OTHER Other Function Telecom Interface ICs 989

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
LA8515N	Onsemi		OTHER	THROUGH-HOLE	20	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		BIPOLAR				IN-LINE	DIP20,.3	Other Telecom ICs	2.54 mm	70 Cel	-30 Cel		DUAL	R-PDIP-T20				Not Qualified
TCP-3027H-QT	Onsemi	TELECOM CIRCUIT	OTHER	NO LEAD	6	VQCCN	RECTANGULAR	UNSPECIFIED	YES	1					CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		QUAD	R-XQCC-N6		1 mm	1.2 mm			NOT SPECIFIED	NOT SPECIFIED	1.6 mm
TCP-4156UB-DT	Onsemi	TELECOM CIRCUIT	OTHER	BALL	4	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.42 mm	85 Cel	-30 Cel	NICKEL GOLD	BOTTOM	R-PBGA-B4	1	.345 mm	.609 mm		e4		260	1.009 mm
FIN212ACMLX	Onsemi	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			2.775 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	70 Cel	-30 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N32	1	.8 mm	5 mm	Not Qualified	e4	30	260	5 mm
TCC-106A-RT	Onsemi	TELECOM CIRCUIT	OTHER	BALL	20	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM	R-PBGA-B20		.65 mm	2.23 mm					2.58 mm
TCP-3027N-QT	Onsemi	TELECOM CIRCUIT	OTHER	NO LEAD	6	VQCCN	RECTANGULAR	UNSPECIFIED	YES	1					CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		QUAD	R-XQCC-N6		1 mm	1.2 mm					1.6 mm
TCP-3033N-QT	Onsemi	TELECOM CIRCUIT	OTHER	NO LEAD	6	VQCCN	RECTANGULAR	UNSPECIFIED	YES	1					CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		QUAD	R-XQCC-N6		1 mm	1.2 mm					1.6 mm
FIN210ACMLX	Onsemi	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1			2.775 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	70 Cel	-30 Cel	NICKEL PALLADIUM GOLD SILVER	QUAD	S-XQCC-N32	1	.8 mm	5 mm	Not Qualified	e4	30	260	5 mm
TCP-3118H-DT	Onsemi	TELECOM CIRCUIT	OTHER	BALL	8	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-30 Cel		BOTTOM	R-PBGA-B8		.32 mm	.652 mm			NOT SPECIFIED	NOT SPECIFIED	.834 mm
TCP-3047H-QT	Onsemi	TELECOM CIRCUIT	OTHER	NO LEAD	6	VQCCN	RECTANGULAR	UNSPECIFIED	YES	1					CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		QUAD	R-XQCC-N6		1 mm	1.2 mm			NOT SPECIFIED	NOT SPECIFIED	1.6 mm
TCP-3082H-QT	Onsemi	TELECOM CIRCUIT	OTHER	NO LEAD	6	VQCCN	RECTANGULAR	UNSPECIFIED	YES	1					CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		QUAD	R-XQCC-N6		1 mm	1.2 mm			NOT SPECIFIED	NOT SPECIFIED	1.6 mm
TCP-3033H-DT	Onsemi	TELECOM CIRCUIT	OTHER	BALL	8	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-30 Cel		BOTTOM	R-PBGA-B8		.611 mm	.722 mm					.879 mm
TCP-3068H-QT	Onsemi	TELECOM CIRCUIT	OTHER	NO LEAD	6	VQCCN	RECTANGULAR	UNSPECIFIED	YES	1					CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		QUAD	R-XQCC-N6		1 mm	1.2 mm			NOT SPECIFIED	NOT SPECIFIED	1.6 mm
MTK-40131	Onsemi	TELECOM CIRCUIT	OTHER	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				SMALL OUTLINE				85 Cel	-30 Cel		DUAL	R-PDSO-G28				Not Qualified
MC100SX1230FNR2	Onsemi	TELECOM CIRCUIT	OTHER	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR		5 V	-4.2/-5.46	CHIP CARRIER	LDCC28,.5SQ	Network Interfaces	1.27 mm	85 Cel	0 Cel	TIN LEAD	QUAD	S-PQCC-J28		4.57 mm	11.505 mm	Not Qualified	e0			11.505 mm
TCP-3068N-QT	Onsemi	TELECOM CIRCUIT	OTHER	NO LEAD	6	VQCCN	RECTANGULAR	UNSPECIFIED	YES	1					CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		QUAD	R-XQCC-N6		1 mm	1.2 mm					1.6 mm
