OTHER Other Function Telecom Interface ICs 989

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Nominal Negative Supply Voltage	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
ISL36111DRZ-T7	Renesas Electronics	TELECOM CIRCUIT	OTHER	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			1.2 V	1.2	CHIP CARRIER	LCC16,.12SQ,20	Other Telecom ICs	.5 mm	85 Cel	0 Cel	MATTE TIN	QUAD		S-PQCC-N16	1	1 mm	3 mm	Not Qualified	e3	30	260	3 mm
HXR8204-DNT	Renesas Electronics	TELECOM CIRCUIT	OTHER	NO LEAD		DIE	RECTANGULAR	UNSPECIFIED	YES	1					UNCASED CHIP	DIE OR CHIP			85 Cel	0 Cel	TIN	UPPER	28000 Mbps	R-XUUC-N					e3
MX0141VA0AVG8	Renesas Electronics	TELECOM CIRCUIT	OTHER	BALL	98	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			2.5 V		GRID ARRAY				85 Cel	0 Cel	TIN	BOTTOM		R-PBGA-B98	3				e3		260
HXR8212-DNT	Renesas Electronics	TELECOM CIRCUIT	OTHER	NO LEAD		DIE	RECTANGULAR	UNSPECIFIED	YES	1					UNCASED CHIP	DIE OR CHIP			85 Cel	0 Cel	TIN	UPPER	28000 Mbps	R-XUUC-N					e3
ISL36111DRZ-TS	Renesas Electronics	TELECOM CIRCUIT	OTHER	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			1.2 V	1.2	CHIP CARRIER	LCC16,.12SQ,20	Other Telecom ICs	.5 mm	85 Cel	0 Cel	MATTE TIN	QUAD		S-PQCC-N16	1	1 mm	3 mm	Not Qualified	e3	30	260	3 mm
UPC8217TU-E2	Renesas Electronics	TELECOM CIRCUIT	OTHER	NO LEAD	8	VSON	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR		3 V		SMALL OUTLINE, VERY THIN PROFILE			.5 mm	70 Cel	-30 Cel		DUAL		S-PDSO-N8		.5 mm	2 mm					2 mm
HXT8212-DNT	Renesas Electronics	TELECOM CIRCUIT	OTHER	NO LEAD		DIE	RECTANGULAR	UNSPECIFIED	YES	1					UNCASED CHIP	DIE OR CHIP			85 Cel	0 Cel	TIN	UPPER		R-XUUC-N					e3
ISL35111DRZ-TS	Renesas Electronics	TELECOM CIRCUIT	OTHER	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	0 Cel	MATTE TIN	QUAD		S-PQCC-N16	1	1 mm	3 mm	Not Qualified	e3	30	260	3 mm
UPC8215TU-E2-A	Renesas Electronics	TELECOM CIRCUIT	OTHER	NO LEAD	8	VSON	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR		3 V		SMALL OUTLINE, VERY THIN PROFILE			.5 mm	85 Cel	-25 Cel		DUAL		S-PDSO-N8		.53 mm	2 mm					2 mm
UPD77533S1-YHC	Renesas Electronics	TELECOM CIRCUIT	OTHER	BALL	108	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1	MOS		1.5 V	1.5,3/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA108,12X12,32	Other Telecom ICs	.8 mm	85 Cel	-20 Cel		BOTTOM		S-PBGA-B108		1.66 mm	11 mm	Not Qualified				11 mm
ISL35111DRZ-T7	Renesas Electronics	TELECOM CIRCUIT	OTHER	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	0 Cel	MATTE TIN	QUAD		S-PQCC-N16	1	1 mm	3 mm	Not Qualified	e3	30	260	3 mm
P9020-NTGI8	Renesas Electronics	TELECOM CIRCUIT	OTHER	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	0 Cel		QUAD		S-XQCC-N56		.8 mm	7 mm					7 mm
UPC8220T5A-E1-A	Renesas Electronics	TELECOM CIRCUIT	OTHER	GULL WING	16	HVSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		3 V		SMALL OUTLINE			.4 mm	70 Cel	-30 Cel	TIN BISMUTH	DUAL		R-PDSO-G16		.6 mm	2.3 mm	Not Qualified	e6			3.3 mm
P9020NDG8	Renesas Electronics	TELECOM CIRCUIT	OTHER	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	0 Cel		QUAD		S-XQCC-N56		.8 mm	7 mm					7 mm
GX62474-HIU	Renesas Electronics	TELECOM CIRCUIT	OTHER				RECTANGULAR	UNSPECIFIED		1									85 Cel	-5 Cel			32000 Mbps
HXT6204-DNT	Renesas Electronics	TELECOM CIRCUIT	OTHER	NO LEAD		DIE	RECTANGULAR	UNSPECIFIED	YES	1					UNCASED CHIP	DIE OR CHIP			85 Cel	0 Cel	TIN	UPPER	28000 Mbps	R-XUUC-N					e3
