OTHER Other Function Telecom Interface ICs 989

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

S0280

Infineon Technologies

OTHER

THROUGH-HOLE

16

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

BIPOLAR

35 mA

14 V

14

IN-LINE

DIP16,.3

Other Telecom ICs

2.54 mm

85 Cel

-20 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDIP-T16

Not Qualified

e0

BGA711N7

Infineon Technologies

TELECOM CIRCUIT

OTHER

NO LEAD

6

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

2.8 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-30 Cel

DUAL

R-PDSO-N6

1

.4 mm

1.3 mm

2 mm

PMB2200T-16

Infineon Technologies

OTHER

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

48 mA

5 V

5

SMALL OUTLINE

SOP16,.4

Other Telecom ICs

1.27 mm

70 Cel

-25 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDSO-G16

Not Qualified

e0

PMB27201

Infineon Technologies

TELECOM CIRCUIT

OTHER

GULL WING

128

SQUARE

PLASTIC/EPOXY

YES

1

5 V

FLATPACK

85 Cel

-30 Cel

QUAD

S-PQFP-G128

Not Qualified

PMB2705-F

Infineon Technologies

TELECOM CIRCUIT

OTHER

GULL WING

176

QFP

SQUARE

PLASTIC/EPOXY

YES

1

5 V

FLATPACK

85 Cel

-25 Cel

QUAD

S-PQFP-G176

Not Qualified

PMB2247-F

Infineon Technologies

TELECOM CIRCUIT

OTHER

GULL WING

48

QFP

SQUARE

PLASTIC/EPOXY

YES

1

5 V

FLATPACK

85 Cel

-30 Cel

QUAD

S-PQFP-G48

Not Qualified

BGA751N7

Infineon Technologies

TELECOM CIRCUIT

OTHER

NO LEAD

6

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

2.8 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-30 Cel

DUAL

R-PDSO-N6

1

.4 mm

1.3 mm

2 mm

PMB2407-F

Infineon Technologies

TELECOM CIRCUIT

OTHER

GULL WING

48

QFP

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

FLATPACK

85 Cel

-30 Cel

QUAD

S-PQFP-G48

Not Qualified

PMB2207

Infineon Technologies

OTHER

GULL WING

24

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

BIPOLAR

2.7/4.5

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP24,.25

Other Telecom ICs

.635 mm

85 Cel

-30 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDSO-G24

Not Qualified

e0

BGSF110GN26

Infineon Technologies

TELECOM CIRCUIT

OTHER

NO LEAD

26

HVQCCN

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.4 mm

85 Cel

-30 Cel

QUAD

R-PQCC-N26

1

.77 mm

2.6 mm

3.4 mm

BGSF18DM20E6727XUMA1

Infineon Technologies

TELECOM CIRCUIT

OTHER

BUTT

20

HLGA

RECTANGULAR

UNSPECIFIED

YES

1

CMOS

3.5 V

GRID ARRAY, HEAT SINK/SLUG

.4 mm

85 Cel

-30 Cel

BOTTOM

R-XBGA-B20

3

.98 mm

2.8 mm

3.2 mm

PSB4501-P

Infineon Technologies

OTHER

THROUGH-HOLE

20

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

BIPOLAR

140 mA

1.6/7.5

IN-LINE

DIP20,.3

Other Telecom ICs

2.54 mm

70 Cel

-25 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDIP-T20

Not Qualified

e0

NWX1900P

Infineon Technologies

TELECOM CIRCUIT

OTHER

NO LEAD

3

QCCN

SQUARE

PLASTIC/EPOXY

YES

1

CHIP CARRIER

85 Cel

-30 Cel

QUAD

S-PQCC-N3

1.22 mm

3.8 mm

Not Qualified

3.8 mm

PMB2205T(V1.1)

Infineon Technologies

OTHER

GULL WING

20

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

33 mA

5 V

5

SMALL OUTLINE

SOP20,.4

Other Telecom ICs

1.27 mm

85 Cel

-25 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDSO-G20

Not Qualified

e0

PMB27202

Infineon Technologies

TELECOM CIRCUIT

OTHER

GULL WING

128

QFP

SQUARE

PLASTIC/EPOXY

YES

1

5 V

FLATPACK

85 Cel

-30 Cel

QUAD

S-PQFP-G128

Not Qualified

PMB2205T(V1.2)

