OTHER Other Function Telecom Interface ICs 989

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
MAX3971UGP-T	Maxim Integrated	TELECOM CIRCUIT	OTHER	NO LEAD	20	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR		3.3 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	0 Cel	TIN LEAD	QUAD		S-PQCC-N20		1 mm	4 mm	Not Qualified	e0			4 mm
MAX3971AUGP	Maxim Integrated	TELECOM CIRCUIT	OTHER	NO LEAD	20	VQCCN	SQUARE	UNSPECIFIED	YES	1	BIPOLAR	.085 mA	3.3 V	3.3	CHIP CARRIER, VERY THIN PROFILE	LCC20,.16SQ,20	ATM/SONET/SDH ICs	.5 mm	85 Cel	0 Cel	TIN LEAD	QUAD		S-XQCC-N20	1	1 mm	4 mm	Not Qualified	e0			4 mm
MAX3971AUTP+	Maxim Integrated	TELECOM CIRCUIT	OTHER	NO LEAD	20	VQCCN	SQUARE	UNSPECIFIED	YES	1	BIPOLAR	.085 mA	3.3 V	3.3	CHIP CARRIER, VERY THIN PROFILE	LCC20,.16SQ,20	ATM/SONET/SDH ICs	.5 mm	85 Cel	0 Cel	MATTE TIN	QUAD		S-XQCC-N20	1	.8 mm	4 mm	Not Qualified	e3	30	260	4 mm
MAX3971U/D	Maxim Integrated	TELECOM CIRCUIT	OTHER	NO LEAD	20	DIE	RECTANGULAR	UNSPECIFIED	YES	1	BIPOLAR		3.3 V		UNCASED CHIP				85 Cel	0 Cel	TIN LEAD	UPPER		R-XUUC-N20				Not Qualified	e0
MAX66100K-000AA+	Maxim Integrated	TELECOM CIRCUIT	OTHER	UNSPECIFIED			UNSPECIFIED	UNSPECIFIED	NO	1					SPECIAL SHAPE				50 Cel	-25 Cel		UNSPECIFIED		X-XXSS-X				Not Qualified		NOT SPECIFIED	NOT SPECIFIED
MAX3983UGK-D	Maxim Integrated	TELECOM CIRCUIT	OTHER	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BIPOLAR	.58 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.4SQ,20	Other Telecom ICs	.5 mm	85 Cel	0 Cel	TIN LEAD	QUAD		S-XQCC-N68	1	.9 mm	10 mm	Not Qualified	e0			10 mm
MAX3275U/D	Maxim Integrated	TELECOM CIRCUIT	OTHER	NO LEAD	9	DIE	RECTANGULAR	UNSPECIFIED	YES	1	BIPOLAR	.041 mA	3.3 V	3.3	UNCASED CHIP	DIE OR CHIP	Other Telecom ICs		85 Cel	0 Cel	TIN LEAD	UPPER		R-XUUC-N9				Not Qualified	e0
MAX2852ITK+T	Maxim Integrated	TELECOM CIRCUIT	OTHER	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS		2.85 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-25 Cel	MATTE TIN	QUAD		S-XQCC-N68	3	.8 mm	10 mm		e3	30	260	10 mm
MAX2852ITK+	Maxim Integrated	TELECOM CIRCUIT	OTHER	NO LEAD	68	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		2.85 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-25 Cel	MATTE TIN	QUAD		S-PQCC-N68	3	.8 mm	10 mm	Not Qualified	e3	30	260	10 mm
TA31133FN-TP1	Toshiba	TELECOM CIRCUIT	OTHER	GULL WING	16	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		2.6 mA	3.5 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-30 Cel		DUAL		R-PDSO-G16		1.6 mm	4.4 mm	Not Qualified				5 mm
TC35675XBG-001	Toshiba	TELECOM CIRCUIT	OTHER	BALL	52	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1			3 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-30 Cel		BOTTOM		S-PBGA-B52		1.2 mm	4.5 mm			NOT SPECIFIED	NOT SPECIFIED	4.5 mm
TA31133FN-TP2	Toshiba	TELECOM CIRCUIT	OTHER	GULL WING	16	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		2.6 mA	3.5 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-30 Cel		DUAL		R-PDSO-G16		1.6 mm	4.4 mm	Not Qualified				5 mm
TA31081F(ER)	Toshiba	TELECOM CIRCUIT	OTHER	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		6.2 mA	5 V		SMALL OUTLINE, SHRINK PITCH			1 mm	85 Cel	-35 Cel	TIN LEAD	DUAL		R-PDSO-G16		1.9 mm	4.6 mm	Not Qualified	e0			8.2 mm
JBT6N81SPI	Toshiba	TELECOM CIRCUIT	OTHER								CMOS					DIE OR CHIP	Other Telecom ICs		85 Cel	-20 Cel								Not Qualified
