OTHER Other Function Telecom Interface ICs 989

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
BGS13BN14	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	14	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		3.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-30 Cel	MATTE TIN	QUAD	S-XQCC-N14		.77 mm	1.6 mm		e3			1.6 mm
BGS18MN14E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	14	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel	TIN	QUAD	S-PQCC-N14	1	.77 mm	2 mm		e3			2 mm
TDA5100XT	Infineon Technologies	TELECOM CIRCUIT	OTHER	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-25 Cel		DUAL	R-PDSO-G16		1.2 mm	4.4 mm			NOT SPECIFIED	NOT SPECIFIED	5 mm
TDA5103AHTMA2	Infineon Technologies		OTHER	GULL WING	10	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES		BIPOLAR	9.5 mA	3 V	3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20	Other Telecom ICs	.5 mm	85 Cel	-25 Cel		DUAL	R-PDSO-G10				Not Qualified
TDA5100	Infineon Technologies	TELECOM CIRCUIT	OTHER	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	.008 mA	3 V	3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	Other Telecom ICs	.65 mm	85 Cel	-25 Cel	TIN	DUAL	R-PDSO-G16	3	1.2 mm	4.4 mm	Not Qualified	e3		260	5 mm
TDA5101	Infineon Technologies	TELECOM CIRCUIT	OTHER	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		3 V	3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	Other Telecom ICs	.65 mm	85 Cel	-25 Cel		DUAL	R-PDSO-G16	3	1.2 mm	4.4 mm	Not Qualified			260	5 mm
BGS14GA14	Infineon Technologies	TELECOM CIRCUIT	OTHER	BUTT	14		SQUARE	UNSPECIFIED	YES	1			3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-30 Cel		QUAD	S-XQMA-B14	1	.65 mm	2 mm					2 mm
BGS12PN10	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	10	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	1			2.85 V		SMALL OUTLINE, VERY THIN PROFILE			.4 mm	85 Cel	-30 Cel		DUAL	R-PDSO-N10	1	.4 mm	1.1 mm					1.5 mm
BGS12AL7-6	Infineon Technologies	TELECOM CIRCUIT	OTHER	BUTT	6	BCC	RECTANGULAR	UNSPECIFIED	YES	1			2.8 V		CHIP CARRIER			.48 mm	85 Cel	-30 Cel		BOTTOM	R-XBCC-B6	1	.4 mm	1.4 mm					1.26 mm
TDA5103AHTMA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR	.0095 mA	3 V	3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20	Other Telecom ICs	.5 mm	85 Cel	-25 Cel	TIN	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified	e3			3 mm
TDA5103AXT	Infineon Technologies	TELECOM CIRCUIT	OTHER	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	85 Cel	-25 Cel		DUAL	S-PDSO-G10		1.1 mm	3 mm			NOT SPECIFIED	NOT SPECIFIED	3 mm
BGS16GA14	Infineon Technologies	TELECOM CIRCUIT	OTHER	BUTT	14	BCC	SQUARE	UNSPECIFIED	YES	1			3 V		CHIP CARRIER			.4 mm	85 Cel	-30 Cel		BOTTOM	S-XBCC-B14	1	.65 mm	2 mm					2 mm
BGS18MN14	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	14	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel	Tin (Sn)	QUAD	S-PQCC-N14	1	.77 mm	2 mm		e3	NOT SPECIFIED	NOT SPECIFIED	2 mm
BGS15M2A12E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	BUTT	12	BCC	RECTANGULAR	UNSPECIFIED	YES	1	MOS				CHIP CARRIER			.4 mm	85 Cel	-30 Cel		BOTTOM	R-XBCC-B12	1	.65 mm	1.1 mm					1.9 mm
TDA5103A	Infineon Technologies	TELECOM CIRCUIT	OTHER	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR	.0095 mA	3 V	3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20	Other Telecom ICs	.5 mm	85 Cel	-25 Cel	TIN	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified	e3		260	3 mm
BGS16MN14	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	14	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		QUAD	S-PQCC-N14	1	.77 mm	2 mm					2 mm
TDA7100XT	Infineon Technologies	TELECOM CIRCUIT	OTHER	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	70 Cel	-20 Cel		DUAL	S-PDSO-G10		1.1 mm	3 mm			NOT SPECIFIED	NOT SPECIFIED	3 mm
BGS15M2A12	Infineon Technologies	TELECOM CIRCUIT	OTHER	BUTT	12	BCC	RECTANGULAR	UNSPECIFIED	YES	1	MOS				CHIP CARRIER			.4 mm	85 Cel	-30 Cel		BOTTOM	R-XBCC-B12	1	.65 mm	1.1 mm					1.9 mm
TDA5110	Infineon Technologies	TELECOM CIRCUIT	OTHER	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		3 V	3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	Other Telecom ICs	.65 mm	85 Cel	-25 Cel		DUAL	R-PDSO-G16		1.2 mm	4.4 mm	Not Qualified				5 mm
BGS13SL9E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	BUTT	9	BCC	SQUARE	UNSPECIFIED	YES	1			3 V		CHIP CARRIER			.4 mm	85 Cel	-30 Cel		BOTTOM	S-XBCC-B9		.32 mm	1.15 mm					1.15 mm
TDA5100XUMA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-25 Cel		DUAL	R-PDSO-G16	3	1.2 mm	4.4 mm	Not Qualified				5 mm
BGS14BN14	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	14	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		3.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-30 Cel	MATTE TIN	QUAD	S-XQCC-N14		.77 mm	1.6 mm		e3			1.6 mm
TDA7200XT	Infineon Technologies	TELECOM CIRCUIT	OTHER	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	70 Cel	-20 Cel		DUAL	R-PDSO-G28		1.2 mm	4.4 mm	Not Qualified				9.7 mm