P9020NDG	Renesas Electronics	TELECOM CIRCUIT	OTHER	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	0 Cel		QUAD		S-XQCC-N56		.8 mm	7 mm					7 mm
ISL36411DRZ-T7	Renesas Electronics	TELECOM CIRCUIT	OTHER	NO LEAD	46	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.2 V	1.2	CHIP CARRIER	LCC46,.16X.28,16	Other Telecom ICs	.4 mm	85 Cel	0 Cel	MATTE TIN	QUAD		R-PQCC-N46	1	.75 mm	4 mm	Not Qualified	e3	30	260	7 mm
HXR6104-DNT	Renesas Electronics	TELECOM CIRCUIT	OTHER	NO LEAD		DIE	RECTANGULAR	UNSPECIFIED	YES	1					UNCASED CHIP	DIE OR CHIP			85 Cel	0 Cel	TIN	UPPER	10300 Mbps	R-XUUC-N					e3
UPD9930G-22	Renesas Electronics		OTHER	GULL WING	44	QFP	SQUARE	PLASTIC/EPOXY	YES		MOS		3 V	3	FLATPACK	QFP44,.5SQ,32	Other Telecom ICs	.8 mm	85 Cel	-30 Cel	Tin/Lead (Sn/Pb)	QUAD		S-PQFP-G44				Not Qualified	e0
P9025AC-RNBGI8	Renesas Electronics	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1			4.54 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	0 Cel	Matte Tin (Sn)	QUAD		S-XQCC-N32	1	.8 mm	5 mm		e3	NOT SPECIFIED	260	5 mm
HXR42100-DNT	Renesas Electronics	TELECOM CIRCUIT	OTHER	NO LEAD		DIE	RECTANGULAR	UNSPECIFIED	YES	1					UNCASED CHIP	DIE OR CHIP			85 Cel	0 Cel	TIN	UPPER	28000 Mbps	R-XUUC-N					e3
HXT6112-DNT	Renesas Electronics	TELECOM CIRCUIT	OTHER	NO LEAD		DIE	RECTANGULAR	UNSPECIFIED	YES	1					UNCASED CHIP	DIE OR CHIP			85 Cel	0 Cel	TIN	UPPER		R-XUUC-N					e3
HXR6112-DNT	Renesas Electronics	TELECOM CIRCUIT	OTHER	NO LEAD		DIE	RECTANGULAR	UNSPECIFIED	YES	1					UNCASED CHIP	DIE OR CHIP			85 Cel	0 Cel	TIN	UPPER	16000 Mbps	R-XUUC-N					e3
P9020-AHGI	Renesas Electronics	TELECOM CIRCUIT	OTHER	BALL	99	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	0 Cel		BOTTOM		R-PBGA-B99		.65 mm	4.65 mm					4.86 mm
AW-CU362	Renesas Electronics	TELECOM CIRCUIT	OTHER	NO LEAD	30		RECTANGULAR	UNSPECIFIED	YES	1			3.3 V		MICROELECTRONIC ASSEMBLY			1.27 mm	85 Cel	-30 Cel		UNSPECIFIED	1000 Mbps	R-XXMA-N30		2.65 mm	15 mm					19.615 mm
HSDL-7001	Broadcom	TELECOM CIRCUIT	OTHER	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE			1.27 mm	85 Cel	-20 Cel		DUAL		R-PDSO-G16	4	1.75 mm	3.9 mm	Not Qualified			255	9.9 mm
DRT1-2312	Broadcom	TELECOM CIRCUIT	OTHER	PIN/PEG	12		RECTANGULAR	UNSPECIFIED	NO	1	BIPOLAR	-5 V	5 V		MICROELECTRONIC ASSEMBLY				70 Cel	-30 Cel		SINGLE		R-XSMA-P12				Not Qualified
HSDL-7001-2500	Broadcom	TELECOM CIRCUIT	OTHER	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE			1.27 mm	85 Cel	-20 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G16		1.75 mm	3.9 mm	Not Qualified	e4			9.9 mm
HSDL-3201011	Broadcom	TELECOM CIRCUIT	OTHER	NO LEAD	8		RECTANGULAR	UNSPECIFIED	NO	1	BICMOS		3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-25 Cel		SINGLE		R-XSMA-N8				Not Qualified
HDMP-2631B	Broadcom	TELECOM CIRCUIT	OTHER	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR		3.3 V		FLATPACK			.8 mm	85 Cel	0 Cel		QUAD		S-PQFP-G64		2.35 mm	13.8 mm	Not Qualified				13.8 mm
ACPM-5001-TR1	Broadcom	TELECOM CIRCUIT	OTHER	NO LEAD	10	HTSON	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR		3.4 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.6 mm	85 Cel	-30 Cel		DUAL		S-PDSO-N10	3		3 mm	Not Qualified			260	3 mm