TA31133FN(EL)	Toshiba	TELECOM CIRCUIT	OTHER	GULL WING	16	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		2.6 mA	3.5 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-30 Cel		DUAL		R-PDSO-G16		1.6 mm	4.4 mm	Not Qualified				5 mm
TC35670FTG-006	Toshiba	TELECOM CIRCUIT	OTHER	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		QUAD		S-PQCC-N40		.9 mm	6 mm			NOT SPECIFIED	NOT SPECIFIED	6 mm
JBT6N81SZR	Toshiba	TELECOM CIRCUIT	OTHER								CMOS					DIE OR CHIP	Other Telecom ICs		85 Cel	-20 Cel								Not Qualified
TODX270A	Toshiba	TELECOM CIRCUIT	OTHER	UNSPECIFIED	10		RECTANGULAR	UNSPECIFIED	NO	1			5 V		FIBER OPTIC				70 Cel	-40 Cel		UNSPECIFIED		R-XXFO-X10				Not Qualified		NOT SPECIFIED	NOT SPECIFIED
TOTX170A	Toshiba	TELECOM CIRCUIT	OTHER	UNSPECIFIED	6		RECTANGULAR	UNSPECIFIED	NO	1			5 V		FIBER OPTIC				70 Cel	-40 Cel		UNSPECIFIED		R-XXFO-X6				Not Qualified		NOT SPECIFIED	NOT SPECIFIED
TA31081F-TP1	Toshiba	TELECOM CIRCUIT	OTHER	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		6.2 mA	5 V		SMALL OUTLINE, SHRINK PITCH			1 mm	85 Cel	-35 Cel		DUAL		R-PDSO-G16		1.9 mm	4.6 mm	Not Qualified				8.2 mm
TA8104F	Toshiba	TELECOM CIRCUIT	OTHER	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		1 mA	1.4 V		SMALL OUTLINE, SHRINK PITCH			1 mm	85 Cel	-35 Cel		DUAL		R-PDSO-G16		1.9 mm	4.6 mm	Not Qualified				8.2 mm
TA31133FN(ER)	Toshiba	TELECOM CIRCUIT	OTHER	GULL WING	16	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		2.6 mA	3.5 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-30 Cel		DUAL		R-PDSO-G16		1.6 mm	4.4 mm	Not Qualified				5 mm
TA8104F-TP1	Toshiba	TELECOM CIRCUIT	OTHER	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		1 mA	1.4 V		SMALL OUTLINE, SHRINK PITCH			1 mm	85 Cel	-35 Cel		DUAL		R-PDSO-G16		1.9 mm	4.6 mm	Not Qualified				8.2 mm
TA31133FN	Toshiba	TELECOM CIRCUIT	OTHER	GULL WING	16	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		2.6 mA	3.5 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-30 Cel	TIN LEAD	DUAL		R-PDSO-G16		1.6 mm	4.4 mm	Not Qualified	e0			5 mm
TA31135F-TP1	Toshiba	TELECOM CIRCUIT	OTHER	GULL WING	30	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE, SHRINK PITCH			1 mm	85 Cel	-30 Cel		DUAL		R-PDSO-G30		2.7 mm	7.5 mm	Not Qualified				15.4 mm
TA31081F-TP2	Toshiba	TELECOM CIRCUIT	OTHER	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		6.2 mA	5 V		SMALL OUTLINE, SHRINK PITCH			1 mm	85 Cel	-35 Cel		DUAL		R-PDSO-G16		1.9 mm	4.6 mm	Not Qualified				8.2 mm
TA31081F	Toshiba	TELECOM CIRCUIT	OTHER	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		6.2 mA	5 V		SMALL OUTLINE, SHRINK PITCH			1 mm	85 Cel	-35 Cel	TIN LEAD	DUAL		R-PDSO-G16		1.9 mm	4.6 mm	Not Qualified	e0			8.2 mm
TA7657P	Toshiba	TELECOM CIRCUIT	OTHER	THROUGH-HOLE	14	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		BIPOLAR			6/10	IN-LINE	DIP14,.3	Other Telecom ICs	2.54 mm	70 Cel	-25 Cel	Tin/Lead (Sn/Pb)	DUAL		R-PDIP-T14				Not Qualified	e0
TA31081F(EL)	Toshiba	TELECOM CIRCUIT	OTHER	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		6.2 mA	5 V		SMALL OUTLINE, SHRINK PITCH			1 mm	85 Cel	-35 Cel		DUAL		R-PDSO-G16		1.9 mm	4.6 mm	Not Qualified				8.2 mm
TA31135F	Toshiba	TELECOM CIRCUIT	OTHER	GULL WING	30	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE, SHRINK PITCH			1 mm	85 Cel	-30 Cel		DUAL		R-PDSO-G30		2.7 mm	7.5 mm	Not Qualified				15.4 mm
TA31081P	Toshiba	TELECOM CIRCUIT	OTHER	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1		6.2 mA	5 V		IN-LINE			2.54 mm	85 Cel	-35 Cel		DUAL		R-PDIP-T16		4.45 mm	7.62 mm	Not Qualified				19.25 mm
