OTHER Other Function Telecom Interface ICs 989

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

TCP-3039NQT

Onsemi

TELECOM CIRCUIT

OTHER

NO LEAD

6

VQCCN

RECTANGULAR

UNSPECIFIED

YES

1

CHIP CARRIER, VERY THIN PROFILE

.5 mm

85 Cel

-30 Cel

QUAD

R-XQCC-N6

1 mm

1.2 mm

1.6 mm

TCP-4112UB-DT

Onsemi

TELECOM CIRCUIT

OTHER

BALL

4

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.42 mm

85 Cel

-30 Cel

NICKEL GOLD

BOTTOM

R-PBGA-B4

1

.345 mm

.609 mm

e4

260

.626 mm

TCP-3039H-DT

Onsemi

TELECOM CIRCUIT

OTHER

BALL

10

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

85 Cel

-30 Cel

BOTTOM

R-PBGA-B10

.611 mm

.722 mm

1.029 mm

TCP-3056H-DT

Onsemi

TELECOM CIRCUIT

OTHER

BALL

12

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

85 Cel

-30 Cel

BOTTOM

R-PBGA-B12

.611 mm

.722 mm

1.179 mm

TCP-3056N-DT

Onsemi

TELECOM CIRCUIT

OTHER

BALL

12

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

85 Cel

-30 Cel

BOTTOM

R-PBGA-B12

.611 mm

.722 mm

1.179 mm

TCP-3068H-DT

Onsemi

TELECOM CIRCUIT

OTHER

BALL

12

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

85 Cel

-30 Cel

BOTTOM

R-PBGA-B12

.611 mm

.722 mm

1.179 mm

LA72910V-TLM-E

Onsemi

OTHER

GULL WING

16

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5 V

5

SMALL OUTLINE, SHRINK PITCH

SSOP16,.25

Other Telecom ICs

.635 mm

70 Cel

-30 Cel

TIN BISMUTH

DUAL

R-PDSO-G16

3

Not Qualified

e6

30

260

LA72910V-MPB-E

Onsemi

OTHER

GULL WING

16

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5 V

5

SMALL OUTLINE, SHRINK PITCH

SSOP16,.25

Other Telecom ICs

.635 mm

70 Cel

-30 Cel

TIN BISMUTH

DUAL

R-PDSO-G16

3

Not Qualified

e6

30

260

LA72910V-MPB-H

Onsemi

OTHER

GULL WING

16

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5 V

5

SMALL OUTLINE, SHRINK PITCH

SSOP16,.25

Other Telecom ICs

.635 mm

70 Cel

-30 Cel

TIN BISMUTH

DUAL

R-PDSO-G16

3

Not Qualified

e6

30

260

STHVDAC-253MTGF3

STMicroelectronics

TELECOM CIRCUIT

OTHER

BALL

16

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-30 Cel

BOTTOM

S-PBGA-B16

.64 mm

1.7 mm

NOT SPECIFIED

NOT SPECIFIED

1.7 mm

SRIX4K-A4T/XXX

STMicroelectronics

TELECOM CIRCUIT

OTHER

CMOS

.25 mA

3 V

3

DIE OR CHIP

Other Telecom ICs

85 Cel

-20 Cel

Not Qualified

STM7E1A

STMicroelectronics

TELECOM CIRCUIT

OTHER

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

-3.3 V

3.3 V

+-3.3

FLATPACK, LOW PROFILE, FINE PITCH

QFP64,.47SQ,20

Other Telecom ICs

.5 mm

85 Cel

-25 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQFP-G64

3

1.6 mm

10 mm

Not Qualified

e4

10 mm

SRI4K-A3S/XXX

STMicroelectronics

TELECOM CIRCUIT

OTHER

CMOS

.25 mA

2.5/3.3

DIE OR CHIP

Other Telecom ICs

85 Cel

-20 Cel

Not Qualified

SPBT2563C1

STMicroelectronics

TELECOM CIRCUIT

OTHER

UNSPECIFIED

24

RECTANGULAR

UNSPECIFIED

NO

1

3.3 V

MICROELECTRONIC ASSEMBLY

70 Cel

-20 Cel

DUAL

R-XDMA-X24

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

XRAG2-W41/1GE

STMicroelectronics

TELECOM CIRCUIT

OTHER

NO LEAD

DIE

UNSPECIFIED

UNSPECIFIED

YES

1

UNCASED CHIP

55 Cel

-20 Cel

UPPER

X-XUUC-N

Not Qualified

ST95HF-VMD5T

STMicroelectronics

TELECOM CIRCUIT

OTHER

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-25 Cel

NICKEL PALLADIUM GOLD

QUAD

S-XQCC-N32

1

1 mm

5 mm

e4

260

5 mm

GS-BT2416C2.H

STMicroelectronics

TELECOM CIRCUIT

OTHER

UNSPECIFIED

45

RECTANGULAR

UNSPECIFIED

NO

1

3.3 V

MICROELECTRONIC ASSEMBLY

70 Cel

-20 Cel

UNSPECIFIED

R-XXMA-X45

Not Qualified

LRI2K-MBTG/3

STMicroelectronics

TELECOM CIRCUIT

OTHER

NO LEAD

8

SON

RECTANGULAR

PLASTIC/EPOXY

YES

.15 mA

1.5/3

SMALL OUTLINE

SOLCC8,.12,20

Other Telecom ICs

.5 mm

85 Cel

-20 Cel

DUAL

R-PDSO-N8

Not Qualified

XRAG2-SBN18I/1GE

STMicroelectronics

TELECOM CIRCUIT

OTHER

NO LEAD

DIE

UNSPECIFIED

UNSPECIFIED

YES

1

UNCASED CHIP

DIE OR CHIP

Other Telecom ICs

55 Cel

-20 Cel

UPPER

X-XUUC-N

Not Qualified

L3845D1013TR

STMicroelectronics

TELECOM CIRCUIT

OTHER

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

SMALL OUTLINE

1.27 mm

70 Cel

-40 Cel

TIN LEAD

DUAL

R-PDSO-G8

1.75 mm

3.9 mm

Not Qualified

e0

4.9 mm

STHVDAC-256MTGF3

STMicroelectronics

TELECOM CIRCUIT

OTHER

BALL

20

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.3 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-30 Cel

BOTTOM

R-PBGA-B20

.64 mm

1.94 mm

NOT SPECIFIED

NOT SPECIFIED

2.23 mm

STHVDAC-253MF3

STMicroelectronics

TELECOM CIRCUIT

OTHER

BALL

16

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.3 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-30 Cel

