OTHER Other Function Telecom Interface ICs 989

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
CYW43438KUBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	63	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	70 Cel	-30 Cel		BOTTOM		R-PBGA-B63		.55 mm	2.87 mm						4.87 mm
CYBLE-013030-00	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	31		RECTANGULAR	UNSPECIFIED	YES	1					MICROELECTRONIC ASSEMBLY			1.27 mm	85 Cel	-30 Cel		UNSPECIFIED		R-XXMA-N31	3	2.25 mm	14.52 mm						19.2 mm
CYW20710A1KUFBXG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	42	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		1.22 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-30 Cel		BOTTOM		R-PBGA-B42		.6 mm	4 mm						4.5 mm
CYW20704UA2KFFB1G	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	49	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-30 Cel		BOTTOM		R-PBGA-B49		1 mm	4 mm						4.5 mm
CYW43455XKUBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	140	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM		R-PBGA-B140		.6 mm	4.47 mm						5.27 mm
CYW4334WKWBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	208	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-30 Cel		BOTTOM		R-PBGA-B208		.33 mm	4.08 mm						4.48 mm
CYW20702B0KWFBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	50	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		1.22 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-30 Cel		BOTTOM		R-PBGA-B50		.8 mm	4 mm						4.5 mm
CYW4356XKUBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	192	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM		R-PBGA-B192		.55 mm	4.87 mm						7.67 mm
CYW4354XKUBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	192	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM		R-PBGA-B192		.55 mm	4.87 mm						7.67 mm
CYW4343W1KUBGT	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	74	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	70 Cel	-30 Cel		BOTTOM		R-PBGA-B74		.55 mm	2.87 mm						4.87 mm
CYW20732A0KML2G	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		QUAD		S-XQCC-N32		1 mm	5 mm						5 mm
CYW20702A1KWFBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	50	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		1.22 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-30 Cel		BOTTOM		R-PBGA-B50		.8 mm	4 mm						4.5 mm
CYBT-423054-02	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	28	XMA	SQUARE	UNSPECIFIED	YES	1			3 V		MICROELECTRONIC ASSEMBLY			.91 mm	85 Cel	-30 Cel		UNSPECIFIED	3 Mbps	S-XXMA-N28	3	1.7 mm	11 mm		SEATED HGT-NOM				11 mm
CYW4343SKUBGT	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	74	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	70 Cel	-30 Cel		BOTTOM		R-PBGA-B74		.55 mm	2.87 mm						4.87 mm
CYW20705A1KWFBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	50	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		1.22 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-30 Cel		BOTTOM		R-PBGA-B50		.8 mm	4 mm						4.5 mm
CYW4343WKWBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	153	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH				70 Cel	-30 Cel		BOTTOM		R-PBGA-B153		.33 mm	2.87 mm						4.87 mm
CYW43364KUBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	74	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	70 Cel	-30 Cel		BOTTOM		R-PBGA-B74		.55 mm	2.87 mm						4.87 mm
