OTHER Other Function Telecom Interface ICs 989

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

AFEM-S102-TR1G

Broadcom

TELECOM CIRCUIT

OTHER

NO LEAD

13

VQCCN

SQUARE

UNSPECIFIED

YES

1

CHIP CARRIER, VERY THIN PROFILE

.5 mm

85 Cel

-30 Cel

QUAD

S-XQCC-N13

.65 mm

2.2 mm

Not Qualified

2.2 mm

L64767WE

Broadcom

OTHER

GULL WING

100

QFP

RECTANGULAR

PLASTIC/EPOXY

YES

5 V

5

FLATPACK

QFP100,.7X.9

Other Telecom ICs

.635 mm

85 Cel

0 Cel

Tin/Lead (Sn/Pb)

QUAD

R-PQFP-G100

Not Qualified

e0

DRT1-3813

Broadcom

TELECOM CIRCUIT

OTHER

PIN/PEG

12

RECTANGULAR

UNSPECIFIED

NO

1

BIPOLAR

-5 V

5 V

MICROELECTRONIC ASSEMBLY

70 Cel

-30 Cel

SINGLE

R-XSMA-P12

Not Qualified

BCM4330XB2KFFBG

Broadcom

TELECOM CIRCUIT

OTHER

BALL

144

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

1.2 V

3.6

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA144,12X12,20

Other Telecom ICs

.5 mm

85 Cel

-30 Cel

BOTTOM

S-PBGA-B144

1 mm

6.5 mm

Not Qualified

6.5 mm

HDMP-100K

Broadcom

TELECOM CIRCUIT

OTHER

FLAT

68

QFF

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

1

BIPOLAR

-5 V

FLATPACK

1.27 mm

85 Cel

0 Cel

QUAD

S-CQFP-F68

3.683 mm

24.13 mm

Not Qualified

24.13 mm

HDMP-1000

Broadcom

TELECOM CIRCUIT

OTHER

FLAT

68

QFF

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

1

BIPOLAR

-5 V

FLATPACK

1.27 mm

85 Cel

0 Cel

QUAD

S-CQFP-F68

3.683 mm

24.13 mm

Not Qualified

24.13 mm

ACPM-5017-BLK

Broadcom

TELECOM CIRCUIT

OTHER

BUTT

10

BCC

SQUARE

UNSPECIFIED

YES

1

BIPOLAR

3.4 V

CHIP CARRIER

.6 mm

90 Cel

-20 Cel

BOTTOM

S-XBCC-B10

3

1 mm

3 mm

260

3 mm

HDMP-1514

Broadcom

TELECOM CIRCUIT

OTHER

GULL WING

80

QFP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

5 V

FLATPACK

.8 mm

85 Cel

0 Cel

QUAD

R-PQFP-G80

3.2 mm

14 mm

Not Qualified

20 mm

ACPM-5001-BLK

Broadcom

TELECOM CIRCUIT

OTHER

NO LEAD

10

HTSON

SQUARE

PLASTIC/EPOXY

YES

1

BIPOLAR

3.4 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

.6 mm

85 Cel

-30 Cel

DUAL

S-PDSO-N10

3

3 mm

Not Qualified

260

3 mm

BCM4330FB2KFFBG

Broadcom

TELECOM CIRCUIT

OTHER

BALL

144

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

1.2 V

3.6

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA144,12X12,20

Other Telecom ICs

.5 mm

85 Cel

-30 Cel

BOTTOM

S-PBGA-B144

1 mm

6.5 mm

Not Qualified

6.5 mm

HDMP-1004

Broadcom

TELECOM CIRCUIT

OTHER

FLAT

68

QFF

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

1

BIPOLAR

-5 V

FLATPACK

1.27 mm

85 Cel

0 Cel

QUAD

S-CQFP-F68

3.683 mm

24.13 mm

Not Qualified

24.13 mm

BCM4330HB2KUBG

Broadcom

TELECOM CIRCUIT

OTHER

BALL

133

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

1.2 V

3.6

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA133,12X12,16

Other Telecom ICs

.4 mm

85 Cel

-30 Cel

BOTTOM

R-PBGA-B133

.55 mm

4.89 mm

Not Qualified

5.33 mm

DRT1-2322

Broadcom

TELECOM CIRCUIT

OTHER

PIN/PEG

12

RECTANGULAR

UNSPECIFIED

NO

1

BIPOLAR

-5 V

5 V

MICROELECTRONIC ASSEMBLY

70 Cel

-30 Cel

SINGLE

R-XSMA-P12

Not Qualified

HDMP-1685A

Broadcom

TELECOM CIRCUIT

OTHER

BALL

208

LBGA

SQUARE

PLASTIC/EPOXY

YES

1

BIPOLAR

3.3 V

3.3

GRID ARRAY, LOW PROFILE

BGA208,17X17,50

Other Telecom ICs

1.27 mm

85 Cel

0 Cel

BOTTOM

S-PBGA-B208

1.65 mm

23 mm

Not Qualified

23 mm

DRT1-3823

Broadcom

TELECOM CIRCUIT

OTHER

PIN/PEG

12

RECTANGULAR

UNSPECIFIED

NO

1

BIPOLAR

-5 V

5 V

