OTHER Other Function Telecom Interface ICs 989

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
BCM43241ZKFFBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	208	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.2 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM	R-PBGA-B208		1.05 mm	7 mm					9 mm
BCM4343WKUBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	74	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1			1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	70 Cel	-30 Cel		BOTTOM	S-PBGA-B74		.55 mm	2.87 mm					4.87 mm
BCM20710A1KUFBXG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	50	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		1.22 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-30 Cel		BOTTOM	R-PBGA-B50		.6 mm	4 mm					4.5 mm
BCM4325GKFBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	196	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1			1.25 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-30 Cel		BOTTOM	S-PBGA-B196		1.05 mm	7.5 mm					7.5 mm
BCM4329EKUBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	182	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			2.7 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM	R-PBGA-B182		.55 mm	5.62 mm					6.57 mm
BCM4354XKUBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	192	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM	R-PBGA-B192		.55 mm	4.87 mm					7.67 mm
BCM4325FKFBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	196	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1			1.25 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-30 Cel		BOTTOM	S-PBGA-B196		1.05 mm	7.5 mm					7.5 mm
BCM43340HKUBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	141	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM	R-PBGA-B141		.55 mm	4.47 mm					5.67 mm
BCM43903KUBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	151	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM	R-PBGA-B151		.55 mm	4.91 mm					5.85 mm
BCM4330FKUBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	133	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM	R-PBGA-B133		.55 mm	4.89 mm					5.33 mm
BCM20705A1KWFBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	50	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		1.22 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-30 Cel		BOTTOM	R-PBGA-B50		.8 mm	4 mm					4.5 mm
BCM43241GKFFBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	208	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.2 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM	R-PBGA-B208		1.05 mm	7 mm					9 mm
BCM4325FKWBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	339	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.25 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-30 Cel		BOTTOM	R-PBGA-B339		.42 mm	5.81 mm					6.51 mm
BCM4339XKWBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	286	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-30 Cel		BOTTOM	R-PBGA-B286		.41 mm	4.87 mm					5.413 mm
BCM4330FKWBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	225	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-30 Cel		BOTTOM	R-PBGA-B225		.41 mm	4.89 mm					5.33 mm
MB86977PFV-G-BND	Infineon Technologies	TELECOM CIRCUIT	OTHER	GULL WING	208	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			1.8 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-20 Cel		QUAD	S-PQFP-G208		1.7 mm	28 mm					28 mm
BCM20710A1KUBXG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	42	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		1.22 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM	R-PBGA-B42		.6 mm	2.509 mm					3.019 mm
BCM4330GKUBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	133	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM	R-PBGA-B133		.55 mm	4.89 mm					5.33 mm
BCM20736A0KML2G	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		QUAD	S-XQCC-N32		1 mm	5 mm					5 mm
BCM4330XKWBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	225	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-30 Cel		BOTTOM	R-PBGA-B225		.41 mm	4.89 mm					5.33 mm
BCM4325GKWBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	339	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.25 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-30 Cel		BOTTOM	R-PBGA-B339		.42 mm	5.81 mm					6.51 mm
BCM4339NKFFBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	160	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1			1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM	S-PBGA-B160		1 mm	8 mm					8 mm
BCM4356XKWBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	395	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-30 Cel		BOTTOM	R-PBGA-B395		.33 mm	4.87 mm					7.67 mm
BCM4319SKUBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	138	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		1.225 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM	R-PBGA-B138		.55 mm	4.53 mm					5.74 mm