Infineon Technologies

OTHER

GULL WING

20

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

33 mA

5 V

5

SMALL OUTLINE

SOP20,.4

Other Telecom ICs

1.27 mm

85 Cel

-25 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDSO-G20

Not Qualified

e0

BGA735N16

Infineon Technologies

TELECOM CIRCUIT

OTHER

NO LEAD

16

VQCCN

SQUARE

UNSPECIFIED

YES

1

2.8 V

CHIP CARRIER, VERY THIN PROFILE

.5 mm

85 Cel

-30 Cel

QUAD

S-XQCC-N16

1

.4 mm

2.3 mm

Not Qualified

2.3 mm

PMB2205S(V1.2)

Infineon Technologies

OTHER

GULL WING

20

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

33 mA

5 V

5

SMALL OUTLINE, SHRINK PITCH

SSOP20,.3

Other Telecom ICs

.635 mm

85 Cel

-25 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDSO-G20

Not Qualified

e0

PSB4500-T

Infineon Technologies

OTHER

GULL WING

20

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

BIPOLAR

140 mA

1.6/7.5

SMALL OUTLINE

SOP20,.4

Other Telecom ICs

1.27 mm

70 Cel

-25 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDSO-G20

Not Qualified

e0

BGA735N16E6327XTSA1

Infineon Technologies

TELECOM CIRCUIT

OTHER

NO LEAD

16

HVQCCN

SQUARE

UNSPECIFIED

YES

1

2.8 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-30 Cel

TIN

QUAD

S-XQCC-N16

1

.4 mm

2.3 mm

e3

2.3 mm

PMB2402-S

Infineon Technologies

OTHER

GULL WING

28

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

BIPOLAR

.03 mA

5 V

5

SMALL OUTLINE, SHRINK PITCH

SSOP28,.3

Other Telecom ICs

.635 mm

85 Cel

-25 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDSO-G28

Not Qualified

e0

PMB2401T

Infineon Technologies

OTHER

GULL WING

28

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

BIPOLAR

.03 mA

5 V

5

SMALL OUTLINE

SOP28,.4

Other Telecom ICs

1.27 mm

85 Cel

-25 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDSO-G28

Not Qualified

e0

PMB2400

Infineon Technologies

OTHER

GULL WING

24

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

BIPOLAR

33 mA

5 V

5

SMALL OUTLINE

SOP24,.3

Other Telecom ICs

1.27 mm

85 Cel

-25 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDSO-G24

Not Qualified

e0

BGM704N7

Infineon Technologies

TELECOM CIRCUIT

OTHER

NO LEAD

7

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-30 Cel

DUAL

R-PDSO-N7

.4 mm

1.3 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

2 mm

PMB2900-H

Infineon Technologies

TELECOM CIRCUIT

OTHER

GULL WING

64

QFP

SQUARE

PLASTIC/EPOXY

YES

1

5 V

FLATPACK

85 Cel

-25 Cel

QUAD

S-PQFP-G64

Not Qualified

PSB4501-T

Infineon Technologies

OTHER

GULL WING

20

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

BIPOLAR

140 mA

1.6/7.5

SMALL OUTLINE

SOP20,.4

Other Telecom ICs

1.27 mm

70 Cel

-25 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDSO-G20

Not Qualified

e0

PSB4500-P

Infineon Technologies

OTHER

THROUGH-HOLE

20

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

BIPOLAR

140 mA

1.6/7.5

IN-LINE

DIP20,.3

Other Telecom ICs

2.54 mm

70 Cel

-25 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDIP-T20

Not Qualified

e0

PMB2240V1.6

Infineon Technologies

OTHER

GULL WING

48

QFP

SQUARE

PLASTIC/EPOXY

YES

BIPOLAR

29 mA

2.7/4.5

FLATPACK

TQFP48,.35SQ

Other Telecom ICs

.5 mm

85 Cel

-30 Cel

Tin/Lead (Sn/Pb)

QUAD

S-PQFP-G48

Not Qualified

e0

IRMS5000

Infineon Technologies

TELECOM CIRCUIT

OTHER

NO LEAD

6

RECTANGULAR

UNSPECIFIED

NO

1

BICMOS

5 V

MICROELECTRONIC ASSEMBLY

85 Cel

-25 Cel

SINGLE

R-XSMA-N6

Not Qualified

PMB2205S(V1.1)