TB31296FT	Toshiba	TELECOM CIRCUIT	OTHER	BALL	48	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3.3 V	3.3	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA48,8X8,20	Other Telecom ICs	.5 mm	85 Cel	-35 Cel	TIN LEAD	BOTTOM		S-PBGA-B48		1.2 mm	5 mm	Not Qualified	e0			5 mm
TA31135F(EL)	Toshiba	TELECOM CIRCUIT	OTHER	GULL WING	30	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE, SHRINK PITCH			1 mm	85 Cel	-30 Cel		DUAL		R-PDSO-G30		2.7 mm	7.5 mm	Not Qualified				15.4 mm
TA8104F-TP2	Toshiba	TELECOM CIRCUIT	OTHER	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		1 mA	1.4 V		SMALL OUTLINE, SHRINK PITCH			1 mm	85 Cel	-35 Cel		DUAL		R-PDSO-G16		1.9 mm	4.6 mm	Not Qualified				8.2 mm
TA31135F(ER)	Toshiba	TELECOM CIRCUIT	OTHER	GULL WING	30	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE, SHRINK PITCH			1 mm	85 Cel	-30 Cel	TIN LEAD	DUAL		R-PDSO-G30		2.7 mm	7.5 mm	Not Qualified	e0			15.4 mm
TA7320P	Toshiba		OTHER		9			PLASTIC/EPOXY	NO		BIPOLAR					SIP9,.1	Other Telecom ICs	2.54 mm	70 Cel	-30 Cel	Tin/Lead (Sn/Pb)	SINGLE						Not Qualified	e0
TA31135F-TP2	Toshiba	TELECOM CIRCUIT	OTHER	GULL WING	30	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE, SHRINK PITCH			1 mm	85 Cel	-30 Cel		DUAL		R-PDSO-G30		2.7 mm	7.5 mm	Not Qualified				15.4 mm
TODX270	Toshiba	TELECOM CIRCUIT	OTHER	UNSPECIFIED	10		RECTANGULAR	UNSPECIFIED	NO	1			5 V		FIBER OPTIC				70 Cel	-40 Cel	TIN LEAD	UNSPECIFIED		R-XXFO-X10				Not Qualified	e0
HXT5104A-DNT	Renesas Electronics	TELECOM CIRCUIT	OTHER	NO LEAD		DIE	RECTANGULAR	UNSPECIFIED	YES	1					UNCASED CHIP	DIE OR CHIP			95 Cel	0 Cel	TIN	UPPER	14000 Mbps	R-XUUC-N					e3
UPC8220T5A-E1	Renesas Electronics	TELECOM CIRCUIT	OTHER	GULL WING	16	HVSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		3 V		SMALL OUTLINE			.4 mm	70 Cel	-30 Cel	TIN LEAD	DUAL		R-PDSO-G16		.6 mm	2.3 mm	Not Qualified	e0			3.3 mm
P9025AC-RNBGI	Renesas Electronics	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1			4.54 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	0 Cel	Matte Tin (Sn)	QUAD		S-XQCC-N32	1	.8 mm	5 mm		e3	NOT SPECIFIED	260	5 mm
P9027LP-RAWGI8	Renesas Electronics	TELECOM CIRCUIT	OTHER	BALL	40	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM		R-PBGA-B40	1	.65 mm	2.24 mm		e1		260	3.62 mm
P9020-AHGI8	Renesas Electronics	TELECOM CIRCUIT	OTHER	BALL	99	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	0 Cel		BOTTOM		R-PBGA-B99		.65 mm	4.65 mm					4.86 mm
MX0141VA0AVG	Renesas Electronics	TELECOM CIRCUIT	OTHER	BALL	98	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			2.5 V		GRID ARRAY				85 Cel	0 Cel	TIN	BOTTOM		R-PBGA-B98	3				e3		260
ISL36411DRZ-TS	Renesas Electronics	TELECOM CIRCUIT	OTHER	NO LEAD	46	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.2 V	1.2	CHIP CARRIER	LCC46,.16X.28,16	Other Telecom ICs	.4 mm	85 Cel	0 Cel	MATTE TIN	QUAD		R-PQCC-N46	1	.75 mm	4 mm	Not Qualified	e3	30	260	7 mm
P9020-NTGI	Renesas Electronics	TELECOM CIRCUIT	OTHER	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	0 Cel		QUAD		S-XQCC-N56		.8 mm	7 mm					7 mm
UPC8215TU-E2	Renesas Electronics	TELECOM CIRCUIT	OTHER	NO LEAD	8	VSON	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR		3 V		SMALL OUTLINE, VERY THIN PROFILE			.5 mm	85 Cel	-25 Cel		DUAL		S-PDSO-N8		.53 mm	2 mm					2 mm
HXR6101-DNT	Renesas Electronics	TELECOM CIRCUIT	OTHER	NO LEAD		DIE	SQUARE	UNSPECIFIED	YES	1			3.3 V		UNCASED CHIP				85 Cel	0 Cel	TIN	UPPER		S-XUUC-N	1				e3

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.