LV0111CF	Onsemi	TELECOM CIRCUIT	OTHER	BALL	4	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1			2.5 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-30 Cel		BOTTOM	S-PBGA-B4		.68 mm	1.08 mm					1.08 mm
TCP-3047N-QT	Onsemi	TELECOM CIRCUIT	OTHER	NO LEAD	6	VQCCN	RECTANGULAR	UNSPECIFIED	YES	1					CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		QUAD	R-XQCC-N6		1 mm	1.2 mm					1.6 mm
TCP-4127UB-DT	Onsemi	TELECOM CIRCUIT	OTHER	BALL	4	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.42 mm	85 Cel	-30 Cel	NICKEL GOLD	BOTTOM	R-PBGA-B4	1	.345 mm	.609 mm		e4		260	.626 mm
LV2285VB	Onsemi	TELECOM CIRCUIT	OTHER	GULL WING	24	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS		3.3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.5 mm	85 Cel	-10 Cel		DUAL	R-PDSO-G24		1.5 mm	4.4 mm					6.5 mm
TCP-4182UB-DT	Onsemi	TELECOM CIRCUIT	OTHER	BALL	4	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.42 mm	85 Cel	-30 Cel	NICKEL GOLD	BOTTOM	R-PBGA-B4	1	.345 mm	.609 mm		e4		260	1.009 mm
LC898214XD-MH	Onsemi	TELECOM CIRCUIT	OTHER	BALL	8	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		2.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	70 Cel	-30 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B8	1	.33 mm	1.15 mm		e1	30	260	2.37 mm
LC898214XC-MH	Onsemi	TELECOM CIRCUIT	OTHER	BALL	8	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		2.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	70 Cel	-30 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B8	1	.45 mm	1.15 mm		e1	30	260	2.37 mm
TCP-3047N-DT	Onsemi	TELECOM CIRCUIT	OTHER	BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-30 Cel		BOTTOM	R-PBGA-B12		.611 mm	.722 mm					1.179 mm
TCP-3056H-QT	Onsemi	TELECOM CIRCUIT	OTHER	NO LEAD	6	VQCCN	RECTANGULAR	UNSPECIFIED	YES	1					CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		QUAD	R-XQCC-N6		1 mm	1.2 mm			NOT SPECIFIED	NOT SPECIFIED	1.6 mm
TCP-4127UA-DT	Onsemi	TELECOM CIRCUIT	OTHER	BALL	4	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.42 mm	85 Cel	-30 Cel	NICKEL GOLD	BOTTOM	R-PBGA-B4	1	.345 mm	.609 mm		e4		260	.862 mm
AMIS49587C5871RG	Onsemi	TELECOM CIRCUIT	OTHER	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1		.08 mA	3.3 V	3.3	CHIP CARRIER	LDCC28,.5SQ	Modems	1.27 mm	80 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-PQCC-J28	3	4.572 mm	11.506 mm	Not Qualified	e3	30	260	11.506 mm
TCP-3012H-DT	Onsemi	TELECOM CIRCUIT	OTHER	BALL	8	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-30 Cel		BOTTOM	R-PBGA-B8		.639 mm	.722 mm					.879 mm
TCP-3012H-QT	Onsemi	TELECOM CIRCUIT	OTHER	NO LEAD	6	VSON	RECTANGULAR	UNSPECIFIED	YES	1					SMALL OUTLINE, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		DUAL	R-XDSO-N6		1 mm	1.2 mm			NOT SPECIFIED	NOT SPECIFIED	1.6 mm
TCP-3027HA-QT	Onsemi	TELECOM CIRCUIT	OTHER	NO LEAD	6	VQCCN	RECTANGULAR	UNSPECIFIED	YES	1					CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		QUAD	R-XQCC-N6		1 mm	1.2 mm					1.6 mm
FIN210ACGFX	Onsemi	TELECOM CIRCUIT	OTHER	BALL	42	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	70 Cel	-30 Cel		BOTTOM	R-PBGA-B42		1 mm	3.5 mm					4.5 mm
