPECIFIED	UNSPECIFIED	YES	1						UNCASED CHIP				85 Cel	-25 Cel		UPPER	X-XUUC-N				Not Qualified		NOT SPECIFIED	NOT SPECIFIED
NT2H0301G0DUD	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD		DIE	UNSPECIFIED	UNSPECIFIED	YES	1						UNCASED CHIP				70 Cel	-25 Cel		UPPER	X-XUUC-N
UAA3559HN	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS			3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel	TIN/NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N32		1 mm	5 mm	Not Qualified	e3/e4			5 mm
PCD3316TD-T	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3.3 V		SMALL OUTLINE			1.27 mm	70 Cel	-25 Cel		DUAL	R-PDSO-G16		2.65 mm	7.5 mm	Not Qualified				10.3 mm
935272970005	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD		DIE	UNSPECIFIED	UNSPECIFIED	YES	1						UNCASED CHIP				85 Cel	-25 Cel		UPPER	X-XUUC-N				Not Qualified		NOT SPECIFIED	NOT SPECIFIED
SLRC61002HN/T/R	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-25 Cel		QUAD	S-PQCC-N32		1 mm	5 mm					5 mm
TDA8730N	NXP Semiconductors	TELECOM CIRCUIT	OTHER	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1				9 V		IN-LINE			2.54 mm	85 Cel	-25 Cel		DUAL	R-PDIP-T16		4.7 mm	7.62 mm	Not Qualified				21.6 mm
NT2H1311F0DTL	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	4	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1						SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	70 Cel	-25 Cel		DUAL	R-PDSO-N4		.5 mm	1.5 mm					2 mm
NT2H1611F0DTL,125	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	4	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	1						SMALL OUTLINE, VERY THIN PROFILE			.5 mm	70 Cel	-25 Cel		DUAL	R-PDSO-N4		.5 mm	1.5 mm					2 mm
TEA1081TD	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				4 V		SMALL OUTLINE			1.27 mm	70 Cel	-25 Cel		DUAL	R-PDSO-G8		1.75 mm	3.9 mm	Not Qualified				4.9 mm
NT2H1611F0DTL	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	4	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1						SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	70 Cel	-25 Cel		DUAL	R-PDSO-N4		.5 mm	1.5 mm					2 mm
PCD3316T/2D	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3.3 V		SMALL OUTLINE			1.27 mm	70 Cel	-25 Cel	TIN LEAD	DUAL	R-PDSO-G16		2.65 mm	7.5 mm	Not Qualified	e0			10.3 mm
PCA5075	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			5 V		SMALL OUTLINE				70 Cel	-40 Cel		DUAL	R-PDSO-G20				Not Qualified
HTRM800/CED	NXP Semiconductors	TELECOM CIRCUIT	OTHER					PLASTIC/EPOXY				-15 V	.55 mA	15 V	+-15	MICROELECTRONIC ASSEMBLY	MODULE(UNSPEC)	Other Telecom ICs		70 Cel	-25 Cel							Not Qualified
PCD6001U	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD			UNSPECIFIED	UNSPECIFIED	YES	1				2.5 V		UNCASED CHIP				70 Cel	-25 Cel		UPPER	X-XUUC-N				Not Qualified
UAA2072M-T	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			4.8 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-30 Cel		DUAL	R-PDSO-G20		1.5 mm	4.4 mm	Not Qualified				6.5 mm
PCD3316T	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		2.3 mA	3.3 V	3.3	SMALL OUTLINE	SOP16,.4	Telephone Circuits	1.27 mm	70 Cel	-25 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G16		2.65 mm	7.5 mm	Not Qualified	e4			10.3 mm
935272975118	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD		DIE	UNSPECIFIED	UNSPECIFIED	YES	1						UNCASED CHIP				85 Cel	-25 Cel		UPPER	X-XUUC-N				Not Qualified		NOT SPECIFIED	NOT SPECIFIED
935272971005	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD		DIE	UNSPECIFIED	UNSPECIFIED	YES	1						UNCASED CHIP				85 Cel	-25 Cel		UPPER	X-XUUC-N				Not Qualified		NOT SPECIFIED	NOT SPECIFIED
OL2300NHN/F,118	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			19 mA	2.7 V	2.7	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.12SQ,20	Other Telecom ICs	.5 mm	85 Cel	-25 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N16	1	1 mm	3 mm	Not Qualified	e4	30	260	3 mm
BGB101	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	28	LGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.8 V		GRID ARRAY			1.15 mm	85 Cel	-30 Cel		BOTTOM	R-PBGA-N28		1.9 mm	8.5 mm	Not Qualified				10.5 mm
PN7150B0HN/C11004E	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				2.75 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20		.5 mm	85 Cel	-30 Cel		QUAD	S-PQCC-N40		1 mm	6 mm					6 mm
HTRM800/EED	NXP Semiconductors	TELECOM CIRCUIT	OTHER					PLASTIC/EPOXY				-15 V	.55 mA	15 V	+-15	MICROELECTRONIC ASSEMBLY	MODULE(UNSPEC)	Other Telecom ICs		70 Cel	-25 Cel							Not Qualified
PRH601HL/C1	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel	-25 Cel		QUAD	S-PQFP-G100		1.6 mm	14 mm					14 mm
933897010112	NXP Semiconductors	TELECOM CIRCUIT	OTHER	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1				4 V		IN-LINE			2.54 mm	70 Cel	-25 Cel		DUAL	R-PDIP-T8		4.2 mm	7.62 mm	Not Qualified		40	250	9.5 mm
PCD6002H/F1-T	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	80	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		FLATPACK			.8 mm	70 Cel	-25 Cel		QUAD	R-PQFP-G80		3.2 mm	14 mm	Not Qualified				20 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.