BGS17GA14	Infineon Technologies	TELECOM CIRCUIT	OTHER	BUTT	14		SQUARE	UNSPECIFIED	YES	1			3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-30 Cel		QUAD	S-XQMA-B14	1	.65 mm	2 mm					2 mm
BGS12AL76E6327XTMA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	BUTT	6	BCC	RECTANGULAR	UNSPECIFIED	YES	1			2.8 V		CHIP CARRIER			.48 mm	85 Cel	-30 Cel	GOLD	BOTTOM	R-XBCC-B6	1	.4 mm	1.4 mm		e4			1.26 mm
BGS15MA12E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	12	HVQCCN	RECTANGULAR	UNSPECIFIED	YES	1	CMOS		2.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-30 Cel		QUAD	R-XQCC-N12	1	.65 mm	1.1 mm					1.9 mm
BGS12AL7-4	Infineon Technologies	TELECOM CIRCUIT	OTHER	BUTT	6	BCC	RECTANGULAR	UNSPECIFIED	YES	1			2.8 V		CHIP CARRIER			.55 mm	85 Cel	-30 Cel		BOTTOM	R-XBCC-B6	1	.5 mm	1.5 mm					2.3 mm
BGS15MA12	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	12	HVQCCN	RECTANGULAR	UNSPECIFIED	YES	1	CMOS		2.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-30 Cel		QUAD	R-XQCC-N12	1	.65 mm	1.1 mm					1.9 mm
TDA7100	Infineon Technologies	TELECOM CIRCUIT	OTHER	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR	.0046 mA	3 V	3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20	Other Telecom ICs	.5 mm	70 Cel	-20 Cel	MATTE TIN	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified	e3		260	3 mm
TDA5102	Infineon Technologies	TELECOM CIRCUIT	OTHER	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	.0095 mA	3 V	2.1/4	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	Other Telecom ICs	.65 mm	85 Cel	-25 Cel		DUAL	R-PDSO-G16	3	1.2 mm	4.4 mm	Not Qualified			260	5 mm
CYW4356XKUBGT	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	192	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM	R-PBGA-B192	1	.55 mm	4.87 mm					7.67 mm
CYW4339XKWBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	286	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-30 Cel		BOTTOM	R-PBGA-B286		.41 mm	4.87 mm					5.413 mm
CYW4343SKUBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	74	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	70 Cel	-30 Cel		BOTTOM	R-PBGA-B74		.55 mm	2.87 mm					4.87 mm
CYW43362SKUBGT	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	69	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B69	1	.55 mm	2.92 mm		e1			4.52 mm
CYW43362KUBGT	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	69	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B69	1	.55 mm	2.92 mm		e1			4.52 mm
CYW4339NKFFBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	160	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1			1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM	S-PBGA-B160		1 mm	8 mm					8 mm
CYW43362KUBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	69	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM	R-PBGA-B69		.55 mm	2.92 mm					4.52 mm
CYW20707UA2KFFB4G	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	49	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		1.2 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-30 Cel		BOTTOM	R-PBGA-B49		1.05 mm	4 mm					4.5 mm
CYW43362SKUBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	69	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM	R-PBGA-B69		.55 mm	2.92 mm					4.52 mm
CYW4343WKUBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	74	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	70 Cel	-30 Cel		BOTTOM	R-PBGA-B74		.55 mm	2.87 mm					4.87 mm
CYW20707UA2EKUBGT	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	36	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM	R-PBGA-B36		.55 mm	2.51 mm					2.77 mm
CYW4354XKWBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	395	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-30 Cel		BOTTOM	R-PBGA-B395		.33 mm	4.87 mm					7.67 mm
CYW20705B0KWFBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	50	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		1.22 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-30 Cel		BOTTOM	R-PBGA-B50		.8 mm	4 mm					4.5 mm
CYW20719B1KUMLG	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-30 Cel	PURE TIN	QUAD	S-XQCC-N40	3	.6 mm	5 mm			30	260	5 mm
CYW43340XKUBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	141	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM	R-PBGA-B141		.55 mm	4.47 mm					5.67 mm
CYW4343WKWBGT	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	153	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH				70 Cel	-30 Cel		BOTTOM	R-PBGA-B153		.33 mm	2.87 mm					4.87 mm
CYW20706UA1KFFB4G	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	49	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		1.2 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-30 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B49	3	1.05 mm	4 mm		e1		260	4.5 mm
CYW4354ZKUBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	192	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM	R-PBGA-B192		.55 mm	4.87 mm					7.67 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.