BCM4330XKUBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	133	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM	R-PBGA-B133		.55 mm	4.89 mm					5.33 mm
BCM4339XKUBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	145	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM	R-PBGA-B145		.55 mm	4.87 mm					5.413 mm
BCM4329HKUBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	182	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			2.7 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM	R-PBGA-B182		.55 mm	5.62 mm					6.57 mm
BCM43907KWBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	316	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-30 Cel		BOTTOM	R-PBGA-B316		.33 mm	4.907 mm					5.848 mm
BCM4334WKWBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	208	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-30 Cel		BOTTOM	R-PBGA-B208		.33 mm	4.08 mm					4.48 mm
BCM4330GKFFBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	144	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1			1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-30 Cel		BOTTOM	S-PBGA-B144		1 mm	6.5 mm					6.5 mm
BCM4334XKWBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	208	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-30 Cel		BOTTOM	R-PBGA-B208		.41 mm	4.08 mm					4.48 mm
BCM4354ZKUBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	192	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM	R-PBGA-B192		.55 mm	4.87 mm					7.67 mm
SLE95050H	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	6	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			1.55 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	110 Cel	-20 Cel		QUAD	S-PQCC-N6		.8 mm	2.5 mm					2.5 mm
BGS17GA14E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	BUTT	14		SQUARE	UNSPECIFIED	YES	1			3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-30 Cel	GOLD NICKEL	QUAD	S-XQMA-B14	1	.65 mm	2 mm		e4			2 mm
BGS16MN14E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	14	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel	Tin (Sn)	QUAD	S-PQCC-N14	1	.77 mm	2 mm		e3	NOT SPECIFIED	NOT SPECIFIED	2 mm
TDA5101A	Infineon Technologies	TELECOM CIRCUIT	OTHER	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR		3 V	3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20	Other Telecom ICs	.5 mm	85 Cel	-25 Cel	TIN LEAD	DUAL	S-PDSO-G10		1.1 mm	3 mm	Not Qualified	e0			3 mm
TDA5101XUMA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-25 Cel		DUAL	R-PDSO-G16	3	1.2 mm	4.4 mm	Not Qualified				5 mm
TDA5102XUMA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-25 Cel		DUAL	R-PDSO-G16	3	1.2 mm	4.4 mm	Not Qualified				5 mm
TDA5111	Infineon Technologies	TELECOM CIRCUIT	OTHER	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		3 V	2.1/4	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	Other Telecom ICs	.65 mm	85 Cel	-25 Cel		DUAL	R-PDSO-G16		1.2 mm	4.4 mm	Not Qualified				5 mm
BGS15BN14	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	14	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		3.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-30 Cel		QUAD	S-XQCC-N14		.77 mm	1.6 mm			NOT SPECIFIED	NOT SPECIFIED	1.6 mm
BGS14AN16	Infineon Technologies	TELECOM CIRCUIT	OTHER	BUTT	16	HVBCC	SQUARE	PLASTIC/EPOXY	YES	1			3.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		BOTTOM	S-PBCC-B16	1	.77 mm	2.3 mm					2.3 mm
BGS18GA14	Infineon Technologies	TELECOM CIRCUIT	OTHER	BUTT	14		SQUARE	UNSPECIFIED	YES	1			3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-30 Cel		QUAD	S-XQMA-B14	1	.65 mm	2 mm					2 mm
BGS17GA14E6327	Infineon Technologies	TELECOM CIRCUIT	OTHER	BUTT	14		SQUARE	UNSPECIFIED	YES	1			3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-30 Cel		QUAD	S-XQMA-B14		.65 mm	2 mm					2 mm
TDA5100A	Infineon Technologies	TELECOM CIRCUIT	OTHER	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR	.0095 mA	3 V	2.1/4	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20	Other Telecom ICs	.5 mm	85 Cel	-25 Cel	TIN LEAD	DUAL	S-PDSO-G10		1.1 mm	3 mm	Not Qualified	e0			3 mm
BGS14AN16E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	BUTT	16	HVBCC	SQUARE	PLASTIC/EPOXY	YES	1			3.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel	TIN	BOTTOM	S-PBCC-B16	1	.77 mm	2.3 mm		e3			2.3 mm
BGS15GA14	Infineon Technologies	TELECOM CIRCUIT	OTHER	BUTT	14		SQUARE	UNSPECIFIED	YES	1			3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-30 Cel		QUAD	S-XQMA-B14	1	.65 mm	2 mm					2 mm
TDA5102XT	Infineon Technologies	TELECOM CIRCUIT	OTHER	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-25 Cel		DUAL	R-PDSO-G16		1.2 mm	4.4 mm					5 mm
TDA7200	Infineon Technologies	TELECOM CIRCUIT	OTHER	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	.0077 mA	5 V	5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25	Other Telecom ICs	.65 mm	70 Cel	-20 Cel		DUAL	R-PDSO-G28	3	1.2 mm	4.4 mm	Not Qualified			260	9.7 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.