Infineon Technologies

OTHER

GULL WING

20

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

33 mA

5 V

5

SMALL OUTLINE, SHRINK PITCH

SSOP20,.3

Other Telecom ICs

.635 mm

85 Cel

-25 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDSO-G20

Not Qualified

e0

BGAU1A10E6327XTSA1

Infineon Technologies

TELECOM CIRCUIT

OTHER

BUTT

10

BCC

RECTANGULAR

UNSPECIFIED

YES

1

1.8 V

CHIP CARRIER

.4 mm

85 Cel

-30 Cel

BOTTOM

R-XBCC-B10

1

.65 mm

1.1 mm

1.5 mm

PMB2205

Infineon Technologies

OTHER

GULL WING

20

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

.048 mA

5 V

5

SMALL OUTLINE

SOP20,.4

Other Telecom ICs

1.27 mm

85 Cel

-25 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDSO-G20

Not Qualified

e0

IRMT6409

Infineon Technologies

TELECOM CIRCUIT

OTHER

UNSPECIFIED

8

RECTANGULAR

UNSPECIFIED

NO

1

BICMOS

3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-25 Cel

SINGLE

R-XSMA-X8

Not Qualified

PMB2200-T

Infineon Technologies

TELECOM CIRCUIT

OTHER

GULL WING

20

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

.048 mA

5 V

5

SMALL OUTLINE

SOP20,.4

Other Telecom ICs

1.27 mm

85 Cel

-25 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDSO-G20

2.65 mm

7.6 mm

Not Qualified

e0

12.8 mm

PMB2200-S

Infineon Technologies

TELECOM CIRCUIT

OTHER

GULL WING

24

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

.048 mA

5 V

5

SMALL OUTLINE

SSOP20(UNSPEC)

Other Telecom ICs

85 Cel

-25 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDSO-G24

Not Qualified

e0

BGA771N16

Infineon Technologies

TELECOM CIRCUIT

OTHER

NO LEAD

16

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

2.8 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-30 Cel

QUAD

S-PQCC-N16

.625 mm

2.3 mm

NOT SPECIFIED

NOT SPECIFIED

2.3 mm

BCM20715A1KUBXG

Infineon Technologies

TELECOM CIRCUIT

OTHER

BALL

42

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

1.22 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-30 Cel

BOTTOM

R-PBGA-B42

.6 mm

2.509 mm

3.019 mm

BCM4330XKFFBG

Infineon Technologies

TELECOM CIRCUIT

OTHER

BALL

144

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

1.2 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-30 Cel

BOTTOM

S-PBGA-B144

1 mm

6.5 mm

6.5 mm

BCM43241FKFFBG

Infineon Technologies

TELECOM CIRCUIT

OTHER

BALL

208

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

1.2 V

GRID ARRAY, THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-30 Cel

BOTTOM

R-PBGA-B208

1.05 mm

7 mm

9 mm

BCM43455HKUBG

Infineon Technologies

TELECOM CIRCUIT

OTHER

BALL

140

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

1.2 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-30 Cel

BOTTOM

R-PBGA-B140

.6 mm

4.47 mm

5.27 mm

BCM43241XKFFBG

Infineon Technologies

TELECOM CIRCUIT

OTHER

BALL

208

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

1.2 V

GRID ARRAY, THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-30 Cel

BOTTOM

R-PBGA-B208

1.05 mm

7 mm

9 mm

BCM4334XKUBG

Infineon Technologies

TELECOM CIRCUIT

OTHER

BALL

109

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

1.2 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-30 Cel

BOTTOM

R-PBGA-B109

.55 mm

4.08 mm

4.48 mm

BCM4329GKUBG

Infineon Technologies

TELECOM CIRCUIT

OTHER

BALL

182

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

2.7 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-30 Cel

BOTTOM

R-PBGA-B182

.55 mm

5.62 mm

6.57 mm

BCM4334WKUBG

Infineon Technologies

TELECOM CIRCUIT

OTHER

BALL

109

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

1.2 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-30 Cel

BOTTOM

R-PBGA-B109

.55 mm

4.08 mm

4.48 mm

BCM43241DKFFBG

Infineon Technologies

TELECOM CIRCUIT

OTHER

BALL

208

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

1.2 V

GRID ARRAY, THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-30 Cel

BOTTOM

R-PBGA-B208

1.05 mm

7 mm

9 mm

BCM4354XKWBG

Infineon Technologies

TELECOM CIRCUIT

OTHER

BALL

395

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

1.2 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

85 Cel

-30 Cel

BOTTOM

R-PBGA-B395

.33 mm

4.87 mm

7.67 mm

BCM43438KUBG

Infineon Technologies

TELECOM CIRCUIT

OTHER

BALL

63

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

1.2 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

70 Cel

-30 Cel

BOTTOM

R-PBGA-B63

.55 mm

2.87 mm

4.87 mm

BCM4330GKWBG

Infineon Technologies

TELECOM CIRCUIT

OTHER

BALL

225

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

1.2 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

85 Cel

-30 Cel

BOTTOM

R-PBGA-B225

.41 mm

4.89 mm

5.33 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.