BOTTOM

R-PBGA-B16

.655 mm

1.6 mm

NOT SPECIFIED

NOT SPECIFIED

1.7 mm

XRAG2-W41/1GI

STMicroelectronics

TELECOM CIRCUIT

OTHER

NO LEAD

DIE

UNSPECIFIED

UNSPECIFIED

YES

1

UNCASED CHIP

55 Cel

-20 Cel

UPPER

X-XUUC-N

Not Qualified

CRX14-MQP/1GE

STMicroelectronics

TELECOM CIRCUIT

OTHER

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

20 mA

5 V

5

SMALL OUTLINE

SOP16,.25

Other Telecom ICs

1.27 mm

85 Cel

-20 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G16

3

Not Qualified

e4

30

260

ST70134A

STMicroelectronics

TELECOM CIRCUIT

OTHER

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3 V

3.3

FLATPACK, LOW PROFILE, FINE PITCH

QFP64,.47SQ,20

Modems

.5 mm

80 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQFP-G64

1.6 mm

10 mm

Not Qualified

e4

10 mm

SRI4K-A5T/XXX

STMicroelectronics

TELECOM CIRCUIT

OTHER

CMOS

.25 mA

2.5/3.3

DIE OR CHIP

Other Telecom ICs

85 Cel

-20 Cel

Not Qualified

XRAG2-W4I/1GE

STMicroelectronics

TELECOM CIRCUIT

OTHER

NO LEAD

DIE

UNSPECIFIED

UNSPECIFIED

YES

1

UNCASED CHIP

DIE OR CHIP

Other Telecom ICs

55 Cel

-20 Cel

UPPER

X-XUUC-N

Not Qualified

SRI4K-A3T/XXX

STMicroelectronics

TELECOM CIRCUIT

OTHER

CMOS

.25 mA

2.5/3.3

DIE OR CHIP

Other Telecom ICs

85 Cel

-20 Cel

Not Qualified

CR14-MQP/XXX

STMicroelectronics

TELECOM CIRCUIT

OTHER

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

5 V

SMALL OUTLINE

1.27 mm

85 Cel

-20 Cel

DUAL

R-PDSO-G16

1.75 mm

3.9 mm

Not Qualified

9.9 mm

SRI4K-A4T/XXX

STMicroelectronics

TELECOM CIRCUIT

OTHER

CMOS

.25 mA

2.5/3.3

DIE OR CHIP

Other Telecom ICs

85 Cel

-20 Cel

Not Qualified

SRT512-A4S/XXX

STMicroelectronics

TELECOM CIRCUIT

OTHER

CMOS

.25 mA

3 V

3

DIE OR CHIP

Other Telecom ICs

85 Cel

-20 Cel

Not Qualified

SRI512-A5T/XXX

STMicroelectronics

TELECOM CIRCUIT

OTHER

CMOS

.25 mA

3 V

3

DIE OR CHIP

Other Telecom ICs

85 Cel

-20 Cel

Not Qualified

CRX14-MQP/XXX

STMicroelectronics

TELECOM CIRCUIT

OTHER

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

5 V

SMALL OUTLINE

1.27 mm

85 Cel

-20 Cel

DUAL

R-PDSO-G16

1.75 mm

3.9 mm

Not Qualified

9.9 mm

LS285AB1

STMicroelectronics

OTHER

THROUGH-HOLE

14

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

BIPOLAR

120 mA

IN-LINE

DIP14,.3

Other Telecom ICs

2.54 mm

70 Cel

-40 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDIP-T14

Not Qualified

e0

GS-BT2416C2

STMicroelectronics

TELECOM CIRCUIT

OTHER

UNSPECIFIED

45

RECTANGULAR

UNSPECIFIED

NO

1

3.3 V

MICROELECTRONIC ASSEMBLY

70 Cel

-20 Cel

UNSPECIFIED

R-XXMA-X45

Not Qualified

LRI2K-MBTG/1

STMicroelectronics

TELECOM CIRCUIT

OTHER

NO LEAD

8

SON

RECTANGULAR

PLASTIC/EPOXY

YES

.15 mA

1.5/3

SMALL OUTLINE

SOLCC8,.12,20