CYW20715A1KUBXG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	42	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		1.22 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM		R-PBGA-B42		.6 mm	2.509 mm						3.019 mm
CYW4339XKUBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	145	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM		R-PBGA-B145		.55 mm	4.87 mm						5.413 mm
CYBLE-013025-00	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	31		RECTANGULAR	UNSPECIFIED	YES	1					MICROELECTRONIC ASSEMBLY			1.27 mm	85 Cel	-30 Cel		UNSPECIFIED		R-XXMA-N31	3	2.25 mm	14.52 mm						19.2 mm
CYW43340HKUBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	141	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM		R-PBGA-B141		.55 mm	4.47 mm						5.67 mm
CYW4343W1KUBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	74	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	70 Cel	-30 Cel		BOTTOM		R-PBGA-B74		.55 mm	2.87 mm						4.87 mm
CYBT-423060-02	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	28	XMA	SQUARE	UNSPECIFIED	YES	1			3 V		MICROELECTRONIC ASSEMBLY			.91 mm	85 Cel	-30 Cel		UNSPECIFIED	3 Mbps	S-XXMA-N28	3	1.7 mm	11 mm		SEATED HGT-NOM				11 mm
CYW20710A1KUBXG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	50	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		1.22 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM		R-PBGA-B50		.6 mm	2.509 mm						3.019 mm
IP4365CX11/P	Nexperia	TELECOM CIRCUIT	OTHER	BALL	11	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-35 Cel		BOTTOM		R-PBGA-B11		.65 mm	1.16 mm						1.56 mm
CS5519AJI3FNTR-G1	Diodes Incorporated	TELECOM CIRCUIT	OTHER	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	1					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	80 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N68	3	.8 mm	8 mm			e3	30	260	8 mm
CS5519CJI3FN-G1	Diodes Incorporated	TELECOM CIRCUIT	OTHER	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	80 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N56	3	.8 mm	7 mm			e3	30	260	7 mm
CS5519CJI3FNTR-G1	Diodes Incorporated	TELECOM CIRCUIT	OTHER	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	80 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N56	3	.8 mm	7 mm			e3	30	260	7 mm
CS5519AJI3FN-G1	Diodes Incorporated	TELECOM CIRCUIT	OTHER	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	1					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	80 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N68	3	.8 mm	8 mm			e3	30	260	8 mm
MAX3953UGK-T	Maxim Integrated	TELECOM CIRCUIT	OTHER	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BIPOLAR	.58 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.45SQ,20	ATM/SONET/SDH ICs	.5 mm	85 Cel	0 Cel	TIN LEAD	QUAD		S-XQCC-N68		.9 mm	10 mm	Not Qualified		e0			10 mm
MAX3953UGK-D	Maxim Integrated	TELECOM CIRCUIT	OTHER	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BIPOLAR		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	0 Cel	TIN LEAD	QUAD		S-XQCC-N68	3	.9 mm	10 mm	Not Qualified		e0			10 mm
MAX3971AU/D	Maxim Integrated	TELECOM CIRCUIT	OTHER	NO LEAD	20	DIE	RECTANGULAR	UNSPECIFIED	YES	1	BIPOLAR		3.3 V		UNCASED CHIP				85 Cel	0 Cel	TIN LEAD	UPPER		R-XUUC-N20				Not Qualified		e0
MAX66100E-000AA+	Maxim Integrated	TELECOM CIRCUIT	OTHER	UNSPECIFIED			UNSPECIFIED	UNSPECIFIED	NO	1					SPECIAL SHAPE				50 Cel	-25 Cel		UNSPECIFIED		X-XXSS-X				Not Qualified			NOT SPECIFIED	NOT SPECIFIED
MAX3953UGK-TD	Maxim Integrated	TELECOM CIRCUIT	OTHER	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BIPOLAR		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	0 Cel		QUAD		S-XQCC-N68	1	.9 mm	10 mm	Not Qualified					10 mm