TCP-3027H-DT	Onsemi	TELECOM CIRCUIT	OTHER	BALL	8	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-30 Cel		BOTTOM	R-PBGA-B8		.611 mm	.722 mm					.879 mm
TCP-3047H-DT	Onsemi	TELECOM CIRCUIT	OTHER	BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-30 Cel		BOTTOM	R-PBGA-B12		.611 mm	.722 mm					1.179 mm
TCP-4139UB-DT	Onsemi	TELECOM CIRCUIT	OTHER	BALL	4	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.42 mm	85 Cel	-30 Cel	NICKEL GOLD	BOTTOM	R-PBGA-B4	1	.345 mm	.609 mm		e4		260	.862 mm
TCP-3082H-DT	Onsemi	TELECOM CIRCUIT	OTHER	BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-30 Cel		BOTTOM	R-PBGA-B12		.611 mm	.722 mm					1.179 mm
AMIS49587C5871G	Onsemi	TELECOM CIRCUIT	OTHER	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1		.08 mA	3.3 V	3.3	CHIP CARRIER	LDCC28,.5SQ	Modems	1.27 mm	80 Cel	-40 Cel	TIN	QUAD	S-PQCC-J28	3	4.572 mm	11.506 mm	Not Qualified	e3	30	260	11.506 mm
AMIS49587C5872RG	Onsemi	TELECOM CIRCUIT	OTHER	NO LEAD	52	HVQCCN	SQUARE	UNSPECIFIED	YES	1		.08 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC52,.31SQ,20	Modems	.5 mm	80 Cel	-40 Cel		QUAD	S-XQCC-N52		1 mm	8 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	8 mm
AMIS49587C5872G	Onsemi	TELECOM CIRCUIT	OTHER	NO LEAD	52	HVQCCN	SQUARE	UNSPECIFIED	YES	1		.08 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC52,.31SQ,20	Modems	.5 mm	80 Cel	-40 Cel		QUAD	S-XQCC-N52		1 mm	8 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	8 mm
TCP-3056N-QT	Onsemi	TELECOM CIRCUIT	OTHER	NO LEAD	6	VQCCN	RECTANGULAR	UNSPECIFIED	YES	1					CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		QUAD	R-XQCC-N6		1 mm	1.2 mm					1.6 mm
LC72725KV	Onsemi	TELECOM CIRCUIT	OTHER	GULL WING	16	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	70 Cel	-20 Cel		DUAL	R-PDSO-G16		1.5 mm	4.4 mm					5.2 mm
TCP-3039N-DT	Onsemi	TELECOM CIRCUIT	OTHER	BALL	10	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-30 Cel		BOTTOM	R-PBGA-B10		.611 mm	.722 mm					1.029 mm
TCP-3033N-DT	Onsemi	TELECOM CIRCUIT	OTHER	BALL	10	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-30 Cel		BOTTOM	R-PBGA-B10		.611 mm	.722 mm					1.029 mm
FIN212ACGFX	Onsemi	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	70 Cel	-30 Cel		QUAD	S-XQCC-N32		.8 mm	5 mm					5 mm
TCP-3082N-QT	Onsemi	TELECOM CIRCUIT	OTHER	NO LEAD	6	VQCCN	RECTANGULAR	UNSPECIFIED	YES	1					CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		QUAD	R-XQCC-N6		1 mm	1.2 mm					1.6 mm
TCP-4147UB-DT	Onsemi	TELECOM CIRCUIT	OTHER	BALL	4	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.42 mm	85 Cel	-30 Cel	NICKEL GOLD	BOTTOM	R-PBGA-B4	1	.345 mm	.609 mm		e4		260	.964 mm
TCP-3027N-DT	Onsemi	TELECOM CIRCUIT	OTHER	BALL	8	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-30 Cel		BOTTOM	R-PBGA-B8		.611 mm	.722 mm					.879 mm
TCP-4168UB-DT	Onsemi	TELECOM CIRCUIT	OTHER	BALL	4	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.42 mm	85 Cel	-30 Cel	NICKEL GOLD	BOTTOM	R-PBGA-B4	1	.345 mm	.609 mm		e4		260	1.009 mm
TCP-3039H-QT	Onsemi	TELECOM CIRCUIT	OTHER	NO LEAD	6	VQCCN	RECTANGULAR	UNSPECIFIED	YES	1					CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		QUAD	R-XQCC-N6		1 mm	1.2 mm			NOT SPECIFIED	NOT SPECIFIED	1.6 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.