Other Telecom ICs

.5 mm

85 Cel

-20 Cel

DUAL

R-PDSO-N8

Not Qualified

CR14-MQP/1GE

STMicroelectronics

TELECOM CIRCUIT

OTHER

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

.02 mA

5 V

5

SMALL OUTLINE

SOP16,.25

Other Telecom ICs

1.27 mm

85 Cel

-20 Cel

DUAL

R-PDSO-G16

1.75 mm

3.9 mm

Not Qualified

9.9 mm

SRIX4K-A5T/XXX

STMicroelectronics

TELECOM CIRCUIT

OTHER

CMOS

.25 mA

3 V

3

DIE OR CHIP

Other Telecom ICs

85 Cel

-20 Cel

Not Qualified

XRAG2-MATG/1GI

STMicroelectronics

TELECOM CIRCUIT

OTHER

NO LEAD

6

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC6,.08,20

Other Telecom ICs

.5 mm

55 Cel

-20 Cel

DUAL

R-PDSO-N6

.6 mm

1.7 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

1.9 mm

STLC1511

STMicroelectronics

TELECOM CIRCUIT

OTHER

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

5 V

5

FLATPACK, LOW PROFILE, FINE PITCH

QFP64,.47SQ,20

Modems

.5 mm

80 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQFP-G64

1.6 mm

10 mm

Not Qualified

e4

10 mm

CR14-MQ/1GE

STMicroelectronics

TELECOM CIRCUIT

OTHER

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

.02 mA

5 V

5

SMALL OUTLINE

SOP16,.25

Other Telecom ICs

1.27 mm

85 Cel

-20 Cel

TIN LEAD

DUAL

R-PDSO-G16

1.75 mm

3.9 mm

Not Qualified

e0

9.9 mm

LS025T

STMicroelectronics

OTHER

WIRE

10

ROUND

METAL

BIPOLAR

2.5 mA

-12/-30

CYLINDRICAL

CAN10,.23

Other Telecom ICs

85 Cel

-25 Cel

BOTTOM

O-MBCY-W10

Not Qualified

LRI2K-MBTG/4

STMicroelectronics

TELECOM CIRCUIT

OTHER

NO LEAD

8

SON

RECTANGULAR

PLASTIC/EPOXY

YES

.15 mA

1.5/3

SMALL OUTLINE

SOLCC8,.12,20

Other Telecom ICs

.5 mm

85 Cel

-20 Cel

DUAL

R-PDSO-N8

Not Qualified

SRT512-A5T/XXX

STMicroelectronics

TELECOM CIRCUIT

OTHER

CMOS

.25 mA

3 V

3

DIE OR CHIP

Other Telecom ICs

85 Cel

-20 Cel

Not Qualified

LRIS2K-MBTG

STMicroelectronics

TELECOM CIRCUIT

OTHER

NO LEAD

8

SON

RECTANGULAR

PLASTIC/EPOXY

YES

.15 mA

1.5/3

SMALL OUTLINE

SOLCC8,.11,20

Other Telecom ICs

.5 mm

85 Cel

-20 Cel

DUAL

R-PDSO-N8

Not Qualified

PBL3726/8

STMicroelectronics

OTHER

THROUGH-HOLE

16

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

BIPOLAR

100 mA

3.5/9

IN-LINE

DIP16,.3

Other Telecom ICs

2.54 mm

70 Cel

-40 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDIP-T16

Not Qualified

e0

LRI2K-MBTG/2

STMicroelectronics

TELECOM CIRCUIT

OTHER

NO LEAD

8

SON

RECTANGULAR

PLASTIC/EPOXY

YES

.15 mA

1.5/3

SMALL OUTLINE

SOLCC8,.12,20

Other Telecom ICs

.5 mm

85 Cel

-20 Cel

DUAL

R-PDSO-N8

Not Qualified

SRI4K-A4S/XXX

STMicroelectronics

TELECOM CIRCUIT

OTHER

CMOS

.25 mA

2.5/3.3

DIE OR CHIP

Other Telecom ICs

85 Cel

-20 Cel

Not Qualified

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.