MAX3971AUTP+T	Maxim Integrated	TELECOM CIRCUIT	OTHER	NO LEAD	20	VQCCN	SQUARE	UNSPECIFIED	YES	1	BIPOLAR	.085 mA	3.3 V	3.3	CHIP CARRIER, VERY THIN PROFILE	LCC20,.16SQ,20	ATM/SONET/SDH ICs	.5 mm	85 Cel	0 Cel	MATTE TIN	QUAD		S-XQCC-N20	1	.8 mm	4 mm	Not Qualified		e3	30	255	4 mm
MAX3970U/D-T	Maxim Integrated	TELECOM CIRCUIT	OTHER	NO LEAD	18	DIE	RECTANGULAR	UNSPECIFIED	YES	1	BIPOLAR		3.3 V		UNCASED CHIP				85 Cel	0 Cel	TIN LEAD	UPPER		R-XUUC-N18				Not Qualified		e0
MAX3274UGE-T	Maxim Integrated	TELECOM CIRCUIT	OTHER	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BIPOLAR		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	0 Cel	TIN LEAD	QUAD		S-XQCC-N16	1	1 mm	4 mm	Not Qualified		e0			4 mm
MAX3277U/D	Maxim Integrated	TELECOM CIRCUIT	OTHER	NO LEAD	9	DIE	RECTANGULAR	UNSPECIFIED	YES	1	BIPOLAR	.041 mA	3.3 V	3.3	UNCASED CHIP	DIE OR CHIP	Other Telecom ICs		85 Cel	0 Cel	TIN LEAD	UPPER		R-XUUC-N9				Not Qualified		e0
MAX3971UGP	Maxim Integrated	TELECOM CIRCUIT	OTHER	NO LEAD	20	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR		3.3 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	0 Cel	TIN LEAD	QUAD		S-PQCC-N20	1	1 mm	4 mm	Not Qualified		e0			4 mm
MAX3983UGK-TD	Maxim Integrated	TELECOM CIRCUIT	OTHER	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BIPOLAR	.58 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.4SQ,20	Other Telecom ICs	.5 mm	85 Cel	0 Cel		QUAD		S-XQCC-N68	1	.9 mm	10 mm	Not Qualified					10 mm
MAX66120K-000AA+	Maxim Integrated	TELECOM CIRCUIT	OTHER	UNSPECIFIED			UNSPECIFIED	UNSPECIFIED	NO	1					SPECIAL SHAPE				50 Cel	-25 Cel		UNSPECIFIED		X-XXSS-X				Not Qualified			NOT SPECIFIED	NOT SPECIFIED
MAX3971AUTP	Maxim Integrated	TELECOM CIRCUIT	OTHER	NO LEAD	20	VQCCN	SQUARE	UNSPECIFIED	YES	1	BIPOLAR		3.3 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	0 Cel	TIN LEAD	QUAD		S-XQCC-N20	1	.8 mm	4 mm	Not Qualified		e0		245	4 mm
MAX3953UGK	Maxim Integrated	TELECOM CIRCUIT	OTHER	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BIPOLAR	.58 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.45SQ,20	ATM/SONET/SDH ICs	.5 mm	85 Cel	0 Cel	TIN LEAD	QUAD		S-XQCC-N68	3	.9 mm	10 mm	Not Qualified		e0			10 mm
MAX3970U/D	Maxim Integrated	TELECOM CIRCUIT	OTHER	NO LEAD	18	DIE	RECTANGULAR	UNSPECIFIED	YES	1	BIPOLAR	.062 mA	3.3 V	3.3	UNCASED CHIP	DIE OR CHIP	Other Telecom ICs		85 Cel	0 Cel	TIN LEAD	UPPER		R-XUUC-N18				Not Qualified		e0
MAX3971AU/D-T	Maxim Integrated	TELECOM CIRCUIT	OTHER	NO LEAD	20	DIE	RECTANGULAR	UNSPECIFIED	YES	1	BIPOLAR		3.3 V		UNCASED CHIP				85 Cel	0 Cel	TIN LEAD	UPPER		R-XUUC-N20				Not Qualified		e0
MAX3971AUGP-T	Maxim Integrated	TELECOM CIRCUIT	OTHER	NO LEAD	20	VQCCN	SQUARE	UNSPECIFIED	YES	1	BIPOLAR	.085 mA	3.3 V	3.3	CHIP CARRIER, VERY THIN PROFILE	LCC20,.16SQ,20	ATM/SONET/SDH ICs	.5 mm	85 Cel	0 Cel	TIN LEAD	QUAD		S-XQCC-N20	1	1 mm	4 mm	Not Qualified		e0			4 mm
MAX3274UGE	Maxim Integrated	TELECOM CIRCUIT	OTHER	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BIPOLAR	.099 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.16SQ,25	ATM/SONET/SDH ICs	.65 mm	85 Cel	0 Cel	TIN LEAD	QUAD		S-XQCC-N16	1	1 mm	4 mm	Not Qualified		e0			4 mm
MAX3910U/D	Maxim Integrated	TELECOM CIRCUIT	OTHER	NO LEAD	33	DIE	SQUARE	UNSPECIFIED	YES	1	BIPOLAR		5 V		UNCASED CHIP				85 Cel	0 Cel	TIN LEAD	UPPER		S-XUUC-N33	3			Not Qualified		e0

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.