HFBR-0508	Broadcom	TELECOM CIRCUIT	OTHER	UNSPECIFIED			RECTANGULAR	UNSPECIFIED	NO	1			5 V		FIBER OPTIC				85 Cel	-20 Cel		UNSPECIFIED		R-XXFO-X				Not Qualified
HDMP-1512	Broadcom	TELECOM CIRCUIT	OTHER	GULL WING	80	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		5 V		FLATPACK			.8 mm	85 Cel	0 Cel		QUAD		R-PQFP-G80		3.2 mm	14 mm	Not Qualified				20 mm
DRT1-2311	Broadcom	TELECOM CIRCUIT	OTHER	PIN/PEG	12		RECTANGULAR	UNSPECIFIED	NO	1	BIPOLAR	-5 V	5 V		MICROELECTRONIC ASSEMBLY				70 Cel	-30 Cel		SINGLE		R-XSMA-P12				Not Qualified
HSDL-7001#100	Broadcom	TELECOM CIRCUIT	OTHER	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE			1.27 mm	85 Cel	-20 Cel		DUAL		R-PDSO-G16	4	1.75 mm	3.9 mm	Not Qualified			255	9.9 mm
AFEM-S106-BLKG	Broadcom	TELECOM CIRCUIT	OTHER	BUTT	14	HBCC	SQUARE	UNSPECIFIED	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG				85 Cel	-30 Cel		BOTTOM		S-XBCC-B14	3		3.2 mm				260	3.2 mm
HDMP-1687	Broadcom		OTHER	BALL	208	BGA	SQUARE	PLASTIC/EPOXY	YES		BIPOLAR		3.3 V	3.3	GRID ARRAY	BGA208,17X17,50	Other Telecom ICs	1.27 mm	85 Cel	0 Cel		BOTTOM		S-PBGA-B208				Not Qualified
ACPM-5017-TR1	Broadcom	TELECOM CIRCUIT	OTHER	BUTT	10	BCC	SQUARE	UNSPECIFIED	YES	1	BIPOLAR		3.4 V		CHIP CARRIER			.6 mm	90 Cel	-20 Cel		BOTTOM		S-XBCC-B10	3	1 mm	3 mm				260	3 mm
HSDL-3201001	Broadcom	TELECOM CIRCUIT	OTHER	NO LEAD	8		RECTANGULAR	UNSPECIFIED	NO	1	BICMOS		3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-25 Cel	COPPER	SINGLE		R-XSMA-N8				Not Qualified			255
TECO3264	Broadcom	TELECOM CIRCUIT	OTHER	GULL WING	160	QFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		FLATPACK			.65 mm	85 Cel	0 Cel	TIN LEAD	QUAD		S-PQFP-G160		4.07 mm	28 mm	Not Qualified	e0	30	225	28 mm
HDMP-1022	Broadcom	TELECOM CIRCUIT	OTHER	GULL WING	80	HQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		FLATPACK, HEAT SINK/SLUG			.8 mm	85 Cel	0 Cel		QUAD		R-PQFP-G80		3.4 mm	13.79 mm	Not Qualified				19.79 mm
BCM4330SB2KUBG	Broadcom	TELECOM CIRCUIT	OTHER	BALL	133	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.2 V	3.6	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA133,12X12,16	Other Telecom ICs	.4 mm	85 Cel	-30 Cel		BOTTOM		R-PBGA-B133		.55 mm	4.89 mm	Not Qualified				5.33 mm
AFEM-S102-BLKG	Broadcom	TELECOM CIRCUIT	OTHER	NO LEAD	13	VQCCN	SQUARE	UNSPECIFIED	YES	1					CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		QUAD		S-XQCC-N13		.65 mm	2.2 mm	Not Qualified				2.2 mm
HDMP-1002	Broadcom	TELECOM CIRCUIT	OTHER	FLAT	68	QFF	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	1	BIPOLAR	-5 V			FLATPACK			1.27 mm	85 Cel	0 Cel		QUAD		S-CQFP-F68		3.683 mm	24.13 mm	Not Qualified				24.13 mm
HSDL-7001#50	Broadcom	TELECOM CIRCUIT	OTHER	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE			1.27 mm	85 Cel	-20 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G16		1.75 mm	3.9 mm	Not Qualified	e4			9.9 mm
HDMP-2689	Broadcom	TELECOM CIRCUIT	OTHER	BALL	289	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		1.8 V	1.8,2.5	GRID ARRAY	BGA289,17X17,40	Other Telecom ICs	1 mm	85 Cel	0 Cel		BOTTOM		S-PBGA-B289		1.97 mm	19 mm	Not Qualified				19 mm
AFEM-S106-TR1G	Broadcom	TELECOM CIRCUIT	OTHER	BUTT	14	HBCC	SQUARE	UNSPECIFIED	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG				85 Cel	-30 Cel		BOTTOM		S-XBCC-B14	3		3.2 mm				260	3.2 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.