MICROELECTRONIC ASSEMBLY

70 Cel

-30 Cel

SINGLE

R-XSMA-P12

Not Qualified

DRT1-2321

Broadcom

TELECOM CIRCUIT

OTHER

PIN/PEG

12

RECTANGULAR

UNSPECIFIED

NO

1

BIPOLAR

-5 V

5 V

MICROELECTRONIC ASSEMBLY

70 Cel

-30 Cel

SINGLE

R-XSMA-P12

Not Qualified

HDMP-2630B

Broadcom

TELECOM CIRCUIT

OTHER

GULL WING

64

QFP

SQUARE

PLASTIC/EPOXY

YES

1

BIPOLAR

3.3 V

FLATPACK

.8 mm

85 Cel

0 Cel

QUAD

S-PQFP-G64

2.35 mm

13.8 mm

Not Qualified

13.8 mm

HDMP-1024

Broadcom

TELECOM CIRCUIT

OTHER

GULL WING

80

HQFP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

FLATPACK, HEAT SINK/SLUG

.8 mm

85 Cel

0 Cel

QUAD

R-PQFP-G80

3.4 mm

13.79 mm

Not Qualified

19.79 mm

KA8501AN

Samsung

OTHER

THROUGH-HOLE

16

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

BIPOLAR

8 mA

3.9/12.2,2.5

IN-LINE

DIP16,.3

Other Telecom ICs

2.54 mm

70 Cel

-45 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDIP-T16

Not Qualified

e0

KA8500AN

Samsung

OTHER

THROUGH-HOLE

16

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

BIPOLAR

IN-LINE

DIP16,.3

Other Telecom ICs

2.54 mm

70 Cel

-45 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDIP-T16

Not Qualified

e0

KA8502BN

Samsung

OTHER

THROUGH-HOLE

16

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

BIPOLAR

IN-LINE

DIP16,.3

Other Telecom ICs

2.54 mm

70 Cel

-45 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDIP-T16

Not Qualified

e0

KA8511

Samsung

OTHER

THROUGH-HOLE

64

SDIP

RECTANGULAR

PLASTIC/EPOXY

NO

2/6

IN-LINE, SHRINK PITCH

SDIP64,.75

Other Telecom ICs

1.78 mm

70 Cel

-25 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDIP-T64

Not Qualified

e0

KA8501BN

Samsung

OTHER

THROUGH-HOLE

16

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

BIPOLAR

8 mA

3.9/12.2,2.5

IN-LINE

DIP16,.3

Other Telecom ICs

2.54 mm

70 Cel

-45 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDIP-T16

Not Qualified

e0

KA8502AN

Samsung

OTHER

THROUGH-HOLE

16

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

BIPOLAR

IN-LINE

DIP16,.3

Other Telecom ICs

2.54 mm

70 Cel

-45 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDIP-T16

Not Qualified

e0

KT8555N

Samsung

OTHER

THROUGH-HOLE

20

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

CMOS

1.5 mA

5 V

5

IN-LINE

DIP20,.3

Other Telecom ICs

2.54 mm

125 Cel

-20 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDIP-T20

Not Qualified

e0

S1M8660AX01-F0T0

Samsung

TELECOM CIRCUIT

OTHER

BUTT

48

BCC

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

1

BICMOS

3.3 V

3.3

CHIP CARRIER

LCC48,.27SQ,20

Other Telecom ICs

.5 mm

85 Cel

-30 Cel

BOTTOM

S-CBCC-B48

7 mm

Not Qualified

7 mm

KA8500BN

Samsung

OTHER

THROUGH-HOLE

16

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

BIPOLAR

IN-LINE

DIP16,.3

Other Telecom ICs

2.54 mm

70 Cel

-45 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDIP-T16

Not Qualified

e0

KA8510

Samsung

OTHER

THROUGH-HOLE

64

SDIP

RECTANGULAR

PLASTIC/EPOXY

NO

2/6

IN-LINE, SHRINK PITCH

SDIP64,.75

Other Telecom ICs

1.78 mm

70 Cel

-25 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDIP-T64

Not Qualified

e0

KA8503N

Samsung

OTHER

THROUGH-HOLE

18

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

3.7/13

IN-LINE

DIP18,.3

Other Telecom ICs

2.54 mm

70 Cel

-40 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDIP-T18

Not Qualified

e0

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.